SE0302437D0 - Film actuator based RF MEMS switching circuits - Google Patents

Film actuator based RF MEMS switching circuits

Info

Publication number
SE0302437D0
SE0302437D0 SE0302437A SE0302437A SE0302437D0 SE 0302437 D0 SE0302437 D0 SE 0302437D0 SE 0302437 A SE0302437 A SE 0302437A SE 0302437 A SE0302437 A SE 0302437A SE 0302437 D0 SE0302437 D0 SE 0302437D0
Authority
SE
Sweden
Prior art keywords
membrane
contact
applications
electrode layer
signal line
Prior art date
Application number
SE0302437A
Other languages
English (en)
Swedish (sv)
Inventor
Joachim Oberhammer
Goeran Stemme
Original Assignee
Joachim Oberhammer
Goeran Stemme
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Joachim Oberhammer, Goeran Stemme filed Critical Joachim Oberhammer
Priority to SE0302437A priority Critical patent/SE0302437D0/xx
Publication of SE0302437D0 publication Critical patent/SE0302437D0/xx
Priority to PCT/IB2004/051732 priority patent/WO2005023699A1/fr
Priority to EP04769980A priority patent/EP1663849A1/fr
Priority to CNA2004800329494A priority patent/CN1910109A/zh
Priority to US10/570,681 priority patent/US20070256917A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
    • H01G5/16—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes
    • H01G5/18—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes due to change in inclination, e.g. by flexing, by spiral wrapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
    • H01G5/40—Structural combinations of variable capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H01H2059/0045—Electrostatic relays; Electro-adhesion relays making use of micromechanics with s-shaped movable electrode, positioned and connected between two driving fixed electrodes, e.g. movable electrodes moving laterally when driving voltage being applied
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H01H2059/0072—Electrostatic relays; Electro-adhesion relays making use of micromechanics with stoppers or protrusions for maintaining a gap, reducing the contact area or for preventing stiction between the movable and the fixed electrode in the attracted position
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49105—Switch making

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Telephone Set Structure (AREA)
SE0302437A 2003-09-09 2003-09-09 Film actuator based RF MEMS switching circuits SE0302437D0 (sv)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SE0302437A SE0302437D0 (sv) 2003-09-09 2003-09-09 Film actuator based RF MEMS switching circuits
PCT/IB2004/051732 WO2005023699A1 (fr) 2003-09-09 2004-09-09 Dispositif de commutation a systemes microelectromecaniques pilotes par un actionneur a film, et procede correspondant
EP04769980A EP1663849A1 (fr) 2003-09-09 2004-09-09 Dispositif de commutation a systemes microelectromecaniques pilotes par un actionneur a film, et procede correspondant
CNA2004800329494A CN1910109A (zh) 2003-09-09 2004-09-09 基于微机电系统装置的薄膜致动器及其方法
US10/570,681 US20070256917A1 (en) 2003-09-09 2004-09-09 Film Actuator Based Mems Device and Method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0302437A SE0302437D0 (sv) 2003-09-09 2003-09-09 Film actuator based RF MEMS switching circuits

Publications (1)

Publication Number Publication Date
SE0302437D0 true SE0302437D0 (sv) 2003-09-09

Family

ID=28787317

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0302437A SE0302437D0 (sv) 2003-09-09 2003-09-09 Film actuator based RF MEMS switching circuits

Country Status (5)

Country Link
US (1) US20070256917A1 (fr)
EP (1) EP1663849A1 (fr)
CN (1) CN1910109A (fr)
SE (1) SE0302437D0 (fr)
WO (1) WO2005023699A1 (fr)

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WO2004114345A2 (fr) * 2003-06-26 2004-12-29 Koninklijke Philips Electronics N.V. Dispositif microelectromecanique, module et leur procede de fabrication
US7960804B1 (en) 2004-05-24 2011-06-14 The United States of America as respresented by the Secretary of the Air Force Latching zip-mode actuated mono wafer MEMS switch
US7977137B1 (en) 2004-05-24 2011-07-12 The United States Of America As Represented By The Secretary Of The Air Force Latching zip-mode actuated mono wafer MEMS switch method
EP1886333A1 (fr) * 2005-05-12 2008-02-13 NHC Communications, Inc. Systeme de matrice a connexion transversale de commutateur rotatif
US7321275B2 (en) * 2005-06-23 2008-01-22 Intel Corporation Ultra-low voltage capable zipper switch
US7355258B2 (en) * 2005-08-02 2008-04-08 President And Fellows Of Harvard College Method and apparatus for bending electrostatic switch
US7528691B2 (en) * 2005-08-26 2009-05-05 Innovative Micro Technology Dual substrate electrostatic MEMS switch with hermetic seal and method of manufacture
ES2259570B1 (es) * 2005-11-25 2007-10-01 Baolab Microsystems S.L. Dispositivo para la conexion de dos puntos de un circuito electrico.
WO2007059634A1 (fr) * 2005-11-28 2007-05-31 Abb Research Ltd Actionneur electrostatique
JP2007157511A (ja) * 2005-12-06 2007-06-21 Hitachi Ltd マイクロエレクトロメカニカルシステムを用いたスイッチ
US7602261B2 (en) 2005-12-22 2009-10-13 Intel Corporation Micro-electromechanical system (MEMS) switch
US7554421B2 (en) 2006-05-16 2009-06-30 Intel Corporation Micro-electromechanical system (MEMS) trampoline switch/varactor
US7605675B2 (en) 2006-06-20 2009-10-20 Intel Corporation Electromechanical switch with partially rigidified electrode
DE102006046206B4 (de) * 2006-09-29 2009-06-25 Siemens Ag Verbindungseinrichtung zur wahlfreien Verbindung einer Anzahl an Sendern und Empfängern, Kommunikationseinrichtung und Verfahren zum Herstellen einer Verbindungseinrichtung
US8384500B2 (en) * 2007-12-13 2013-02-26 Broadcom Corporation Method and system for MEMS switches fabricated in an integrated circuit package
US8039938B2 (en) * 2009-05-22 2011-10-18 Palo Alto Research Center Incorporated Airgap micro-spring interconnect with bonded underfill seal
JP5589515B2 (ja) * 2010-04-05 2014-09-17 セイコーエプソン株式会社 傾斜構造体の製造方法
US9641174B2 (en) * 2011-04-11 2017-05-02 The Regents Of The University Of California Use of micro-structured plate for controlling capacitance of mechanical capacitor switches
WO2012164725A1 (fr) * 2011-06-02 2012-12-06 富士通株式会社 Dispositif électronique et son procédé de production, et procédé de commande du dispositif électronique
WO2012177954A2 (fr) * 2011-06-21 2012-12-27 Board Of Regents Of The University Of Texas System Actionneurs bimétalliques
US9708177B2 (en) * 2011-09-02 2017-07-18 Cavendish Kinetics, Inc. MEMS device anchoring
US9330874B2 (en) 2014-08-11 2016-05-03 Innovative Micro Technology Solder bump sealing method and device
CN105161436B (zh) * 2015-09-11 2018-05-22 柯全 倒装芯片的封装方法
US20170301475A1 (en) * 2016-04-15 2017-10-19 Kymeta Corporation Rf resonators with tunable capacitor and methods for fabricating the same
US10807857B2 (en) * 2016-09-12 2020-10-20 Mems Drive, Inc. MEMS actuation systems and methods
US11049658B2 (en) * 2016-12-22 2021-06-29 Kymeta Corporation Storage capacitor for use in an antenna aperture
CN109375096B (zh) * 2018-09-04 2021-06-29 东南大学 一种基于柔性基板弯曲条件下的rf mems静电驱动开关微波特性分析方法
CN111434605B (zh) * 2019-01-15 2023-08-29 台湾积体电路制造股份有限公司 微机电系统装置的控制方法及测试方法
CN115235681B (zh) * 2022-09-21 2022-12-20 无锡芯感智半导体有限公司 Mems压力传感器的封装结构及方法
US11953392B1 (en) 2022-09-21 2024-04-09 Wuxi Sencoch Semiconductor Co., Ltd. Packaging structure and method of MEMS pressure sensor

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US4474212A (en) * 1981-05-11 1984-10-02 Harper-Wyman Company Proportional flow control valve
DE69213340T2 (de) * 1991-05-30 1997-03-27 Hitachi Ltd Ventil und seine Verwendung in einer Vorrichtung hergestellt aus Halbleitermaterial
US20020096421A1 (en) * 2000-11-29 2002-07-25 Cohn Michael B. MEMS device with integral packaging
KR100738064B1 (ko) * 2001-02-27 2007-07-12 삼성전자주식회사 비선형적 복원력의 스프링을 가지는 ｍｅｍｓ 소자
US6621135B1 (en) * 2002-09-24 2003-09-16 Maxim Integrated Products, Inc. Microrelays and microrelay fabrication and operating methods
US7283024B2 (en) * 2003-12-18 2007-10-16 Intel Corporation MEMS switch stopper bumps with adjustable height
US7362199B2 (en) * 2004-03-31 2008-04-22 Intel Corporation Collapsible contact switch

Also Published As

Publication number Publication date
US20070256917A1 (en) 2007-11-08
EP1663849A1 (fr) 2006-06-07
CN1910109A (zh) 2007-02-07
WO2005023699A1 (fr) 2005-03-17

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