RU2396737C1 - Module of signals receiver in satellite radio navigation systems - Google Patents

Abstract

FIELD: radio engineering.

SUBSTANCE: module comprises multi-layer printed circuit board with conducting and insulating layers and metallised holes, which are used to provide interlayer electric connections, and board carriers printed conductors and electric radio elements of electric circuit intended for reception and processing of signals in satellite radio navigation systems (SRNS), coming from external source of signals. Printed conductors and electric radio elements related to units of analog signal processing are grouped in zone, which occupies group of upper conducting and insulating layers of multi-layer printed circuit board. Printed conductors and electric radio elements related to units of digital signal processing are grouped in zone, which occupies group of lower conducting and insulating layers of multi-layer printed circuit board. Intermediate zone with screening ground planes, which occupies group of medium conducting and insulating layers in multi-layer printed circuit board, is arranged between zones of analog and digital signal processing. Multi-layer printed circuit board consists of three joined multi-layer fragments - upper, medium and lower ones. Upper fragment includes group of upper conducting and insulating layers of multi-layer printed circuit board related to zone of analog signal processing, lower fragment - group of lower conducting and insulating layers of multi-layer printed circuit board related to zone of digital signal processing, and medium fragment - group of medium conducting and insulating layers related to intermediate zone. Medium fragment has H-shaped profile of cross section, which forms inner cavities of multi-layer printed circuit board, where inner electric radio elements are arranged from zones of analog and digital signal processing, installed in lower inner conducting layer of analog signal processing zone and upper inner conducting layer of digital signal processing zone. At the same time in lower external conducting layer of digital signal processing zone there are external electric radio elements of this zone arranged, and in upper external conducting layer of analog signal processing zone there is a ground plane, which forms external screen of analog signal processing zone, and contact sites arranged along edges and serving for external connections.

EFFECT: development of compact module, which requires less area for its location.

21 dwg

Description

The invention relates to radio engineering and can be used in the design of small-sized modules of signal receivers of satellite radio navigation systems (SRNS).

The SRNS signal receiver modules are used to obtain navigation information and / or information about the exact time based on the received SRNS signals, for example, the SRNS GLONASS (Russia) and GPS (USA) signals. These signals are processed using analog and digital functional units located on a multilayer printed circuit board. Analog processing includes, in particular, filtering signals from interference, their amplification and frequency conversion with decreasing frequency, and digital processing includes, in particular, multi-channel correlation processing and processing in a digital processor. To ensure the on-board electromagnetic compatibility of heterogeneous functional units that perform analog and digital signal processing (i.e., to reduce spurious interference and induced interference to an acceptable level; due to the mutual influence of analog and digital nodes), these nodes are placed on a multilayer printed circuit board in a certain way and shielded by internal means.

Known are the designs of the SRNS signal receiver modules in which the functional units performing the analog and digital processing of the SRNS signals are grouped according to the corresponding functional zones — the zones of analog and digital signal processing, arranged in series in accordance with the signal processing sequence along the long side of the multilayer printed circuit board, see For example, RF patents: [1] - RU 2172080 C1, H05K 1/00, 1/11, 1/14, 3/46, 08/10/2001, [2] - RU 2188522 C1, H05K 1/14, H01P 11 / 00, 08.27.2002, [3] - RU 2192108 C1, H05K 1/00, 1/11, 1/14, 3/46, 9/00, 10.27.2002, [4] - RU 2194375 C1, H05K 1 / 00, 1/11, 1 / 14, 3/46, 9/00, 12/10/2002, [5] - RU 2199839 C1, H05K 1/00, 1/11, 1/14, 3/46, 9/00, 02/27/2003, [6 ] - RU 2173036 C1, H05K 1/00, 1/11, 1/14, 3/46, 08.27.2001. In each of the zones of analog and digital signal processing, shielding is carried out using planar screens formed by ground planes made in the inner conductive layers of a multilayer printed circuit board and serving as power conductors of the Earth potential for the radio-electronic elements of the corresponding zones. Such on-board in-band shielding allows you to reduce the influence of spurious interference and induced noise created by elements belonging to different functional areas and transmitted mainly through power circuits.

The sequential arrangement of the zones of analog and digital signal processing, applied in patents [1] - [6], to the greatest extent corresponds to the element base of low and medium level of integration, providing the possibility of rational placement of a large number of discrete electro-radio elements on both sides of a multilayer printed circuit board in each of the zones analog and digital signal processing.

With an increase in the level of integration of the element base and a decrease in the total number of electro-radio elements in this regard, the principle of the sequential arrangement of the zones of analog and digital signal processing for the double-sided placement of electro-radio elements in each zone, applied in patents [1] - [6], ceases to be optimal from the point of view possibilities of miniaturization of the design of the SRNS signal receiver module. To this case, the one-sided placement of radio electronic elements within each of the zones of analog and digital signal processing corresponds to this case while simultaneously placing these zones under each other on different sides of the multilayer printed circuit board, for example, as is done in the SRNS signal receiver modules presented in the patents of the Russian Federation: [ 7] - RU 2287917 C1, H05K 1/11, 3/46, 9/00, 11/20/2006; [8] - RU 2287918 C1, H05K 1/11, 3/46, 9/00, 11/20/2006; [9] - RU 2287919 C1, H05K 1/11, 3/46, 9/00, 11/20/2006, as well as in the receiver module of the SRNS signals presented in the patent of the Russian Federation [10] - RU 2287920 C1, H05K 1/14, November 20, 2006, adopted as a prototype.

The SRNS signal receiver module [10], adopted as a prototype, contains a multilayer printed circuit board with conductive and insulating layers and metallized holes, through which interlayer electrical connections are made. A multilayer printed circuit board carries printed conductors and electrical components of an electrical circuit designed to receive and process SRNS signals from an external signal source. The printed conductors and electro-radio elements related to the analog signal processing units are grouped in the analog signal processing zone, which occupies the group of upper conductive and insulating layers of the multilayer printed circuit board. Printed conductors and electro-radio elements related to digital signal processing units are grouped in a digital signal processing zone, which occupies a group of lower conductive and insulating layers of a multilayer printed circuit board. Between these zones is an intermediate zone with shielding earth planes, occupying a group of middle conductive and insulating layers of a multilayer printed circuit board. In the example considered in [10], the zone of analog signal processing occupies the five upper conductive layers and four insulating layers located between them, the digital signal processing zone occupies the five lower conductive layers and four insulating layers located between them, and the intermediate zone occupies two middle conductive layers layers and three adjacent insulating layers. In the General case, the number of layers occupied by these zones may be different depending on the specific electrical circuit.

All discrete electro-radio elements of the analog signal processing zone are located in the outer first conductive layer of the multilayer printed circuit board. All discrete electro-radio elements of the digital signal processing zone are located in the outer last conductive layer of the multilayer printed circuit board.

For the implementation of external connections are high-frequency and low-frequency connectors located respectively in the outer first and last conductive layers of the multilayer printed circuit board. In this case, the high-frequency connector serves to supply the SRNS signals to the multilayer printed circuit board from an external signal source, and the low-frequency connector serves to supply external power and external control signals to the multilayer printed circuit board, as well as to remove processed signals from it.

Interlayer electrical connections within the zones of analog and digital signal processing are carried out using the corresponding deaf metallized holes. Electrical connections between the zones of analog and digital signal processing, as well as between them and the separation zone are carried out using the corresponding through metallized holes.

The functions of the intraband screening are carried out by the earth planes of the zones of analog and digital signal processing, which serve as power conductors of the “Earth” potential for the electrical radio elements of their zones. The function of the interband separation shielding is performed by the shielding earth planes of the intermediate zone. All earth elements of all three zones are electrically connected to each other and connected to the Earth contact element of the low-frequency connector, to which the corresponding output of the external power source is connected.

The prototype module is installed on a carrier board on four racks and connected to external devices using low-frequency and high-frequency connectors.

Unilateral placement of radio electronic elements within the zones of analog and digital signal processing while simultaneously placing these zones under each other on different sides of the multilayer printed circuit board and separating them with the shielding earth planes of the intermediate zone allows reducing the dimensions of the prototype module in conditions of using an element base of a high level of integration and providing electromagnetic compatibility of analog and digital signal processing zones. In this case, the area of the prototype module is determined by the largest of the areas required to accommodate the corresponding electrical connectors and discrete electrical radio elements of the zones of analog and digital signal processing. So, in the example presented in [10], the dimensions of the module (in plan) are (50 × 50) mm, which is determined by the area required for the placement of digital nodes and a low-frequency connector. In this case, the analog nodes require a smaller area for their placement, in particular when using a specialized large integrated circuit (VLSI) for the frequency conversion of the type described in the patent of the Russian Federation [11] - RU 2256936 C1, G01S 5/14, H04B 1/26, 20.07 .2005.

The reduction in area provided in the prototype module in some cases is insufficient to solve the problems of constructing small-sized radio navigation equipment, which requires new design solutions to create a more compact SRNS signal receiver module.

The technical result to which the invention is directed is to create a design of a compact module of the SRNS signal receiver, requiring a reduced area for its placement.

The invention consists in the following. The SRNS signal receiver module contains a multilayer printed circuit board with conductive and insulating layers and metallized holes, through which interlayer electrical connections are made, carrying printed conductors and radio-electronic elements of an electrical circuit designed to receive and process SRNS signals from an external signal source. In this case, the printed conductors and electro-radio elements related to the analog signal processing units are grouped in the analog signal processing zone, which occupies the group of the upper conductive and insulating layers of the multilayer printed circuit board, the printed conductors and electro-radio elements related to the digital signal processing units are grouped in the digital signal processing area occupying a group of lower conductive and insulating layers of a multilayer printed circuit board, and located between the zones of analog and digital signal processing There is an intermediate zone with shielding earthen planes, occupying a group of middle conductive and insulating layers of a multilayer printed circuit board. Unlike the prototype, a multilayer printed circuit board consists of three interconnected multilayer fragments - the upper, middle and lower, interacting with each other adjacent contact pads located at the edges of the corresponding conductive layers of adjacent fragments, and the upper fragment includes a group of upper conductive and insulating layers of a multilayer printed circuit board related to the zone of analog signal processing, the lower fragment includes a group of lower conductive and insulating Oev multilayer circuit board pertaining to the zone of digital signal processing, and the average fragment comprises a group of conductive and insulating middle layers of the multilayer printed circuit board belonging to the intermediate zone. The middle fragment has an H-shaped cross-sectional profile, forming the internal cavities of the multilayer printed circuit board, in which the internal electro-radio elements of the zones of analog and digital signal processing are located, respectively installed in the lower inner conducting layer of the analog signal processing zone and the upper inner conducting layer of the digital signal processing zone. In this case, the external electro-radio elements of this zone are located in the lower outer conducting layer of the digital signal processing zone, and in the upper outer conducting layer of the analog signal processing zone there is an earth plane forming the outer screen of the analog signal processing zone and contact pads located at the edges, which serve for external connections .

The invention and its feasibility are illustrated by the schematic drawings shown in figures 1-21.

Figure 1 presents a General view of the receiver module of the SRNS signals (a - top view, b - side view with a partial section, in - bottom view);

figure 2 is a sectional view of a multilayer printed circuit board (the arrangement of metallized holes and printed elements is conditional);

figure 3 is a fragment of the print pattern of the first conductive layer;

figure 4 is a fragment of the print pattern of the second conductive layer (view from the side of the first layer, layers conditionally transparent);

on. 5 is a fragment of the print pattern of the third conductive layer (view from the side of the first layer, the layers are conditionally transparent);

Fig.6 is a fragment of the print pattern of the fourth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

7 is a fragment of the print pattern of the fifth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig is a fragment of the print pattern of the sixth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

figure 9 is an example of a print pattern of the seventh conductive layer (view from the side of the first layer, the layers are conditionally transparent);

figure 10 is an example of a print pattern of the eighth conductive layer (view from the side of the first layer, layers conditionally transparent);

figure 11 is an example of a print pattern of the ninth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig - an example of a print pattern of the tenth conductive layer (view from the side of the first layer, layers conditionally transparent);

in Fig.13 is a fragment of the print pattern of the eleventh conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig is a fragment of the print pattern of the twelfth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig is a fragment of the print pattern of the thirteenth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

in Fig.16 is a fragment of the print pattern of the fourteenth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig is a fragment of the print pattern of the fifteenth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig is a fragment of the print pattern of the sixteenth conductive layer (view from the side of the first layer, layers conditionally transparent);

in Fig.19 is a fragment of the print pattern of the seventeenth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig is a fragment of the print pattern of the eighteenth conductive layer (view from the side of the first layer, layers conditionally transparent);

on Fig is a schematic drawing explaining the manufacturing features of the module receiver receiver signals SRNS.

The inventive SRNS signal receiver module is a monoblock and contains (Figs. 1, 2) a multilayer printed circuit board 1 with conductive 2 and 3 insulating layers, carrying printed conductors and radio electronic elements of an electrical circuit designed to receive and process SRNS signals from an external signal source , for example, an external antenna that receives signals from the SRNS GLONASS and GPS signals from the air in the frequency range F1 / L1 (1.55 ÷ 1.65 GHz).

Printed conductors and electro-radio elements related to the nodes of the analog signal processing are grouped in zone 4 of the analog signal processing, which occupies in the multilayer printed circuit board 1 group of upper conductive and insulating layers (figa, b; 2). In particular, in this zone there are nodes that filter the SRNS signals, their amplification and frequency conversion with decreasing frequency, as well as the node of the voltage generator of the analog power supply, which generates the voltage of the analog power from the input voltage of the external power (not shown in the figures).

Printed conductors and electro-radio elements related to digital signal processing units are grouped in zone 5 of digital signal processing, which occupies in the multilayer printed circuit board 1 group of lower conductive and insulating layers (Fig. 1b, c; 2). In particular, in this zone there are nodes that perform analog-to-digital signal conversion, multi-channel correlation processing and processing in a digital processor, as well as nodes of digital power voltage conditioners, which generate a network of digital power voltages from the input external power voltage (not indicated in the figures) .

Between zone 4 of the analog signal processing and zone 5 of digital signal processing in the multilayer printed circuit board 1 is an intermediate zone 6, which occupies a group of middle conductive and insulating layers. Shielding earth planes 7 and 8 are located in this zone, providing on-board dividing shielding between the zones of analog 4 and digital 5 signal processing (Fig. 1b, 2).

In this example, zone 4 of the analog signal processing occupies the first six conductive layers 2 (2 ₁ , 2 ₂ , 2 ₃ , 2 ₄ , 2 ₅ , 2 ₆ ) and five insulating layers 3 (3 ₁ , 3 ₂ , 3 ₃ , 3 ₄ 3 ₅ ) (Figs. 2, 3-8), the intermediate zone 6 occupies the following four conductive layers 2 (2 ₇ , 2 ₈ , 2 ₉ , 2 ₁₀ ) and three insulating layers 3 (3 ₆ , 3 ₇ , 3 ₈ ) (Fig. 2, 9-12), and zone 5 of digital signal processing occupies the last eight conductive layers 2 (2 ₁₁ , 2 ₁₂ , 2 ₁₃ , 2 ₁₄ , 2 ₁₅ , 2 ₁₆ , 2 ₁₇ , 2 ₁₈ ) and seven insulating layers 3 (3 ₉ , 3 ₁₀ , 3 ₁₁ , 3 ₁₂ , 3 ₁₃ , 3 ₁₄ , 3 ₁₅ ) (figure 2, 13-20), while the lower conductive layer 2 ₆ zone 4 of the analog signal processing s adjacent to the upper conductive layer 2 _{7 of the} intermediate zone 6, and the lower conductive layer 2 _{10 of the} intermediate zone 6 is adjacent to the upper conductive layer 2 _{11 of the} zone 5 of digital signal processing (figure 2).

Interlayer electrical connections in zone 4 of the analog signal processing are carried out using metallized holes 9, interlayer electrical connections in zone 5 of digital signal processing are made using metallized holes 10, and interlayer electrical connections in the intermediate zone 6 are made using metallized holes 11 (Fig. 2 ) In this case, the metallized holes 9 and 10 are located over the entire area of their zones, and the metallized holes 11 are located around the perimeter of the intermediate zone 6.

The multilayer printed circuit board 1 consists of three interconnected multilayer fragments - the upper 1 ₁ , middle 1 ₂ and lower 1 ₃ fragments (1, 2), where the upper fragment 1 ₁ includes a group of upper conductive 2 ₁ ÷ 2 ₆ and insulating 3 ₁ ÷ 3 ₅ layers of a multilayer printed circuit board 1, related to zone 4 of the analog signal processing (figure 2, 3-8), the middle fragment 1 ₂ includes a group of medium conductive 2 ₇ ÷ 2 ₁₀ and insulating 3 ₆ ÷ 3 ₈ layers of a multilayer printed circuit board 1 related to the intermediate zone 6 (figure 2, 9-12), and the lower fragment 1 ₃ includes a group of lower conductive 2 ₁₁ ÷ 2 ₁₈ and insulating 3 ₉ ÷ 3 ₁₅ layers of a multilayer printed circuit board 1, related to zone 5 of digital signal processing (figure 2, 13-20). The upper 1 ₁ and lower 1 ₃ fragments are flat with a rectangular cross-sectional profile, the middle fragment 1 ₂ has rectangular recesses above and below, due to which an H-shaped profile of its cross-section is formed.

The upper fragment 1 ₁ and the middle fragment 1 ₂ interact with each other with their adjacent contact pads 12 and 13, located around the perimeter along the edges of adjacent to each other conductive layers 2 ₆ and 2 ₇ (Fig.2, 8, 9). The adjacent contact pads 12 and 13 are soldered together, providing mechanical and electrical connection of the upper fragment 1 ₁ with the middle fragment 1 ₂ and, accordingly, the connection of zone 4 of the analog signal processing with the intermediate zone 6.

The middle fragment 1 ₂ and the lower fragment 1 ₃ interact with each other with their adjacent contact pads 14 and 15, located around the perimeter along the edges of adjacent to each other conductive layers 2 ₁₀ and 2 ₁₁ (figure 2, 12, 13). The adjacent contact pads 14 and 15 are soldered together, providing a mechanical and electrical connection of the middle fragment 12 with the lower fragment 1 ₃ and, accordingly, the connection of the intermediate zone 6 with the zone 5 of digital signal processing.

Electrical connections between the upper 1 ₁ and lower 1 ₃ fragments (i.e., between zone 4 of the analog signal processing and zone 5 of the digital signal processing) are made through the middle fragment 1 ₂ (through the intermediate zone 6) through the transit chains, including the corresponding metallized holes 11 and associated pads 13 and 14, interacting with pads 12 and 15.

Due to the H-shaped cross-sectional profile of the middle fragment 1 ₂ in the multilayer printed circuit board 1, two inner cavities 16 and 17 located one under the other are formed (Fig. 1b, 2). The inner cavity 16 is bounded above by the lower inner conducting layer 2 _{6 of the} zone 4 of the analog signal processing, below by the shielding earth plane 7 located in the conducting layer 2 _{8 of the} intermediate zone 6, and on the sides by a frame made in the insulating layer 3 _{6 of the} intermediate zone 6. The inner cavity 17 is bounded above by a shielding earthen plane 8 located in the conductive layer 2 _{9 of the} intermediate zone 6, from below by the upper inner conductive layer 2 _{11 of} the digital signal processing zone 5, and on the sides by a frame made in an insulating m layer 3 _{8 of the} intermediate zone 6.

Inside the cavity 17 there are internal electro-radio elements 18 of the digital signal processing zone 5 installed in its upper inner conductive layer 2 ₁₁ (Fig. 1b, 13). The remaining (external) radio-electronic elements 19 of the zone 5 of digital signal processing are located in its lower outer conductive layer 2 ₁₈ (Fig. 1b, c; 20).

Inside the cavity 16 there are electro-radio elements 20 of zone 4 of the analog signal processing installed in its lower inner conductive layer 2 ₆ (Fig. 1b, 8).

In the upper outer conducting layer 2 _{1 of} zone 4 of the analog signal processing (figa, b; 3) there is an earthen plane 21 forming the outer screen of the zone 4 of analog signal processing and the contact pads 22 located at the edges, which serve for external connections. In particular, among the contact pads 22 there are contact pads 22 _A (“Power”) and 22 _B (“Earth”), designed to connect an external power source, a contact pad 22 _V (“Signal”) and contact pads located on both sides of it 22 _G ("Earth"), designed to connect an external signal source.

The 22 _A contact pad is connected via a metallized hole 9 _A to a printed conductor located in the fourth conductive layer 2 ₄ (discussed below), which transmits the external voltage supply voltage of the “Power” potential to the node of the analog power supply voltage former.

The contact area 22 _B through a metallized hole 9 _{B is} connected to earth elements in all conductive layers of zone 4 of the analog signal processing, including the ground plane located in the fifth conductive layer 2 ₅ (discussed below), which performs the function of a common power supply conductor of the potential “Earth” for electro-radio elements of zone 4 of analog signal processing.

The 22 _V contact pad is connected via a metallized 9 _V hole to the printed strip of the input strip line located in the third conductive layer 2 ₃ (discussed below).

The 22 _G contact pads are connected to the earth sections in all conductive layers of zone 4 of the analog signal processing by means of metallized holes 9 _G , including the earth sections of the third conductive layer 2 ₃ surrounding the printed conductor of the input strip line.

In the second conductive layer 2 ₂ , (FIG. 4) there is an earthen plane 23 duplicating the outer screen of the zone 4 of the analog signal processing formed by the earthen plane 21.

In the third conductive layer 2 ₃ (Fig. 5) there are printed conductors 24 of zone 4 of the analog signal processing, as well as earthen sections 25 filling the space free from the placement of printed conductors 24. In particular, in this conductive layer there is a printed strip 24 _{A of the} input strip line connected by means of a metallized hole 9 _V to a contact plate 22 _V (in addition to the printed wire 24 _A , in figure 5 three more printed conductors 24 are indicated as an example).

In the fourth conductive layer 2 ₄ (Fig.6) are printed conductors 26 of zone 4 of the analog signal processing, as well as earthen sections 27, filling the space free from the placement of printed conductors 26. In particular, in this conductive layer there is a printed circuit conductor 26 _A , connected through a metallized hole 9 _A to the contact pad 22 _A , which serves to transmit the external power voltage of the “Power” potential to the voltage supply unit of the analog power supply (except for the printed conductor 26 _A , in FIG. .6 three more printed conductors are indicated as an example 26).

In the fifth conductive layer 2 ₅ (Fig. 7) there are printed conductors 28 of the zone 4 of the analog signal processing and an earthen plane 29, which acts as a common power supply conductor of the potential “Earth” for the electrical components of zone 4 of the analog signal processing. In particular, in this conductive layer there are printed conductors of 28 _A analog supply, through which the voltage of the analog power generated by the node of the voltage generator of the analog power is transmitted (except for the printed conductor 28 _A , in Fig. 7, three more printed conductors 28 are indicated as an example).

In the sixth conductive layer 2 ₆ (Fig. 8) - the lower inner conductive layer of the analog signal processing zone 4 - there are printed conductors 30 of the analog signal processing zone 4 (three printed conductors 30 are indicated as an example in Fig. 8), earth sections 31, as well as pads 12 located around the perimeter around the edges of the conductive layer 2 ₆ , which serve to connect the upper fragment 1 ₁ to the middle fragment 1 ₂ and, respectively, to connect zone 4 of the analog signal processing with the intermediate zone 6. In particular, among the circuit pads 12 there are contact pads 12 _A and 12 _B , connected by means of metallized holes 9 _A and 9 _B with contact pads 22 _A ("Power") and 22 _B ("Earth") located in the first conductive layer 2 ₁ . In the same conductive layer, the electric radio elements 20 of zone 4 of the analog signal processing are mounted (Fig. 1b).

In the seventh conductive layer 2 ₇ (Fig. 9), the upper conductive layer of the intermediate zone 6, there are contact pads 13 used to connect the middle fragment 1 ₂ to the upper fragment 1 ₁ and, respectively, to connect the intermediate zone 6 to the analog processing zone 4 signals. In particular, among the contact pads 13, there are contact pads 13 _A and 13 _B interacting with the above described contact pads 12 _A and 12 _{B of} zone 4 of the analog signal processing. The contact pad 13 _{A is} connected to the metallized hole 11 _A , forming the beginning of the transit circuit by transmitting the external voltage of the potential “Power” from zone 4 of the analog signal processing through the intermediate zone 6. The contact pad 13 _{B is} connected to the metallized hole 11 _B , forming the beginning of the transit circuit for transmitting the external power supply voltage of the Earth potential from zone 4 of analog signal processing through intermediate zone 6.

Shielded earthen planes 7 and 8 of the intermediate zone 6 are connected to the metallized hole 11 _B , located in the eighth 2 ₈ and ninth 2 ₉ conductive layers (Fig. 10, 11). In addition, the shielding earthen planes 7 and 8 are additionally connected to each other by metallized holes 11 _B connected to the corresponding contact pads 13 and 14, as well as metallized holes 11 _G not connected to the contact pads 13 and 14 (as an example in FIG. .9-12 one metallized hole 11 _V and one metallized hole 11 _G ) are indicated.

In the tenth conductive layer 2 ₁₀ (Fig. 12), the lower conductive layer of the intermediate zone 6, there are contact pads 14 used to connect the middle fragment 1 ₂ to the lower fragment 1 ₃ and, accordingly, to connect the intermediate zone 6 to the analog processing zone 4 signals. In particular, among the contact pads 14 there are contact pads 14 _A and 14 _B , which are connected to the metallized holes 11 _A and 11 _B , forming the end of the transit circuit for transmitting external power voltage through the intermediate zone 6.

In the eleventh conductive layer 2 ₁₁ (Fig. 13) - the upper inner conductive layer of the digital signal processing zone 5 - there are printed conductors 32 of the digital signal processing zone 5 (three printed conductors 32 are indicated as an example in Fig. 13), earth sections 33, as well as pads 15 located around the perimeter along the edges of the conductive layer 2 ₁₁ , which serve to connect the lower fragment 1 ₃ to the middle fragment 1 ₂ and, respectively, to connect zone 5 of the digital signal processing with the intermediate zone 6. In particular, among there are 15 contact pads 15 _A and 15 _B , which interact with the pads 14 _A and 14 _B discussed above, located at the end of the transit circuit for transmitting external power voltage through the intermediate zone 6. In the same conductive layer 2 _11, internal electric radio elements 18 are mounted zone 5 of digital signal processing (figb).

The 15 _A contact pad is connected through a metallized 10 _A hole to a printed conductor located in the thirteenth conductive layer 2 ₁₃ (discussed below) that transmits the external voltage of the “Power” potential to the nodes of the digital power voltage conditioners.

The contact area 15 _B through a metallized hole 10 _B connected to located in the twelfth conductive layer 2 ₁₂ (Fig.14) ground plane 34, which performs the function of a common power supply conductor of the potential “Earth” for electronic components of zone 5 of digital signal processing.

In the thirteenth conductive layer 2 ₁₃ (Fig. 15) there are printed conductors 35 of the digital signal processing zone 5 and earth sections 36. In particular, in this conductive layer there is a 35 _A printed conductor transmitting the external voltage of the “Power” potential to the nodes of the voltage conditioners digital power supply (as an example in FIG. 15, in addition to the printed conductor 35 _A , three more printed conductors 35 are indicated).

In the fourteenth conductive layer 2 ₁₄ (FIG. 16), the printed conductors 37 of the digital signal processing zone 5 are located, the earth sections 38 and the first digital power section 39 (three printed conductors 37 are indicated as an example in FIG. 16).

In the fifteenth conductive layer 2 ₁₅ (FIG. 17), a second digital power plane 40 of digital signal processing zone 5 is located.

In the sixteenth conductive layer 2 ₁₆ (Fig. 18) there are printed conductors 41 of the digital signal processing zone 5 and the third digital power plane 42 (two printed conductors 41 are indicated as an example in Fig. 18).

In the seventeenth conductive layer 2 ₁₇ (Fig. 19) there are printed conductors 43 of the digital signal processing zone 5 and ground sections 44 (three printed conductors 43 are indicated as an example in Fig. 19).

In the eighteenth conductive layer 2 ₁₈ (FIG. 20) - the lower outer conductive layer of the digital signal processing zone 5 — there are printed conductors 45 of the digital signal processing zone 5 (two printed conductors 45 are indicated as an example in FIG. 20), earth sections 46, and also located on the edges of the contact pads 47 used for instrumental control. In particular, among the contact pads 47, there are contact pads 47 _A and 47 _B connected to the metallized holes 10 _A and 10 _B , used to control the voltage of the external power supplied to zone 5 of the digital signal processing from zone 4 of the analog signal processing in transit through the intermediate zone 6. In the same conductive layer, external electro-radio elements 19 of zone 5 of digital signal processing are mounted (Fig. 1b).

The SRNS signal receiver module is manufactured as follows. First, according to the manufacturing technology of multilayer printed circuit boards, the upper 1 ₁ , middle 1 _2, and lower 1 ₃ fragments of the multilayer printed circuit board 1 (Fig. 21) are individually manufactured, the first of which, as described above, includes conductive layers 2 ₁ ÷ 2 ₆ , the second - conductive layers 2 ₇ ÷ 2 ₁₀ , and the third - conductive layers 2 ₁₁ ÷ 2 ₁₈ . In the upper fragment 1 ₁ in the conductive layer 2 ₆ , the radio-electronic elements 20 of zone 4 of the analog signal processing are installed, and in the lower fragment 1 ₃ in the conductive layers 2 ₁₁ and 2 _{18 the} electric-radio elements 18 and 19 of zone 5 of the digital signal processing are installed. Then a layer of solder paste (solder) is applied to the contact pads 12, 13, 14 and 15, after which the fragments 1 ₁ , 1 ₂ and 1 ₃ are pressed together and soldered (sintered), forming a multilayer printed circuit board 1 with internal cavities 16 and 17, in which the electrical elements 20 and 18 of the analogue 4 and digital 5 signal processing zones are located. Thus, in the finished module, on the lower side (in the conductive layer 2 ₁₈ ) there are radio-electronic elements 19 of the digital signal processing zone 5, and the upper side remains free from the placement of radio-electronic elements, it contains only contact pads 22, which are used for external connections, and the ground plane 21, which is an outer screen.

The considered constructive solution of the SRNS signal receiver module, characterized by the location of a part of its electro-radio elements 20 and 18 in the internal cavities 16 and 17 of the multilayer printed circuit board 1, as well as the absence of electrical connectors, allows to obtain a compact SRNS signal receiver module, which requires a reduced area for its placement. So, in the considered example, related to the prototype of the SRNS GLONASS / GPS signal receiver module of the frequency range F1 / L1, the dimensions of the SRNS signal receiver module (in plan) are (30 × 30) mm with a total height of about 8.5 mm.

To accommodate the SRNS signal receiver module, a carrier printed circuit board (not shown in the figures) is used with contact pads corresponding to the contact pads 22. The SRNS signal receiver module is placed on the carrier printed circuit board with its upper side so that its contact pads 22 are in contact with the corresponding carrier pads printed circuit board. After that, the SRNS signal receiver module is soldered with its contact pads 22 to the contact pads of the carrier printed circuit board using surface mounting technology.

The operation of the receiver module signals SRNS is as follows.

Through the external power input formed by the contact pads 22 _A and 22 _B , the voltage from the external power source is supplied from the PCB carrier to the SRNS signal receiver module. From this voltage, with the help of the corresponding nodes of the voltage and voltage generators of the analog and digital power, the necessary intra-module voltages are formed, distributed in the zone 4 of the analog signal processing using the corresponding printed wires of the analog power, and in the zone 5 of the digital signal processing using the planes 40, 42 and section 39 digital power. In this case, the ground plane 29 serves as a common power supply conductor of the Earth potential for the radio-electronic elements of zone 4 of the analog signal processing, and the ground plane 34 serves as the common power supply conductor of the Earth potential for the electric radio elements of the zone 5 of digital signal processing.

Through the signal input formed by the contact pads 22 _B and 22 _G , the SRNS signals, for example, the SRNS GLONASS and GPS signals received by the external receiving antenna, frequency range F1 / L1 (1.55-1.65 GHz, are received from the PCB carrier module into the SRNS signal module ) In zone 4 of the analog signal processing, these signals are amplified, filtered from interference, and frequency converted with a decrease in the carrier frequency to tens of megahertz, using the heterodyne signals generated in the same zone.

Next, the signals are transmitted to zone 5 of digital signal processing through the intermediate zone 6 through transit circuits, including the corresponding metallized holes 11 and associated pads 12, 13 and 14, 15. The intermediate zone 6 due to its shielding earth planes 7 and 8 provides on-board separation shielding between the zones of analog 4 and digital 5 signal processing, reducing to an acceptable level spurious interference and induced noise due to the mutual influence of the functional nodes of the zone 4 analog signal processing and zone 5 digital signal processing on each other.

In zone 5 of digital signal processing, analog-to-digital signal conversion, multi-channel correlation processing and subsequent processing in a digital processor are carried out, as a result of which output signals are generated that carry navigation information and / or exact time information.

The output signals are transmitted from the digital signal processing zone 5 to the corresponding contact pads 22 located in the first conductive layer 2 ₁ . The transfer is carried out through the intermediate zone 6 through the transit chains, including the corresponding metallized holes 11 and the associated pads 15, 14, 13, 12. From the pads 22, the output signals are then sent to the carrier circuit board for subsequent use by the consumer.

Thus, the above shows that the claimed invention is feasible and ensures the achievement of the technical result, which consists in creating the design of a compact module of the SRNS signal receiver, requiring a reduced area for its placement, which makes it promising for use in small-sized radio navigation equipment.

Information sources

1. RU 2172080 C1, H05K 1/00, 1/11, 1/14, 3/46, publ. 08/10/2001.

2. RU 2188522 C1, H05K 1/14, H01P 11/00, publ. 08/27/2002.

3. RU 2192108 C1, H05K 1/00, 1/11, 1/14, 3/46, 9/00, publ. 10/27/2002.

4. RU 2194375 C1, H05K 1/00, 1/11, 1/14, 3/46, 9/00, publ. 12/10/2002.

5. RU 2199839 C1, H05K 1/00, 1/11, 1/14, 3/46, 9/00, publ. 02/27/2003.

6. RU 2173036 C1, H05K 1/00, 1/11, 1/14, 3/46, publ. 08/27/2001.

7. RU 2287917 C1, H05K 1/11, 3/46, 9/00, publ. 11/20/2006.

8. RU 2287918 C1, H05K 1/11, 3/46, 9/00, publ. 11/20/2006.

9. RU 2287919 C1, H05K 1/11, 3/46, 9/00, publ. 11/20/2006.

10. RU 2287920 C1, H05K 1/14, publ. 11/20/2006.

11. RU 2256936 C1, G01S 5/14, H04B 1/26, publ. 07/20/2005.

Claims (1)

A receiver module for satellite radio navigation system signals, comprising a multilayer printed circuit board with conductive and insulating layers and metallized holes, through which interlayer electrical connections are made, carrying printed conductors and radio electronic components of an electrical circuit designed to receive and process signals from satellite radio navigation systems (SRNS) coming from an external source of signals, while printed conductors and electro-radio elements related to the nodes logical signal processing, grouped in the zone of analog signal processing, occupying the group of upper conductive and insulating layers of a multilayer printed circuit board, printed conductors and electro-radio elements related to digital signal processing units, are grouped in a zone of digital signal processing, occupying a group of lower conductive and insulating layers of a multilayer printed circuit boards, and between the zones of analog and digital signal processing there is an intermediate zone with shielding earth planes, occupying UPPU middle conductive and insulating layers of a multilayer printed circuit board, characterized in that the multilayer printed circuit board consists of three interconnected multilayer fragments - upper, middle and lower, interacting with each other adjacent contact pads located at the edges of the respective conductive layers of adjacent fragments, and the upper fragment includes a group of upper conductive and insulating layers of a multilayer printed circuit board related to the area of analog signal processing, the lower fragment includes a group of lower conductive and insulating layers of a multilayer printed circuit board related to the digital signal processing zone, and the middle fragment includes a group of middle conductive and insulating layers of a multilayer printed circuit board related to the intermediate zone, while the middle fragment has H- a shaped cross-sectional profile forming the internal cavities of a multilayer printed circuit board, in which the internal radio-electronic elements of the zones of analog and digital signal processing are located respectively located in the lower inner conducting layer of the analog signal processing zone and the upper inner conducting layer of the digital signal processing zone, while the external outer radio-electronic elements of this zone are located in the lower outer conducting layer of the digital signal processing zone, and in the upper outer conducting layer of the analog signal processing zone the plane forming the outer screen of the analog signal processing zone, and the contact pads located at the edges, which serve for external connection Nij.

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