RU2595773C2 - Electronic module - Google Patents

Abstract

FIELD: computer engineering.

SUBSTANCE: invention relates to computer engineering and can be applied to radio-electronic equipment (REE) with set of replaceable modules, operating in conditions of higher heat release, significant mechanical loads, as well as aggressive weather factors in field army operation. Proposed electronic module design includes at least one channel to direct flow of cooling heat medium into electronic module, and insulating REE elements from direct contact with said heat medium. Walls of channel housing does not allow coolant flow to dissipate in inter-unit space, wherein coolant is concentrated on heat-loaded sections. Channel housing is made from heat-conducting material and its outer surface contacts with heat-loaded elements of module. Efficiency of heat removal via channel from heat-loaded elements can be amplified by application of heat-conducting gaskets, or thermo-paste.

EFFECT: technical result is increased efficiency of removing heat released by REE elements, while saving of heat medium.

1 cl, 11 dwg

Description

The invention relates to electronic computer technology and can be used in the construction of electronic equipment (CEA) with a set of replaceable modules operating in conditions of increased heat release by CEA elements, significant mechanical loads, as well as aggressive weather and climate factors during military operation.

A well-known electronic module (RF patent No. 2309560), made on the basis of a frameless structure containing a front panel, a printed circuit board, electrical components and an electrical connector mounted on it. The design of the module involves cooling the radioelements by natural convection or by forced blowing with a stream of air. The disadvantage of this device is that its design does not allow the effective removal of heat from electrical elements with a high level of power dissipation. In addition, dust and dirt particles on the surface of the printed circuit board and electro-radio elements will inevitably come into contact, as well as direct contact of these surfaces with moisture and aggressive substances contained in the air, which leads to a decrease in the efficiency of heat dissipation, destruction and corrosion of the surface of the printed circuit board and installed on her elements.

The closest in technical essence and the achieved effect to the proposed invention is a radio-electronic module (RF patent No. 2052912). The design of this module consists of a section frame with a partition that divides it into two parts. In one part there are elements with a low level of heat generation, in the other - elements with a high level of heat generation. In the compartment, designed for heat-loaded electro-radio elements, there is a “composing field" with a group of holes with a uniform pitch for attaching radiator elements. In this case, the forced flow of cooling air coming from below, due to the geometry of the structure, is directed to the area of heat-loaded elements. However, a significant part of it is scattered in the space between the modules and is spent idle. With this solution, when the heat-loaded elements are grouped in one part of the module, and all the others in the other, it is impossible to implement a circuit diagram of the principle on one module board and at the same time it is impossible to implement sufficiently complex printed circuit boards. The manufacture of such a module is time-consuming due to the need to use a hinged installation.

The task of the invention is to increase the efficiency of removal of heat generated by CEA elements while saving coolant.

The problem is achieved in that the design of the electronic module, containing at least one printed circuit board with electrical components mounted on it, further includes at least one channel communicating with the external space and designed to form a heat carrier flow, the walls of which are made of heat-conducting material so that the electrical elements of at least one printed circuit board have thermal contact with the outer surface of these walls. Thus, the electronic module may contain several of the above channels, two or more printed circuit boards, the elements of which can be adjacent to the channel body from different sides. The efficiency of heat removal can be enhanced by the use of electronic heat-conducting means in the module design, for example, such as thermal greases, heat-conducting gaskets. The walls of the casing of the above channel do not allow the coolant flow to dissipate into the space between the modules, but concentrate it on the heat-loaded areas, directing this flow into the module, and at the same time isolating the REA elements from direct contact with it.

The following abbreviation is adopted in the text:

a channel designed to form a coolant flow is a channel.

The invention is illustrated by drawings, given as an example and not bearing any restrictive nature. In FIG. 1 shows the electronic module in the REA block; in FIG. 2 and 3 - electronic module with one printed circuit board assembled in various angles;

in FIG. 4 and 5 - electronic module with one printed circuit board disassembled in various angles;

in FIG. 6 and 7 - electronic module with two printed circuit boards (main and mezzanine) disassembled in various angles;

in FIG. 8 - electronic module with two printed circuit boards in assembled form;

in FIG. 9 is a three-dimensional section of an electronic module with two printed circuit boards;

in FIG. 10a and 10b are the main view of the electronic module with two printed circuit boards and its cross section AA;

in FIG. 11 - the principle of operation of the device,

where 1 is the channel, 2 is the printed circuit board, 3 is the channel body, 4 are the electrical components of the main circuit board, 5 is the outer side of the channel body adjacent to the elements of the main printed circuit board, 6 and 11 are the protrusions on the outside of the channel body, 7 is the mezzanine printed circuit board, 8 - electrical elements of the mezzanine printed circuit board, 9 and 12 - counterparts of the connector, used for joining the main and mezzanine printed circuit boards, 10 - the outer side of the channel body adjacent to the elements of the mezzanine printed circuit board, 13 - contact line connection of the radio and electronic element and the walls of the channel body.

The design of the electronic module is as follows. The printed circuit board 2 is thus mounted relative to the housing 3 of the channel 1, so that its outer side 5 is adjacent to the surfaces of the electrical components 4 of the printed circuit board 2, as shown in FIG. 2-5. In order to provide better thermal contact between the housing 3 of the channel 1 and the electro-radio elements 4 of the printed circuit board 2, recesses or protrusions 6 can be formed on its outer side 5. In addition, the space between the outer surface of the housing 3 of the channel 1 and the surfaces of the electro-radio elements 4 of the printed circuit board 2 can be filled thermal paste, one or more heat-conducting gaskets or other means that improve heat dissipation. Another electronic circuit board 7 may be included in the design of the electronic module, the elements of which will abut against the second side 10 of the housing 3 of channel 1, as shown in FIG. 6-8.

To provide better thermal contact between the housing 3 of the channel 1 and the radio elements 8 of the mezzanine printed circuit board 7, recesses and protrusions 11 can be formed on its outer side 10. At the same time, in any of the above-described electronic module designs, the space between the outer surface of the channel housing and the surface one or more electrical radio elements can be filled with thermal grease, one or more heat-conducting gaskets or other materials and structures that improve the removal of pl.

Depending on the design of the electronic module, the elements of the printed circuit boards may lie on several sides of the channel housing of this module. Moreover, the number of printed circuit boards, the elements of which are adjacent to the channel body of the electronic module, can be any. In this case, thermal contact between the channel body and the elements of the printed circuit boards can be provided as described above.

In the event that one of the above printed circuit boards is the main one, and the second acts as a mezzanine printed circuit board, electrical connectors 9 and 12 can be used to connect them in accordance with the circuit diagram in principle. In such a situation, corresponding to the case 3 of channel 1 can be made cutouts in the amount of one or more pieces for joining the mating parts of the electrical connectors 9 and 12.

The cross-sectional shape of the aforementioned channel with a plane perpendicular to the direction of movement of the coolant in it can be any. Instead of one such channel, any number of channels with the above-described properties may be present in this design.

The principle of operation of the device is as follows: the heat generated by the electro-radio elements 4 and 8 of the printed circuit boards 2 and 7 is transferred through the contact connections 13 to the walls of the housing 3. As a result of the spread of heat through the housing material, this part of the design of the electronic module is heated. Heating occurs mainly in the region of the shortest heat distribution path from the printed circuit board element to the inner surface of the wall of the housing 3. The heat transfer described above is shown by short arrows in FIG. 11. The flow of cooling coolant flowing through the channel 1 of the housing 3, which in FIG. 11 is conventionally shown by long arrows, in contact with the inner surface of the housing walls, removes heat from them, thus cooling the entire structure.

The electronic module in comparison with the prototype allows you to:

- to increase the efficiency of heat removal from heat-loaded electro-radio elements by using the minimum number of structural elements and conductive connections in the area between heat-loaded electro-radio elements and a heat carrier, which reduce heat conductivity;

- reduce the flow rate of the coolant due to the direction of its flow through the channel inside the electronic module, which eliminates its dispersion into the space between the modules, where the efficiency of heat removal by the coolant is very small;

- to increase resistance to external weather and climatic factors due to the fact that the walls of the channel body exclude direct contact of radio electronic elements, a printed circuit board and other structural elements with the coolant and the particles and substances contained therein;

- increase the dynamic stiffness of the product due to the presence in the design of the channel body.

Claims (1)

An electronic module containing at least one printed circuit board with electric radio elements installed on it, characterized in that at least one channel is connected in its design, communicating with the external space and intended for forming a heat carrier flow, the casing walls of which are made of heat-conducting material in such a way that the electro-radio elements of at least one printed circuit board have thermal contact with the outer surface of these walls, while the surface of one or more electro the radioelements of at least one printed circuit board is separated from the outer surface of the wall of the channel body, designed to form a coolant flow, by means of heat-conducting means, for example, such as thermal grease and / or heat-conducting gasket.

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