RU96105975A - Припой, содержащий чешуйчатый наполнитель - Google Patents
Припой, содержащий чешуйчатый наполнительInfo
- Publication number
- RU96105975A RU96105975A RU96105975/02A RU96105975A RU96105975A RU 96105975 A RU96105975 A RU 96105975A RU 96105975/02 A RU96105975/02 A RU 96105975/02A RU 96105975 A RU96105975 A RU 96105975A RU 96105975 A RU96105975 A RU 96105975A
- Authority
- RU
- Russia
- Prior art keywords
- solder containing
- scale filler
- filler
- scale
- tin
- Prior art date
Links
- 239000000945 filler Substances 0.000 title claims 2
- 229910000679 solder Inorganic materials 0.000 title claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- 210000001503 Joints Anatomy 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- 238000005219 brazing Methods 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Claims (1)
- Композиционный припой для низкотемпературной пайки, содержащий олово, свинец, висмут, отличающийся тем, что с целью повышения прочности паяного соединения и обеспечения пайки вертикальных швов, он дополнительно содержит наполнитель в виде тонких плоских чешуек из белой жести.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU96105975A RU2100164C1 (ru) | 1996-03-27 | 1996-03-27 | Композиционный припой для низкотемпературной пайки |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU96105975A RU2100164C1 (ru) | 1996-03-27 | 1996-03-27 | Композиционный припой для низкотемпературной пайки |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| RU2100164C1 RU2100164C1 (ru) | 1997-12-27 |
| RU96105975A true RU96105975A (ru) | 1998-04-10 |
Family
ID=20178590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU96105975A RU2100164C1 (ru) | 1996-03-27 | 1996-03-27 | Композиционный припой для низкотемпературной пайки |
Country Status (1)
| Country | Link |
|---|---|
| RU (1) | RU2100164C1 (ru) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8991680B1 (en) * | 2005-05-25 | 2015-03-31 | Alfred E. Mann Foundation For Scientific Research | Method of manufacture of an electrode array |
| DE102017004626A1 (de) * | 2017-05-15 | 2018-11-15 | Pfarr Stanztechnik Gmbh | Bleifreie Lötfolie zum Diffusionslöten |
-
1996
- 1996-03-27 RU RU96105975A patent/RU2100164C1/ru not_active IP Right Cessation
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