RU76767U1 - RADIATOR FOR ELECTRONIC COMPONENTS (OPTIONS) - Google Patents

Abstract

The radiator for electronic components contains many separate radiator plates (1) having at least two parallel edges (2), (3). Near the edges (2), (3), the plates (1) are fastened through heat-conducting gaskets (6), (7) to each other, forming respectively heat-absorbing parts (8), (10) in contact with the heat-generating surfaces of the electronic components, and heat distribution parts (9), (11), opposite to the corresponding heat-absorbing parts (8), (10). In one embodiment of the radiator, the distal ends (12), (13) of the heat-conducting gaskets (6), (7) lie in planes passing through the opposite edges (4), (5) of the radiator plates. In the second version of the radiator, the distal sections (14) of the radiator plates (1) protrude beyond the distal ends (12, 13) of the heat-conducting gaskets (6), (7). 2 n.p., 20 s.p., 23 ill.

Description

The invention relates to devices for removing heat from electronic components.

Known thermal plate radiator (see US patent No. 6554060, IPC F28F 7/00, published 04/29/2003) containing a base in the form of a metal plate, on one side of which parallel slots are made in which the radiator plates are fixed. Radiator plates are formed into groups made of metals with different thermal conductivity.

The known radiator allows the use of radiator plates of cheaper metal in areas of less intense heat generation, however, requires sophisticated manufacturing technology.

Known thermal plate radiator (see US patent No. 6698500, IPC F28F 7/00, published March 2, 2004) containing a base in the form of a metal plate with parallel ribs on two opposite sides. Between the opposing inner ribs in the plate, parallel slots are made in which radiator plates of metal are fixed, the thermal conductivity of which is different from the thermal conductivity of the metal of the plate and the ribs.

Known radiator provides more intense heat dissipation by the central part of the radiator. A disadvantage of the known radiator is a rather complicated and laborious technology for its manufacture.

The closest in technical essence and the totality of essential features to the claimed technical solution is the radiator adopted for the prototype for the electronic component (see patent RU No. 2217886, IPC Н05К 7/20, published November 27, 2003), containing many separate radiator plates bonded to each other another in their connecting part with the formation of a heat-absorbing part in contact with the heat-generating surface of the electronic component. Parts of the radiator plates opposite the heat-absorbing part are separated from each other and together form heat-removing parts. A plurality of radiator plates are fastened together by fixing means. Between the radiator plates there are many spacers, each of which is located between the connecting parts of adjacent radiator plates to provide a gap between the heat sink parts of the radiator plates.

The known radiator allows you to collect from the same elements of the device different heat dissipation capacity, however, it has insufficient heat transfer efficiency associated with different heat dissipation of the radiator plates located in the heat-absorbing part, directly above the heat-generating element, and at a distance from it; as well as high aerodynamic resistance to air flow at the inlet and outlet of the radiator. In addition, over each heat-generating electronic component, it is necessary to install separate known prototype radiators, which complicates the installation and increases the complexity of manufacturing electronic devices and apparatuses.

The task that the claimed technical solution solves is the development of such a radiator in which the opposite heat-absorbing part of the surface of the radiator plates would be more efficiently used, as well as heat removed from several electronic components simultaneously.

The problem is solved by a group of utility models, united by a single inventive concept.

According to the first option, the problem is solved in that the radiator for electronic components contains many separate rectangular radiator plates fastened near the first two opposite edges through heat-conducting gaskets to each other, while the distal ends of the heat-conducting gaskets lie in planes passing through the second opposite edges of the radiator plates. The ends of the radiator plates bonded through heat-conducting gaskets form at least two heat-absorbing parts in contact with the heat-generating surfaces of the electronic components, and at least two heat-distributing parts opposite to the corresponding heat-absorbing parts.

In the first embodiment of the inventive radiator, at least two heat-absorbing parts and at least two heat-distributing parts can be formed by heat-conducting gaskets and the whole set of radiator plates, and at least one heat-absorbing part and at least one heat-distributing part can be formed by heat-conducting gaskets and part from many radiator plates.

Radiator plates and gaskets can, for example, be bonded to each other, for example, solder or heat-conducting adhesive.

Radiator plates can be assembled in at least two groups made of metals with different thermal conductivity, for example, at least one group of radiator plates can be made of copper, and at least another group of radiator plates can be made of aluminum.

Radiator plates can be assembled in at least two groups made of materials having different thicknesses.

The combination of the sections of the radiator plates in two or more heat-absorbing parts located above the sources of intense heat and in two or more heat-distributing parts opposite the heat-absorbing parts allows you to combine the radiator plates (which are directly involved in forced convective heat transfer) into a single heat circuit. The presence of heat-absorbing and heat-distributing parts only under the heat-generating elements allows to reduce the mass and cost of the radiator as much as possible. Radio-electronic elements requiring forced cooling are located on the printed unit according to the electrical circuit diagram and can be located at a sufficiently large distance from each other. Therefore, the manufacture of the radiator base in known structures that repeat the dimensions of the printing unit, leads to unjustified consumption of metal. If the length of the radiator plates is determined by the size of the printing unit in order to ensure heat removal from each heat-generating element, then in the claimed utility model, the functional parts (heat-conducting gaskets) are sufficient to be located only directly under the heat-generating elements. The assembly technology of the claimed utility model with several heat-absorbing and heat-distributing parts reproduces the basic principle: providing in a given place, in a given volume, the specified (in this case, thermophysical) properties of the product. And if the material of the radiator plates selected for a particular radiator cannot be changed, then, alternating or changing the position and number of heat-conducting gaskets, it is possible to take into account not only the location and geometric dimensions of the fuel element, but the power of its heat release. The greatest efficiency of the thermal circuit (and, consequently, heat transfer of the radiator) is achieved using a combination of materials with different thermal conductivities, from

which made radiator plates and heat-conducting gaskets. For example, copper radiator plates mounted directly under the heat-generating element on the opposite side of it, in combination with copper heat-conducting gaskets, are, as it were, a second heat source, from which thermal energy is distributed on both sides by heat transfer. Thus, on the opposite side from the heat-absorbing part of the radiator, redistribution of thermal energy from warmer radiator plates to less heated occurs. And if it is already impossible to change the material of the radiator plates in a specific radiator, then by a combination of various gasket materials in the heat distribution part, various specified tactical and technical characteristics (Heat transfer efficiency or thermal resistance, mass, cost) of the radiator can be achieved.

According to the second embodiment, the problem is solved in that the radiator for electronic components contains many separate radiator plates having at least two parallel edges and fastened near these edges through heat-conducting gaskets to each other. In this case, the distal sections of the radiator plates protrude beyond the distal ends of the heat-conducting gaskets. The ends of the radiator plates fastened through heat-conducting gaskets form respectively two or more heat-absorbing parts in contact with the heat-generating surfaces of the electronic components, and two or more heat-distributing parts opposite to the corresponding heat-absorbing parts. The second embodiment of the radiator is preferred when it is forced laterally by a fan.

In the second embodiment of the inventive radiator, at least two heat-absorbing parts and at least two heat-distributing parts can be formed by heat-conducting gaskets and the whole set of radiator plates, and at least one heat-absorbing part and at least one heat-distributing part can be formed by heat-conducting gaskets and part from many radiator plates.

Radiator plates can protrude on one side beyond the ends of the heat-conducting gaskets towards the air flow generated by the fan.

Radiator plates can protrude both symmetrically on both sides of the ends of the heat-conducting gaskets, and asymmetrically on both sides of the ends of the heat-conducting gaskets.

The sections of the radiator plates protruding beyond the ends of the heat-conducting gaskets may have rounded edges or pointed edges to reduce resistance to the incoming air flow.

The heat-conducting gaskets in the second version of the radiator can be fastened to rectangular opposing protrusions of the radiator plates, while the heat-conducting gaskets are flush with the outer edges of the rectangular opposing protrusions, and the thickness of the heat-conducting gaskets is at least a portion of their length greater than the height of the said rectangular protrusions.

Radiator plates with sections protruding beyond the ends of the heat-conducting gaskets can be formed in at least two groups made of metals with different thermal conductivities.

At least one group of radiator plates can be made of copper, and at least one group of radiator plates can be made of aluminum.

Radiator plates in the second embodiment of the radiator can be formed in at least two groups made of radiator plates of different thicknesses.

Thermally conductive gaskets in the second version of the radiator can be made of metals with different thermal conductivity.

The radiator plates and gaskets in the second embodiment of the radiator can, for example, be fastened to each other with solder or heat-conducting adhesive.

The inventive utility model is illustrated by drawings, where:

figure 1 shows a front view of the first embodiment of the inventive radiator;

figure 2 shows a side view of the first embodiment of the radiator shown in figure 1;

figure 3 shows a top view in section along aa on the first embodiment of the radiator shown in figure 2;

figure 4 shows a top view of the first embodiment of the inventive radiator with plates of different thicknesses;

figure 5 shows a front view of a second embodiment of the inventive radiator with one of the options for radiator plates;

figure 6 shows a side view of a second variant of the radiator;

in Fig.7 shows a top view in section along BB on the second embodiment of the radiator shown in Fig.6;

on Fig shows a front view of a second embodiment of a radiator with a second embodiment of radiator plates;

in Fig.9 shows a side view of a second variant of the radiator shown in Fig.8;

figure 10 shows a top view in section along B-B on the second variant of the radiator shown in figure 9;

11 shows a front view of a second embodiment of the inventive radiator with a third embodiment of radiator plates;

in Fig.12 shows a side view of a second variant of the radiator shown in Fig.11;

on Fig shows a top view in section along G-G on the second variant of the radiator shown in Fig;

on Fig depicts a front view of a second embodiment of the inventive radiator with a fourth version of the radiator plates;

on Fig shows a side view of a second variant of the radiator shown in Fig;

on Fig shows a top view in section along DD on the second variant of the radiator shown in Fig;

on Fig shows a front view of a second variant of the inventive radiator with a fifth variant of the radiator plates;

on Fig shows a side view of a second variant of the radiator shown in Fig;

on Fig shows a top view in section along EE on the second variant of the radiator shown in Fig;

in Fig.20 shows a front view of a second embodiment of a radiator with three pairs of heat-absorbing and heat-distributing parts;

in Fig.21 shows a side view of a second variant of the radiator shown in Fig.20;

on Fig shows a top view in section along MF on the second variant of the radiator shown in Fig;

on Fig shows a top view in section of a second variant of a radiator with three pairs of heat-absorbing and heat-distributing parts and protruding radiator plates.

The first version of the radiator for electronic components (see figure 1, figure 2, figure 3) contains many separate rectangular radiator

plates 1 having two first opposing edges 2, 3 and two second opposing edges 4, 5. Radiator plates 1 are fastened near the edges 2, 3 through heat-conducting gaskets 6, 7 to each other. The heat-conducting gaskets 6 form a first heat-absorbing part 8 in contact with the heat-generating surface of one electronic component (not shown in the drawing) and the first heat-distributing part 9, opposite the first heat-absorbing part 8, and the heat-conducting gaskets 7 form a second heat-absorbing part 10 in contact with the heat-generating surface another electronic component (not shown), the second heat distribution part 11, opposite the second heat-absorbing part 10. Radiator plates Stina 1 and gasket 6, 7 may be bonded to each other by various known methods, for example by soldering or gluing the heat conducting adhesive. In one embodiment of the utility model (see FIG. 1, FIG. 2, FIG. 3, and FIG. 20), the distal ends 12, 13 of the heat-conducting gaskets 6, 7 lie in planes passing through the second opposing edges 4, 5 of the radiator plates 1. In the second embodiment of the utility model (see Fig. 5, Fig. 8 and Fig. 17), the distal sections 14 of the radiator plates protrude on one side of the distal ends 12 of the heat-conducting gaskets 6 (see Fig. 18, Fig. 19 and Fig. 23 ), or on both sides, both for the distal ends 12 of the heat-conducting gaskets 6, and for the distal ends of 13 heat-conducting gaskets 7 (see Fig. 6, Fig.7, Fig.9, Fig.10). In the second embodiment of the utility model, the minimum aerodynamic resistance to air flow is achieved due to the fact that the radiator plates 1 that form outside the heat-conducting gaskets 6, 7 (i.e., the heat-absorbing part) form an air channel (which is a set of elementary channels formed by many radiator plates 1 ), the cross section of which is always larger than the cross section of the channel directly above the heat-absorbing parts 8, 10 of the radiator. Due to this, the speed of the air flow at the inlet and outlet of the radiator is always less than the speed inside the air channel, and hence minimal losses. The narrowing of the air flow occurs over the heat-absorbing parts 8, 10 of the radiator when the air flow moves in a steady state (when the thickness and number of radiator plates 1 does not affect its speed). Therefore, disturbances (turbulence) of the air flow in the zone of heat-absorbing parts 8, 10 lead to a significant increase in heat transfer efficiency with a minimum increase in aerodynamic resistance to air flow.

Radiator plates 1 forming a plurality of elementary channels may have different thicknesses (see FIG. 4). Groups I and III of thick plates 1 are located at least along the edges and provide mechanical strength of the radiator, acting as a supporting structure. Group II of thin plates 1 causes minimal disturbances (turbulence) when they are bent around by the air flow at the inlet and outlet of the radiator. The sections 14 of the radiator plates 1 protruding beyond the ends 12, 13 of the gaskets 6, 7 can have straight edges 4, 5 (see FIG. 6, FIG. 12), rounded edges 15 (see FIG. 9, FIG. 15), and pointed edges 16 (see Fig. 18). In another embodiment of the utility model (see Fig. 11, Fig. 12, Fig. 13. Fig. 14, Fig. 15 and Fig. 16), the heat-conducting gaskets 6, 7 are fastened to the rectangular protrusions 17, 18 of the radiator plates 1. In this case the heat-conducting gaskets 6, 7 are installed flush with the outer edges 19, 20 and 21 of the rectangular opposing protrusions 17, 18 (see Fig. 12), repeating their contour, and the thickness of the heat-conducting gaskets 6, 7 is at least a part of their length greater than the height of the above-mentioned rectangular protrusions 17, 18 so that one or more protrusions 22 (see Fig. 15), or all heat-conducting gaskets ki 6, 7 along their length (see Fig. 12), protruding inward, turbulized the air flow. In Fig.20, Fig.21, Fig.22 and Fig.23 shows radiators with three heat-absorbing parts 8, 10 and 23, three heat-distributing parts 9, 11 and 24. The heat-absorbing part 23 and heat-distributing part 24 are formed by heat-conducting gaskets 25 and part radiator plates 1. Radiator plates 1 can be formed in several groups made of metals with different thermal conductivity. For example, some groups I, II of the radiator plates 1 (see FIG. 4) are made of aluminum, and group III of the radiator plates 1 located above the heat source is made of copper. Heat-conducting gaskets 6, 7 in the radiator can also be made of metals with different thermal conductivity. Without changing the geometric dimensions of the radiator, using thinner radiator plates 1 depending on the task, you can either increase the number of plates 1 (heat transfer area) or increase the gap between them, thereby increasing the effective cross section of the elementary air channel (the space between adjacent radiator plates 1) . In combination with the possibility of combining materials with different thermal conductivity, from which both radiator plates 1 and heat-conducting gaskets 6, 7 are made, the inventive radiator is a very flexible, easily reconfigurable design that allows you to solve

heat transfer problems in complex electronic devices having several heat-generating elements with different capacities and geometric sizes located at a distance from each other, for example, a printing unit or several printing units on a single radiator.

The inventive utility model allows you to remove heat simultaneously from several electronic components while minimizing the cost of manufacturing a radiator.

Claims (22)

1. A radiator for electronic components, comprising a plurality of individual rectangular radiator plates fastened together near the first two opposing edges through heat-conducting gaskets to each other with the formation of at least two heat-absorbing parts in contact with the heat-generating surfaces of the electronic components, and at least two heat distribution parts opposite to the corresponding heat-absorbing parts, while the distal ends of the heat-conducting gaskets located at the second against lying edges of the fins lie in planes passing through said second opposing edge. 2. The radiator according to claim 1, characterized in that at least two heat-absorbing parts and at least two heat-distributing parts are formed by heat-conducting gaskets and the whole set of radiator plates, and at least one heat-absorbing part and at least one heat-distributing part are formed by heat-conducting gaskets and part of many radiator plates. 3. The radiator according to claim 1, characterized in that the radiator plates and said gaskets are fastened to each other with solder. 4. The radiator according to claim 1, characterized in that the radiator plates and said gaskets are bonded to each other with heat-conducting adhesive. 5. The radiator according to claim 1, characterized in that the radiator plates are formed in at least two groups made of metals with different thermal conductivity. 6. The radiator according to claim 5, characterized in that at least one group of radiator plates is made of copper, and at least one group of radiator plates is made of aluminum. 7. The radiator according to claim 1, characterized in that the radiator plates are formed in at least two groups made of radiator plates of different thicknesses. 8. The radiator according to claim 1, characterized in that the heat-conducting gaskets are made of metals with different thermal conductivity. 9. A radiator for electronic components, comprising a plurality of individual radiator plates having at least two parallel edges and fastened close to these edges through heat-conducting gaskets to each other with the formation of at least two heat-absorbing parts in contact with the heat-generating surfaces of the electronic components, and not less than two heat-distributing parts opposite to the corresponding heat-absorbing parts, while the distal sections of the radiator plates are at least on one side fall behind the distal ends of the heat-conducting gaskets located at the second opposite edges of the radiator plates. 10. The radiator according to claim 9, characterized in that at least two heat-absorbing parts and at least two heat-distributing parts are formed by heat-conducting gaskets and the whole set of radiator plates, and at least one heat-absorbing part and at least one heat-distributing part are formed by heat-conducting gaskets and part of many radiator plates. 11. The radiator according to claim 9, characterized in that the heat-conducting gaskets are fastened to rectangular opposing protrusions of the radiator plates, while the heat-conducting gaskets are installed flush with the outer edges of the rectangular opposing protrusions, and the thickness of the heat-conducting gaskets is at least a portion of their length greater than the height of said rectangular protrusions. 12. The radiator according to claim 9, characterized in that the radiator plates protrude on one side of the distal ends of the heat-conducting gaskets. 13. The radiator according to claim 9, characterized in that the radiator plates protrude on both sides of the distal ends of the heat-conducting gaskets. 14. The radiator according to claim 9, characterized in that the sections of the radiator plates protruding beyond the distal ends of the heat-conducting gaskets have rounded edges. 15. The radiator according to claim 9, characterized in that the sections of the radiator plates protruding beyond the distal ends of the heat-conducting gaskets have pointed edges. 16. The radiator according to claim 9, characterized in that the heat-conducting gaskets are attached to the rectangular protrusions of the radiator plates, while the heat-conducting gaskets repeat the shape of the rectangular protrusions. 17. The radiator according to claim 9, characterized in that the radiator plates are formed in at least two groups made of metals with different thermal conductivity. 18. The radiator according to claim 17, characterized in that at least one group of radiator plates is made of copper, and at least one group of radiator plates is made of aluminum. 19. The radiator according to claim 9, characterized in that the radiator plates are formed in at least two groups made of radiator plates of different thicknesses. 20. The radiator according to claim 9, characterized in that the heat-conducting gaskets are made of metals with different thermal conductivity. 21. The radiator according to claim 9, characterized in that the radiator plates and said gaskets are fastened to each other with solder. 22. The radiator according to claim 9, characterized in that the radiator plates and said gaskets are bonded to each other with heat-conducting adhesive.