RU2396736C1 - Module of signals receiver in satellite radio navigation systems - Google Patents

Abstract

FIELD: radio engineering.

SUBSTANCE: module comprises multi-layer printed circuit board with conducting and insulating layers and metallised holes, which are used to provide interlayer electric connections, and board carriers printed conductors and electric radio elements of electric circuit intended for reception and processing of signals in satellite radio navigation systems (SRNS). Printed conductors and electric radio elements related to units of analog signal processing are grouped in zone of analog signal processing. Printed conductors and electric radio elements related to units of digital signal processing are grouped in zone of digital signal processing. Intermediate zone with screening ground planes is arranged between zones of analog and digital signal processing. Multi-layer printed circuit board consists of three joined multi-layer fragments - upper, medium and lower ones, interacting with each other by adjacent contact sites arranged at edges of according conducting layers in neighboring fragments. At the same time upper fragment includes group of those related to zone of analog signal processing, lower fragment - group of those related to zone of digital signal processing, and medium fragment - group of those related to intermediate zone. Medium fragment has H-shaped profile of cross section, which forms inner cavities of multi-layer printed circuit board, where inner electric radio elements of analog and digital signal processing zones are arranged. At the same time in lower external conducting layer of digital signal processing zone there are external electric radio elements of this zone and contact sites arranged along edges and serving for external connections, and in upper external conducting layer of analog signal processing zone there is a ground plane connected to underlying surface of receiving antenna separated by dielectric from resonating element connected by vertical pin-probe to input strip line of analog signal processing zone. Specified strip line is made in the form of printed conductor surrounded at sides in its conducting layer, and also on top and bottom in neighbouring conducting layers of analog signal processing zone by screening printed elements.

EFFECT: development of compact module with inbuilt receiving antenna, which requires less area for its location.

3 cl, 21 dwg

Description

The invention relates to radio engineering and can be used in the design of small-sized modules of signal receivers of satellite radio navigation systems (SRNS).

The SRNS signal receiver modules are used to obtain navigation information and / or information about the exact time based on the received SRNS signals, for example, the SRNS GLONASS (Russia) and GPS (USA) signals. These signals are processed using analog and digital functional units located on a multilayer printed circuit board. Analog processing includes, in particular, filtering signals from interference, their amplification and frequency conversion with decreasing frequency, and digital processing includes, in particular, multi-channel correlation processing and processing in a digital processor. To ensure the on-board electromagnetic compatibility of heterogeneous functional units that perform analog and digital signal processing (i.e., to reduce to an acceptable level of spurious interference and induced interference caused by the mutual influence of analog and digital nodes), these nodes are placed on a multilayer printed circuit board in a certain way and shielded by internal means.

Known are the designs of the SRNS signal receiver modules in which the functional units performing the analog and digital processing of the SRNS signals are grouped according to the corresponding functional zones — the zones of analog and digital signal processing, arranged in series in accordance with the signal processing sequence along the long side of the multilayer printed circuit board, see For example, RF patents: [1] - RU 2172080 C1, H05K 1/00, 1/11, 1/14, 3/46, 08/10/2001, [2] - RU 2188522 C1, H05K 1/14, H01P 11 / 00, 08.27.2002, [3] - RU 2192108 C1, H05K 1/00, 1/11, 1/14, 3/46, 9/00, 10.27.2002, [4] - RU 2194375 C1, H05K 1 / 00, 1/11, 1 / 14, 3/46, 9/00, 12/10/2002, [5] - RU 2199839 C1, H05K 1/00, 1/11, 1/14, 3/46, 9/00, 02/27/2003, [6 ] - RU 2173036 C1, H05K 1/00, 1/11, 1/14, 3/46, 08.27.2001. In each of these zones, shielding is carried out using planar screens formed by earthen planes made in the inner conductive layers of a multilayer printed circuit board and serving as power conductors of the “Earth” potential for the radio-electronic elements of the corresponding zones. This on-board in-band shielding allows you to reduce the influence of spurious interference and induced noise created by elements belonging to different functional areas and transmitted mainly through the power supply circuit.

The sequential arrangement of the zones of analog and digital signal processing, applied in patents [1] ÷ [6], to the greatest extent corresponds to the element base of low and medium integration levels, providing the possibility of rational placement of a large number of discrete electro-radio elements on both sides of a multilayer printed circuit board in each of the zones analog and digital signal processing.

With an increase in the level of integration of the element base and a decrease in the total number of electro-radio elements in this regard, the principle of sequential arrangement of the zones of analog and digital signal processing for the double-sided placement of electro-radio elements in each zone, applied in patents [1] ÷ [6], ceases to be optimal from the point of view possibilities of miniaturization of the design of the SRNS signal receiver module. To this case, the one-sided placement of radio electronic elements within each of the zones of analog and digital signal processing corresponds to this case while simultaneously placing these zones under each other on different sides of the multilayer printed circuit board, for example, as is done in the SRNS signal receiver modules presented in the patents of the Russian Federation: [ 7] - RU 2287917 C1, H05K 1/11, 3/46, 9/00, 11/20/2006; [8] - RU 2287918 C1, H05K 1/11, 3/46, 9/00, 11/20/2006; [9] - RU 2287919 C1, H05K 1/11, 3/46, 9/00, 11/20/2006, as well as in the receiver module of the SRNS signals presented in the patent of the Russian Federation [10] - RU 2287920 C1, H05K 1/14, November 20, 2006, adopted as a prototype.

The SRNS signal receiver module [10], adopted as a prototype, contains a multilayer printed circuit board with conductive and insulating layers and metallized holes, through which interlayer electrical connections are made. A multilayer printed circuit board carries printed conductors and radio-electronic elements of an electrical circuit designed to receive and process SRNS signals. The printed conductors and electro-radio elements related to the analog signal processing units are grouped in the analog signal processing zone, which occupies the group of upper conductive and insulating layers of the multilayer printed circuit board. Printed conductors and electro-radio elements related to digital signal processing units are grouped in a digital signal processing zone, which occupies a group of lower conductive and insulating layers of a multilayer printed circuit board. Between these zones is an intermediate zone with shielding earth planes, occupying a group of middle conductive and insulating layers of a multilayer printed circuit board. In the example considered in [10], the zone of analog signal processing occupies the five upper conductive layers and four insulating layers located between them, the digital signal processing zone occupies the five lower conductive layers and four insulating layers located between them, and the intermediate zone occupies two middle conductive layers layers and three adjacent insulating layers. In the General case, the number of layers occupied by these zones may be different depending on the specific electrical circuit.

All discrete electro-radio elements of the analog signal processing zone are located in the outer first conductive layer of the multilayer printed circuit board. All discrete electro-radio elements of the digital signal processing zone are located in the outer last conductive layer of the multilayer printed circuit board.

For the implementation of external connections are high-frequency and low-frequency connectors located respectively in the outer first and last conductive layers of the multilayer printed circuit board. In this case, the high-frequency connector serves to supply signals to the multilayer printed circuit board from the external receiving antenna, and the low-frequency connector serves to supply external power and control signals to the multilayer printed circuit board and to remove processed signals from it.

Interlayer electrical connections within the zones of analog and digital signal processing are carried out using the corresponding deaf metallized holes. Electrical connections between the zones of analog and digital signal processing, as well as between them and the separation zone are carried out using the corresponding through metallized holes.

The functions of the intraband screening are carried out by the earth planes of the zones of analog and digital signal processing, which serve as power conductors of the “Earth” potential for the electrical radio elements of their zones. The function of the interband separation shielding is performed by the shielding earth planes of the intermediate zone. All earth elements of all three zones are electrically connected to each other and connected to the Earth contact element of the low-frequency connector, to which the corresponding output of the external power source is connected.

The prototype module is mounted on a carrier board on four racks and connected to it using a low-frequency connector. The prototype module is connected to an external receiving antenna using a cable connected to a high-frequency connector.

Unilateral placement of radio electronic elements within the zones of analog and digital signal processing while simultaneously placing these zones under each other on different sides of the multilayer printed circuit board and separating them with the shielding earth planes of the intermediate zone allows reducing the dimensions of the prototype module in conditions of using an element base of a high level of integration and providing electromagnetic compatibility of analog and digital signal processing zones. In this case, the area of the prototype module is determined by the largest of the areas required for the placement of electrical connectors and discrete electro-radio elements of the zones of analog and digital signal processing. So, in the example presented in [10], the dimensions of the module (in plan) are (50 × 50) mm, which is determined by the area required for the placement of digital nodes and a low-frequency connector. In this case, the analog nodes require a smaller area for their placement, in particular when using a specialized large integrated circuit (VLSI) for the frequency conversion, such as described in the RF patent [11] - RU 2256936 C1, G01S 5/14, H04B 1/26, 20.07. 2005.

The reduction in area provided in the prototype module in some cases is insufficient to solve the problems of constructing small-sized navigation equipment, in particular individual GLONASS / GPS navigators, which requires new design solutions to create a more compact SRNS signal receiver module, including with a built-in receiving antenna.

The technical result to which the invention is directed is to create a design of a compact SRNS signal receiver module with an integrated receiving antenna, requiring a reduced area for its placement.

The invention consists in the following. The SRNS signal receiver module contains a multilayer printed circuit board with conductive and insulating layers and metallized holes, through which interlayer electrical connections are carried, carrying printed conductors and radio-electronic elements of an electric circuit designed to receive and process SRNS signals. In this case, the printed conductors and electro-radio elements related to the nodes of analog signal processing are grouped in the zone of analog signal processing, which occupies the group of upper conductive and insulating layers of the multilayer printed circuit board, the printed conductors and electro-radio elements related to the nodes of digital signal processing are grouped in the zone of digital signal processing occupying a group of lower conductive and insulating layers of a multilayer printed circuit board, and located between the zones of analog and digital signal processing There is an intermediate zone with shielding earthen planes, occupying a group of middle conducting and insulating layers of a multilayer printed circuit board. Unlike the prototype, a multilayer printed circuit board consists of three interconnected multilayer fragments - the upper, middle and lower, interacting with each other adjacent contact pads located at the edges of the corresponding conductive layers of adjacent fragments, and the upper fragment includes a group of upper conductive and insulating layers of a multilayer printed circuit board related to the zone of analog signal processing, the lower fragment includes a group of lower conductive and insulating Oev multilayer circuit board pertaining to the zone of digital signal processing, and the average fragment comprises a group of conductive and insulating middle layers of the multilayer printed circuit board belonging to the intermediate zone. The middle fragment has an H-shaped cross-sectional profile, forming the internal cavities of the multilayer printed circuit board, in which the internal electro-radio elements of the zones of analog and digital signal processing are located, respectively installed in the lower inner conducting layer of the analog signal processing zone and the upper inner conducting layer of the digital signal processing zone. At the same time, in the lower external conductive layer of the digital signal processing zone, there are external radio-electronic elements of this zone and contact pads located at the edges, which serve for external connections, and in the upper external conductive layer of the analog signal processing zone there is an earth plane to which the underlying surface of the receiving antenna is connected, separated by a dielectric from the resonating element of the receiving antenna, connected by a vertical probe pin to the input strip line of the analog sample zone Signal operations.

In embodiments of practical importance, the input strip line of the zone of analog signal processing is made in the form of a printed conductor surrounded on the sides in its conductive layer, as well as above and below in adjacent conductive layers of the zone of analog signal processing by shielding it with earthen printed elements, and the vertical the probe pin is sealed in a metallized hole connected to a printed conductor of the input strip line of the analog signal processing zone, wherein said metallized opening This is surrounded by shielding metallized holes connected to earthen printed elements in all conductive layers of the analog signal processing zone.

The invention and its feasibility are illustrated by the schematic drawings shown in figures 1-21.

Figure 1 presents a General view of the receiver module of the SRNS signals (a - top view, b - side view with a partial section, in - bottom view);

figure 2 is a sectional view of a multilayer printed circuit board (the arrangement of metallized holes and printed elements is conditional);

figure 3 is an example of a print pattern of the first conductive layer;

figure 4 is an example of a print pattern of the second conductive layer (view from the side of the first layer, layers conditionally transparent);

figure 5 is a fragment of the print pattern of the third conductive layer (view from the side of the first layer, the layers are conditionally transparent);

Fig.6 is a fragment of the print pattern of the fourth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

7 is a fragment of the print pattern of the fifth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig is a fragment of the print pattern of the sixth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

figure 9 is an example of a print pattern of the seventh conductive layer (view from the side of the first layer, the layers are conditionally transparent);

figure 10 is an example of a print pattern of the eighth conductive layer (view from the side of the first layer, layers conditionally transparent);

figure 11 is an example of a print pattern of the ninth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig - an example of a print pattern of the tenth conductive layer (view from the side of the first layer, layers conditionally transparent);

in Fig.13 is a fragment of the print pattern of the eleventh conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig is a fragment of the print pattern of the twelfth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig is a fragment of the print pattern of the thirteenth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

in Fig.16 is a fragment of the print pattern of the fourteenth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig is a fragment of the print pattern of the fifteenth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig is a fragment of the print pattern of the sixteenth conductive layer (view from the side of the first layer, layers conditionally transparent);

in Fig.19 is a fragment of the print pattern of the seventeenth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig is a fragment of the print pattern of the eighteenth conductive layer (view from the side of the first layer, layers conditionally transparent);

on Fig is a schematic drawing explaining the manufacturing features of the module receiver receiver signals SRNS.

The inventive receiver module of the SRNS signals is a monoblock and contains (Fig.1, 2) a multilayer printed circuit board 1 with conductive 2 and insulating 3 layers, carrying printed conductors and electrical elements of an electrical circuit designed for receiving and processing SRNS signals, for example, SRNS GLONASS and GPS frequency range F1 / L1 (1.55 ÷ 1.65 GHz).

The printed conductors and electro-radio elements related to the nodes of the analog signal processing are grouped in zone 4 of the analog signal processing, which occupies in the multilayer printed circuit board 1 group of upper conductive and insulating layers (Fig. 2, 1a, b). In particular, in this zone there are nodes that filter the SRNS signals received from the ether, amplify and convert them in frequency with decreasing frequency, as well as the node of the voltage generator of the analog power supply, which generates the voltage of the analog power from the input voltage of the external power (not shown in the figures )

Printed conductors and electro-radio elements related to digital signal processing units are grouped in zone 5 of digital signal processing, which occupies in the multilayer printed circuit board 1 group of lower conductive and insulating layers (Fig. 2, 1b, c). In particular, in this zone there are nodes that perform analog-to-digital signal conversion, multichannel correlation processing and processing in a digital processor, as well as nodes of digital power voltage conditioners, which form a network of digital power voltages from the input external power voltage filtered by the input power filter ( not indicated in the figures).

Between zone 4 of the analog signal processing and zone 5 of digital signal processing in the multilayer printed circuit board 1 is an intermediate zone 6, which occupies a group of middle conductive and insulating layers. In this zone there are shielding earthen planes 7 and 8, providing on-board dividing shielding between the zones of analog 4 and digital 5 signal processing (Fig. 2, 1b).

In this example, zone 4 of the analog signal processing occupies the first six conductive layers 2 (2 ₁ 2 ₂ , 2 ₃ , 2 ₄ , 2 ₅ , 2 ₆ ) and five insulating layers 3 (3 ₁ , 3 ₂ , 3 ₃ , 3 ₄ , 3 ₅ ) (FIGS. 2-8), the intermediate zone 6 occupies the following four conductive layers 2 (2 ₇ , 2 ₈ , 2 ₉ , 2 ₁₀ ) and three insulating layers 3 (3 ₆ , 3 ₇ , 3 ₈ ) (FIG. .2, 9-12), and zone 5 of digital signal processing occupies the last eight conductive layers 2 (2 ₁₁ , 2 ₁₂ , 2 ₁₃ , 2 ₁₄ , 2 ₁₅ , 2 ₁₆ , 2 ₁₇ , 2 ₁₈ ) and seven insulating layers 3 (3 ₉ , 3 ₁₀ , 3 ₁₁ , 3 ₁₂ , 3 ₁₃ , 3 ₁₄ , 3 ₁₅ ) (figure 2, 13-20), while the lower conductive layer 2 ₆ zone 4 of the analog signal processing adjacent to the upper conductive layer 2 _{7 of the} intermediate zone 6, and the lower conductive layer 2 _{10 of the} intermediate zone 6 adjacent to the upper conductive layer 2 _{11 of the} zone 5 of digital signal processing (figure 2).

Interlayer electrical connections in zone 4 of the analog signal processing are carried out using metallized holes 9, interlayer electrical connections in zone 5 of digital signal processing are made using metallized holes 10, and interlayer electrical connections in the intermediate zone 6 are made using metallized holes 11 (Fig. 2 ) In this case, the metallized holes 9 and 10 are located over the entire area of their zones, and the metallized holes 11 are located around the perimeter of the intermediate zone 6.

The multilayer printed circuit board 1 consists of three interconnected multilayer fragments - the upper 1 ₁ , middle 1 ₂ and lower 1 ₃ fragments (1, 2), where the upper fragment 1 ₁ includes a group of upper conductive 2 ₁ ÷ 2 ₆ and insulating 3 ₁ ÷ 3 ₅ layers of the multilayer printed circuit board 1 related to zone 4 of the analog signal processing (Fig. 2, 3-8), the middle fragment 12 includes a group of medium conductive 2 ₇ ÷ 2 ₁₀ and insulating 3 ₆ ÷ 3 ₈ layers of the multilayer circuit board 1, belonging to the intermediate zone 6 (Figure 2, 9-12), and the lower portion 1 ₂ includes Rupp lower conductive February ₁₁ ÷ _{18 February} and March ₉ ÷ insulating March ₁₅ layers of the multilayer circuit board 1, belonging to zone 5 the digital signal processor (2, 13-20). The upper 1 ₁ and lower 1 ₃ fragments are flat, with a rectangular cross-sectional profile, the middle fragment 1 ₂ has rectangular recesses above and below, due to which an H-shaped profile of its cross-section is formed.

The upper fragment 1 ₁ and the middle fragment 1 ₂ interact with each other with their adjacent contact pads 12 and 13, located around the perimeter along the edges of adjacent to each other conductive layers 2 ₆ and 2 ₇ (Fig.2, 8, 9). The adjacent contact pads 12 and 13 are soldered together, providing mechanical and electrical connection of the upper fragment 1 ₁ with the middle fragment 1 ₂ and, accordingly, the connection of zone 4 of the analog signal processing with the intermediate zone 6.

The middle fragment 1 ₂ and the lower fragment 1 ₃ interact with each other with their adjacent contact pads 14 and 15, located around the perimeter along the edges of adjacent to each other conductive layers 2 ₁₀ and 2 ₁₁ (figure 2, 12, 13). The adjacent contact pads 14 and 15 are soldered together, providing a mechanical and electrical connection of the middle fragment 1 ₂ with the lower fragment 1 ₃ and, accordingly, the connection of the intermediate zone 6 with zone 5 of digital signal processing.

Electrical connections between the upper 1 ₁ and lower 1 ₃ fragments (i.e., between zone 4 of the analog signal processing and zone 5 of the digital signal processing) are made through the middle fragment 1 ₂ (through the intermediate zone 6) through the transit chains, including the corresponding metallized holes 11 and associated pads 13 and 14, interacting with adjacent pads 12 and 15.

Due to the H-shaped cross-sectional profile of the middle fragment 1 ₂ in the multilayer printed circuit board 1, two inner cavities 16 and 17 located one under the other are formed (Fig. 1b, 2). The inner cavity 16 is bounded above by the lower inner conducting layer 2 _{6 of the} zone 4 of the analog signal processing, below by the shielding earth plane 7 located in the conducting layer 2 _{8 of the} intermediate zone 6, and on the sides by a frame made in the insulating layer 3 _{6 of the} intermediate zone 6. The inner cavity 17 is bounded above by a shielding earthen plane 8 located in the conductive layer 2 _{9 of the} intermediate zone 6, from below by the upper inner conductive layer 2 _{11 of} the digital signal processing zone 5, and on the sides by a frame made in an insulating m layer 3 _{8 of the} intermediate zone 6.

Inside the cavity 17 there are internal electro-radio elements 18 of the digital signal processing zone 5 installed in its upper inner conducting layer 2 ₁₁ (Fig. 1b). The remaining (external) electro-radio elements 19 of the zone 5 of digital signal processing are located in its lower outer conductive layer 2 ₁₈ (Fig. 1b, c).

Inside the cavity 16 there are electro-radio elements 20 of zone 4 of the analog signal processing installed in its lower inner conductive layer 2 ₆ (Fig. 1b).

In the upper outer conducting layer 2 _{1 of} zone 4 of the analog signal processing, there is a receiving antenna 21, which serves to receive SRNS signals from the ether (figa, b).

The receiving antenna 21 contains two parallel conductive plates - the resonating element 22 and the underlying surface 23, separated by a dielectric 24 (figa, b). This design, called the "patch antenna", is described, for example, in US patents: [12] -US 6480170 B1, H01Q 21/00, H01Q 1/38, 11/12/2002; [13] -US 7427957 B2, H01Q 1/38, 09/23/2008; [14] - US 5966096, H01R 1/38, 10/12/1999, and also in the book [15] - GLONASS Global Satellite Radio Navigation System // Pod. ed. V.N.Kharisova, A.I. Perov, V.A.Boldin. / 2nd ed. corrected / M: IPPR, 1999, p. 266-268.

To the resonating element 22 of the receiving antenna 21 is attached (soldered) a vertical pin probe 25 (figa, b), sealed by its other side in a metallized hole 9 ₁ located inside zone 4 of the analog signal processing and intersecting all its layers (Fig.3 -8). The vertical pin probe 25 connects the receiving antenna 21 with the signal processing zone 4, namely, its input strip line (discussed below). Around the circumference of the metallized hole 9 ₁ are shielding metallized holes 9 ₂ (for example, in FIGS. 3-8, one metallized hole 9 _{2 is} indicated). Metallized holes 9 _{2 are} connected in all conductive layers 2 ₁ ÷ 2 _{6 of} zone 4 of the analog signal processing with earthed printed elements (corresponding earthen planes and sections).

The underlying surface 23 of the receiving antenna 21 is connected by soldering to the earthing pads 26, which are part of the earthen plane 27 located in zone 4 of the analog signal processing in its upper outer conductive layer 2 ₁ (figa, b; 3). On the four sides of the earthen plane 27 there are lateral earthen sections 28 separated from it by strips devoid of metallization (Fig. 3).

The lateral earthen sections 28 are connected by means of the corresponding metallized holes 9 ₃ (as an example, FIGS. 3-8 indicate one metallized hole 9 ₃ ) with the ground plane 29 located in the second conductive layer 2 ₂ (FIG. 4), forming an internal circuit board for the receiving antennas 21. These same metallized holes 9 ₃ connect the earthen plane 29 with the earthen printed elements of the subsequent conductive layers 2 ₃ ÷ 2 _{6 of the} zone 4 of the analog signal processing (FIGS. 5-8).

In the third conductive layer 2 ₃ (FIG. 5), there are printed conductors 30 of the analog signal processing zone 4 (as an example, two conductors 30 are indicated in FIG. 5), as well as earthen sections 31 filling the space free of placement of the printed conductors 30.

In the fourth conductive layer 2 ₄ (Fig.6) are printed conductors 32 of the zone 4 of the analog signal processing, as well as earthen sections 33, filling the space free from the placement of the printed conductors 32. In particular, in this conductive layer there is a printed conductor 32 _{1 of the} input power, through which the external power voltage is transmitted to the node of the voltage supply of the analog power supply, printed conductors 32 _{2 of the} analog power supply, which transfers the voltage of the analog power generated by the voltage supply unit of the analog power supply, and also a printed conductor 32 _{3 of the} input strip line of zone 4 of the analog signal processing. In this case, the printed conductor 32 _{3 is} connected, on the one hand, with a metallized hole 9 ₁ , in which the pin probe 25 is sealed, and on the other hand, with a metallized hole 9 ₄ , connecting the printed conductor 32 ₃ with the input element of the zone 4 of analog signal processing that resides with the other electronic components 20 zone 4 analogue signal processing within the cavity 16. The printing wire 32 is surrounded on _three sides in its conducting layer 2, ₄ and the top and bottom of adjacent conductive layers 2 and ₃ May ₂ zone 4 analog processing signal in shielding its earthen elements (5-7) forming a symmetrical strip line, which provides a consistent transmission of signals from the receiving antenna 21 in the zone 4 of the analog signal processing.

In the fifth conductive layer 2 ₅ (Fig. 7) there are printed conductors 34 of zone 4 of the analog signal processing (as an example, three conductors 34 are indicated in Fig. 7) and the ground plane 35, which serves as the lower screen for the above-described printed conductor 32 ₃ , and in addition, it performs the function of a common power supply conductor of the Earth potential for the radio-electronic elements of zone 4 of analog signal processing.

In the sixth conductive layer 2 ₆ (Fig. 8), the lower inner conductive layer of the analog signal processing zone 4, there are printed conductors 36 of the analog signal processing zone 4 (three conductors 36 are indicated as an example in Fig. 8), earth sections 37, and also contact pads 12 located around the perimeter around the edges of the conductive layer 2 ₆ , which serve to connect the upper fragment 1 ₁ to the middle fragment 1 ₂ and, respectively, to connect zone 4 of the analog signal processing with intermediate zone 6 (as an example in Fig. 8, One contact pad 12). In the same conductive layer, the radio-electronic elements 20 of zone 4 of the analog signal processing are mounted.

In the seventh conductive layer 2 ₇ (Fig. 9), the upper conductive layer of the intermediate zone 6, there are contact pads 13 used to connect the middle fragment 1 ₂ to the upper fragment 1 ₁ and, respectively, to connect the intermediate zone 6 to zone 4 of the analog signal processing. Among the contact pads 13 there are contact pads 13 ₁ , which are part of the transit circuits, through which electrical connections are made between the zones of analog 4 and digital 5 signal processing, these contact pads are connected to the corresponding metallized holes 11 ₁ (indicated as an example in FIG. one contact pad 13 ₁ and one metallized hole 11 ₁ ). Among the contact pads 13, there are also contact pads 13 ₂ connected by means of corresponding metallized holes 11 ₂ to the shielding earth planes 7, 8 of the intermediate zone 6 (as an example, in FIG. 9, one contact pad 13 ₂ and one metallized hole 11 _{2 are} indicated).

In the eighth 2 ₈ and ninth 2 ₉ conductive layers (FIGS. 10, 11) there are shielding earthen planes 7 and 8 of the intermediate zone 6, connected to each other by the above metallized holes 11 ₂ , and also additionally metallized holes 11 ₃ that do not have connections with the pads 13 and 14 (as an example in Fig.9-12 designated one metallized hole 11 ₃ ).

In the tenth conductive layer 2 ₁₀ (Fig. 12), the lower conductive layer of the intermediate zone 6, there are contact pads 14 used to connect the middle fragment 1 ₂ to the lower fragment 1 ₃ and, respectively, to connect the intermediate zone 6 to the digital signal processing zone 5. Among the contact pads 14 there are contact pads 14 ₁ that are part of the transit chains connected to the corresponding metallized holes 11 ₁ , as well as contact pads 14 ₂ connected via the corresponding metallized holes 11 ₂ to the shielding earth planes 7 and 8 of the intermediate zone 6 (in as an example, in Fig. 12, one contact pad 14 ₁ and one contact pad 14 ₂ are indicated, connected to the corresponding metallized holes 11 ₁ and 11 ₂ ).

In the eleventh conductive layer 2 ₁₁ (Fig. 13), the upper inner conductive layer of the digital signal processing zone 5, there are printed conductors 38 of the digital signal processing zone 5 (three conductors 38 are indicated in FIG. 13), earth sections 39, and also positioned around the perimeter at the edges of the conductive layer _{11 February} pads 15 which serve to connect the lower portion ₁ March middle frame 1 respectively ₂ and for connecting zone 5 for digital signal processing the intermediate zone 6 (as in example 13 convoy achena one contact pad 15). In the same conductive layer, internal electro-radio elements 18 of zone 5 of digital signal processing are mounted.

In the twelfth conductive layer 2 ₁₂ (Fig. 14) there is an earthen plane 40, serving as a common power supply conductor of the potential "Earth" for the electronic components of zone 5 of digital signal processing.

In the thirteenth conductive layer 2 ₁₃ (Fig. 15) there are printed conductors 41 of the digital signal processing zone 5 (three conductors 41 are indicated as an example in Fig. 15) and earth sections 42.

In the fourteenth conductive layer 2 ₁₄ (FIG. 16) there are printed conductors 43 of the digital signal processing zone 5 (three conductors 43 are indicated as an example in FIG. 16), earth sections 44 and a first digital power section 45.

In the fifteenth conductive layer 2 ₁₅ (FIG. 17), a second digital power plane 46 of digital signal processing zone 5 is located.

In the sixteenth conductive layer 2 ₁₆ (Fig. 18) there are printed conductors 47 of the digital signal processing zone 5 (three conductors 47 are indicated as an example in Fig. 18) and the plane 48 of the third digital power supply.

In the seventeenth conductive layer 2 ₁₇ (Fig. 19), there are printed conductors 49 of the digital signal processing zone 5 (three conductors 49 are indicated as an example in Fig. 19) and earth sections 50.

In the eighteenth conductive layer 2 ₁₈ (FIG. 20) —the lower outer conductive layer of the digital signal processing zone 5 — there are printed conductors 51 of the digital signal processing zone 5 (three conductors 51 are indicated as an example in FIG. 20), earth sections 52, and also located at the edges of the contact pads 53, designed for external connections, including pads 53 ₁ ("Earth") and 53 ₂ ("Power"), designed to connect an external power source. In the same conductive layer, external electro-radio elements 19 of zone 5 of digital signal processing are mounted.

The contact pad 53 ₁ (“Earth”) is electrically connected to all earthed printed elements (corresponding earthen planes and sections) of the digital 5 and analog 4 signal processing zones, as well as to the shielded earth planes 7 and 8 of the intermediate zone 6. Contact pad 53 ₂ ( “Power”) is electrically connected to the input of the analog power supply voltage conditioner assembly, and also, through the input power filter, to the inputs of the first, second and third digital power supply voltage conditioners, the outputs of which are connected s, respectively, with section 45 of the first digital power and planes 46 and 47 of the second and third digital power.

The SRNS signal receiver module is manufactured as follows. First, according to the manufacturing technology of multilayer printed circuit boards, the upper 1 ₁ , middle 1 _2, and lower 1 ₃ fragments of the multilayer printed circuit board 1 (Fig. 21) are individually manufactured, the first of which, as described above, includes conductive layers 2 ₁ ÷ 2 ₆ , the second - conductive layers 2 ₇ ÷ 2 ₁₀ , and the third - conductive layers 2 ₁₁ ÷ 2 ₁₈ . In the upper fragment 1 ₁ , a receiving antenna 21, a vertical probe pin 25, and radio-electronic elements 20 of zone 4 of the analog signal processing are installed, and in the lower fragment 1 ₃ , radio-electronic elements 18 and 19 of zone 5 of the digital signal processing are installed. Then a layer of solder paste (solder) is applied to the contact pads 12, 13, 14 and 15, after which the fragments 1 ₁ , 1 ₂ and 1 ₃ are pressed together and soldered (sintered), forming a multilayer printed circuit board 1 with internal cavities 16 and 17, in which the electrical elements 20 and 18 of the analogue 4 and digital 5 signal processing zones are located. In this case, the receiving antenna 21 and the radio elements 19 of the digital signal processing zone 5 are located on the outer sides of the multilayer printed circuit board 1.

The considered constructive solution of the SRNS signal receiver module, characterized by the location of a part of its electro-radio elements 20 and 18 in the internal cavities 16 and 17 of the multilayer printed circuit board 1, as well as the absence of electrical connectors, allows to obtain a compact SRNS signal receiver module with an integrated receiving antenna, requiring a smaller area. So, in the considered example, related to the prototype of the SRNS GLONASS / GPS signal receiver module of the frequency range F1 / L1, the dimensions of the SRNS signal receiver module (in plan) are (30 × 30) mm with a total height of about 13 mm.

To place the SRNS signal receiver module, a carrier printed circuit board is used (not shown in the figures), in which a window is made corresponding to the area occupied by the electronic components 19 of the digital signal processing zone 5, and along the perimeter of which are contact pads corresponding to the contact pads 53. The signal receiver module The SRNS is placed on a carrier printed circuit board above this window, while the radio-electronic elements 19 are located in this window, and the contact pads 53 are in contact with the contact pads of the carrier printed circuit boards located around the perimeter of the window. After that, the SRNS signal receiver module is soldered with its contact pads 53 to the contact pads of the carrier printed circuit board using surface mounting technology.

The operation of the receiver module signals SRNS is as follows.

The control signals from the external control device and the voltage of the external power supply from the external power supply are received from the PCB carrier to the SRNS signal receiver module through the corresponding contact pads 53.

From the external supply voltage, using the appropriate nodes of the digital and analog power supply voltage generators, the necessary intra-module voltages are formed, distributed in zone 5 of the digital signal processing using planes 46, 48 and section 45 of the digital power supply, and in zone 4 of the analog signal processing, using the corresponding printed analog power conductors. In this case, the ground plane 40 serves as a common conductor of power supply of the Earth potential for electronic components of zone 5 of digital signal processing, and the ground plane 35 as a common conductor of power supplies of the potential Earth for electrical components of zone 4 of analog signal processing.

From the receiving antenna 21 through the vertical pin probe 25 into the zone 4 of the analog signal processing, the SRNS signals received from the air, for example, the SRNS GLONASS and GPS signals of the frequency range F1 / L1 (1.55 ÷ 1.65 GHz), are received. In zone 4 of the analog signal processing, these signals are filtered out from interference, amplified and converted in frequency with a decrease in the carrier frequency to tens of megahertz, using the heterodyne signals generated in the same zone.

Next, the signals are transmitted to zone 5 of digital signal processing through the intermediate zone 6 through transit circuits, including the corresponding metallized holes 11 and associated pads 12, 13 and 14, 15. The intermediate zone 6 due to its shielding earth planes 7 and 8 provides on-board separation shielding between the zones of analog 4 and digital 5 signal processing, reducing to an acceptable level spurious interference and induced noise due to the mutual influence of the functional nodes of the zone 4 analog signal processing and zone 5 digital signal processing on each other.

In zone 5 of digital signal processing, analog-to-digital signal conversion, multi-channel correlation processing and subsequent processing in a digital processor are carried out, as a result of which output signals are generated that carry navigation information and / or exact time information. These signals are sent to the corresponding pads 53, and from them to the carrier circuit board for subsequent use by the consumer, for example, to visually display an individual GLONASS / GPS navigator on the display.

Thus, the above shows that the claimed invention is feasible and ensures the achievement of the technical result, which consists in creating the design of a compact module of the SRNS signal receiver with an integrated receiving antenna, requiring a reduced area for its placement, which makes it promising for use in small-sized navigation equipment, including including in individual GLONASS / GPS navigators.

Information sources

1. RU 2172080 C1, H05K 1/00, 1/11, 1/14, 3/46, publ. 08/10/2001.

2. RU 2188522 C1, H05K 1/14, H01P 11/00, publ. 08/27/2002.

3.RU 2192108 C1, H05K 1/00, 1/11, 1/14, 3/46, 9/00, publ. 27.10.2002.

4. RU 2194375 C1, H05K 1/00, 1/11, 1/14, 3/46, 9/00, publ. 12/10/2002.

5. RU 2199839 C1, H05K 1/00, 1/11, 1/14, 3/46, 9/00, publ. 02/27/2003.

6. RU 2173036 C1, H05K 1/00, 1/11, 1/14, 3/46, publ. 08/27/2001.

7. RU 2287917 C1, H05K 1/11, 3/46, 9/00, publ. 11/20/2006.

8. RU 2287918 C1, H05K 1/11, 3/46, 9/00, publ. 11/20/2006.

9. RU 2287919 C1, H05K 1/11, 3/46, 9/00, publ. 11/20/2006.

10. RU 2287920 C1, H05K 1/14, publ. 11/20/2006.

11. RU 2256936 C1, G01S 5/14, H04B 1/26, publ. 07/20/2005.

12. US 6480170 B1, H01Q 21/00, H01Q 1/38, publ. 11/12/2002.

13. US 7427957 B2, H01Q 1/38, publ. 09/23/2008.

14. US 5966096. H01R 1/38, publ. 10/12/1999.

15. Global satellite radio navigation system GLONASS // Pod. ed. V.N.Kharisova, A.I. Perov, V.A.Boldin. / 2nd ed. corrected / M .: IPRZhR, 1999, p. 266-268.

Claims (3)

1. The receiver module of the signals of satellite radio navigation systems, containing a multilayer printed circuit board with conductive and insulating layers and metallized holes, through which interlayer electrical connections are made, carrying printed conductors and radio electronic elements of an electrical circuit designed to receive and process signals from satellite radio navigation systems (SRNS), while the printed conductors and electro-radio elements related to the nodes of the analog signal processing are grouped in the zone of analog signal processing, occupying the group of upper conductive and insulating layers of the multilayer printed circuit board, the printed conductors and electro-radio elements related to the nodes of digital signal processing are grouped in the zone of digital signal processing, which occupies the group of lower conductive and insulating layers of the multilayer printed circuit board, and between the zones analog and digital signal processing is an intermediate zone with shielding earth planes, occupying a group of medium conductive and insulating layers in a multilayer printed circuit board, characterized in that the multilayer printed circuit board consists of three interconnected multilayer fragments - upper, middle and lower, interacting with each other by adjacent contact pads located at the edges of the respective conductive layers of adjacent fragments, the upper fragment includes a group of upper conductive and insulating layers of a multilayer printed circuit board related to the zone of analog signal processing, the lower fragment includes a group of lower their conductive and insulating layers of the multilayer printed circuit board related to the digital signal processing zone, and the middle fragment includes a group of middle conductive and insulating layers of the multilayer printed circuit board related to the intermediate zone, while the middle fragment has an H-shaped cross-sectional profile, forming internal cavities of a multilayer printed circuit board, in which the internal electro-radio elements of the zones of analog and digital signal processing are located, respectively installed in the lower internal m of the conductive layer of the zone of analog signal processing and the upper inner conductive layer of the zone of digital signal processing, while in the lower outer conductive layer of the zone of digital signal processing are located external electro-radio elements of this zone and contact pads located at the edges, which serve for external connections, and in the upper external conductive the ground plane is connected to the layer of the analog signal processing zone, to which the underlying surface of the receiving antenna is connected, separated by a dielectric from the resonance the receiving element of the receiving antenna connected by a vertical probe pin to the input strip line of the analog signal processing zone. 2. The module according to claim 1, characterized in that the input strip line of the zone of analog signal processing is made in the form of a printed conductor surrounded on the sides in its conductive layer, as well as above and below in adjacent conductive layers of the zone of analog signal processing by shielding it with earthen printed elements. 3. The module according to claim 1 or 2, characterized in that the vertical probe pin is sealed in a metallized hole connected to the printed conductor of the input strip line of the analog signal processing zone, said metallized hole being surrounded by shielding metallized holes connected to earthen printed elements in all conductive layers of the analog signal processing zone.

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