RU2287919C1 - Signal receiver module for satellite radio navigation systems - Google Patents

Abstract

FIELD: radio engineering.

SUBSTANCE: module contains multilayer electronic board with N conductive layers, carrying high frequency and low frequency connectors, and also imprinted conductors and electric radio-elements, grouped in zones of analog and digital signals processing, while first one of aforementioned zones occupies conductive layers from first to n-numbered, and second one is positioned below the first one and occupies conductive layers from (n+1)-numbered to N-numbered, where n ≥ 5, N-n ≥ 5. Inter-layer electric connections in each zone are realized by means of solid transition apertures, and inter-layer electric connections between zones are realized by means of through transition apertures. Each zone is surrounded along perimeter by screening imprinted conductors, positioned one below another in conductive layers from first to (n-1) in first zone and from (n+2) to N in second zone. In each zone screening imprinted conductors are connected by appropriate solid transition apertures to one another and to additional screening planes, positioned in n and (n+1) conductive layers. Also, additional screening planes are connected to one another and to ground planes of both zones by appropriate through transition aperture. Ground plane of zone for digital signals processing is electrically connected to "Ground" clamp of low frequency connector. "Power" clamp of low frequency connector through input power filter is electrically connected to input clamps of voltage generators of digital and analog power, output clamps of which are electrically connected to, respectively, digital power plane and common point of analog power conductors.

EFFECT: creation of one-board construction with positioning of zones for analog and digital signals processing one below the other on different sides of multi-layer electronic board and provision of in-board electromagnetic compatibility under said conditions.

2 cl, 16 dwg

Description

The invention relates to radio engineering and can be used in the construction of modules for signal receivers of satellite radio navigation systems (SRNS).

The SRNS signal receiver modules are used to process SRNS signals received from the receiving antenna (for example, GLONASS and GPS SRNS signals) in order to obtain navigation information and / or exact time information. In most cases, this processing consists of analog processing and digital processing. Analog processing includes filtering the received SRNS signals from interference, converting them in frequency with decreasing frequency, and analog-to-digital conversion, and digital processing includes processing in a digital correlator, processing in a digital processor, and processing in an interface converter. All these stages of the processing of SRNS signals are carried out using the corresponding analog and digital functional units, which are located on one or more printed circuit boards, usually multilayer.

In the case of placing analog and digital functional units on one printed circuit board, the problem arises of ensuring their electromagnetic compatibility, i.e. the problem of eliminating spurious interference and induced interference and eliminating the mutual influence of heterogeneous functional nodes on each other.

Single-board designs of SRNS signal receivers are known, in which the problem of ensuring electromagnetic compatibility of heterogeneous functional units that carry out analog and digital processing of SRNS signals is solved by grouping them according to the corresponding functional zones shielded using structural means of a multilayer printed circuit board.

For example, in the known single-board designs of SRNS signal receivers described in [1] - RU No. 2125775 (C1), H 05 K 1/00, 3/46, 01/27/1999, [2] - RU No. 2172080 (C1), H 05 K 1/00, 1/11, 1/14, 3/46, 08/10/2001, [3] - RU No. 2188522 (C1), H 05 K 1/14, Н 01 Р 11/00, 08/27/2002 , [4] - RU No. 2192108 (C1), H 05 K 1/00, 1/11, 1/14, 3/46, 9/00, 10.27.2002, [5] - RU No. 2194375 (C1), H 05 K 1/00, 1/11, 1/14, 3/46, 9/00, 12/10/2002, [6] - RU No. 2199839 (C1), H 05 K 1/00, 1/11, 1 / 14, 3/46, 9 / 00,27.02.2003, on-board shielding of the zones of analog and digital signal processing is carried out using planar screens - ground planes, made in the inner conductive layers of a multilayer printed circuit board and serving wires power sources of the Earth potential for the radio-electronic elements of the corresponding zones. On-board shielding with the help of such earthen planes allows to reduce the influence of spurious interference and induced noise created by elements belonging to different functional areas, and transmitted mainly through power circuits. Such on-board shielding gives the greatest effect in cases where the zones of analog and digital signal processing are located sequentially one after another on a multilayer printed circuit board (in accordance with the signal processing sequence) and are spaced as far as possible from each other.

In some cases, to increase the shielding effect, plane shielding, carried out using earthen planes, which serve as power conductors of the Earth potential for the radio elements of the corresponding zones, is supplemented by barrier shielding, for example, as in the well-known single-board design of the SRNS signal receiver module described in [7] - RU No. 2173036 (C1), H 05 K 1/00, 1/11, 1/14, 3/46, 08.28.2001, adopted as a prototype.

The SRNS signal receiver module, adopted as a prototype, contains a multilayer printed circuit board with N conductive layers, carrying printed conductors and electrical components of an electric circuit designed to receive and process SRNS signals, a high-frequency connector designed to supply SRNS signals from an external antenna to a multilayer printed circuit board devices, and a low-frequency connector, designed to supply control signals from an external control device and voltage to a multilayer printed circuit board yazheniya power from an external power source and discharge it from the processed signals representative of navigational information and / or information about the exact time. At the same time, printed conductors and radio-electronic elements are grouped according to the areas of analog and digital signal processing that are screened by means of planar and barrier screens.

The zone of analog signal processing in the prototype module consists of two sections - a section of frequency conversion of signals and a section of analog-to-digital conversion. The digital signal processing zone consists of three sections - the digital correlation signal processing section, the signal processing section in the digital processor and the interface conversion section. These zones and sections are arranged sequentially along the long side of the multilayer printed circuit board in accordance with the sequence of signal processing. In this case, the high-frequency and low-frequency connectors are located at opposite ends of the multilayer printed circuit board at the maximum distance from each other; radio elements of each of the zones of analog and digital signal processing are located on both sides of the multilayer printed circuit board; the boundary separating the zones of analog and digital signal processing lies in the cross-sectional plane of the multilayer printed circuit board, the electrical connections between the zones are made through conductive layers using connecting printed conductors crossing the specified border, and the electrical connections between the conductive layers are made through the zones through vias (metallized holes of interlayer connections).

The plane screens of the zones of analog and digital signal processing in the prototype module are formed by earthen planes that serve as power conductors of the Earth potential for the radio-electronic elements of the corresponding zones. Ground planes are located in one of the inner conductive layers of the multilayer printed circuit board and are interconnected by respective ground jumpers. In this case, the plane screen of the analog signal processing zone consists of two earthed planes interconnected by earth bridges - the earth plane of the signal frequency conversion section and the earth plane of the analog-to-digital conversion section, and the plane screen of the digital signal processing zone is formed by the common ground plane for all sections of this zone .

The barrier screen of the analog signal processing zone in the prototype module is formed by a system of shielded printed conductors located along the perimeter of the signal frequency conversion section, and the barrier screen of the digital signal processing zone is formed by a system of shielded printed conductors located at the boundary with the analog signal processing zone. In each of these barrier screens, the shielding printed conductors are located one below the other in the conductive layers of the multilayer printed circuit board that are free of ground planes, connected to each other and to the corresponding ground plane through vias and have gaps for passage through the barrier screens of the connecting printed conductors.

The power wiring in the prototype module is implemented as follows. The supply voltage from an external power source is supplied to the “Power” and “Earth” terminals of the low-frequency connector. From the Earth output of the low-frequency connector, the voltage potential of the Earth potential is supplied to the ground plane of the digital signal processing zone electrically connected to it, and from it to the ground planes of the analog-to-digital and frequency conversion signals of the analog signal processing zone connected by earth jumpers. From the output “Power” of the low-frequency connector, the voltage of the potential “Power” is first supplied to the input terminal of the input power filter, electrically connected to it, then from its output terminal it goes to the digital power plane, and from it, sequentially through the second and third power filters, to power conductors of sections of analog-to-digital and frequency signal conversion.

The processed SRNS signals in the prototype module pass in the direction opposite to the direction of power supply, namely, the path from the high-frequency connector through the sections of the frequency and analog-to-digital signal conversion to the digital signal processing zone, and from it to the low-frequency connector. During its processing, the SRNS signals are amplified, filtered from interference, converted in frequency with decreasing frequency, subjected to analog-to-digital conversion, processed in a digital correlator and digital processor, converted in an interface converter. At the same time, due to the indicated design measures (on-board shielding of zones using planar and barrier screens, the sequential arrangement of zones along the long side of a multilayer printed circuit board, spatial separation of high-frequency and low-frequency connectors, the use of filters in the power circuit) in the prototype module can be reduced to an acceptable level the mutual influence of heterogeneous functional units that carry out analog and digital signal processing in the corresponding zones, i.e. solve the problem of ensuring their internal electromagnetic compatibility.

The considered design of the prototype module is characterized by a sequential arrangement of analog and digital signal processing zones shielded with the help of planar and barrier screens along the long side of a multilayer printed circuit board and by two-way placement of radio-electronic elements in each of these zones. This design is most responsive to the use of element base low and medium integration levels, allowing you to realize the dense placement of a large number of discrete electrical components on both sides of a multilayer printed circuit board.

However, with an increase in the integration level of the used elemental base and a decrease in the total number of electro-radio elements in this regard, the considered design, which provides for the sequential arrangement of the zones of analog and digital signal processing with two-way placement of electro-radio elements within each of the zones, becomes suboptimal in terms of miniaturization of the structure.

One of the possible ways of miniaturizing the design of the SRNS signal receiver module using an element base of a higher level of integration is the one-sided placement of electrical radio elements within each of the zones of analog and digital signal processing, proposed at the same time, while simultaneously placing these zones under each other on different sides of a multilayer printed circuit board . In this case, however, the problem arises of ensuring the electromagnetic compatibility of these zones under new conditions, characterized by a significant increase in the area of their joint boundary, now determined by the area of the zones themselves, rather than the cross-sectional area of the multilayer printed circuit board, which takes place in the prototype module [7] and analogues [1] - [6].

The technical result, to which the claimed invention is directed, is to create a design of a single-board module of the SRNS signal receiver, which implements a new principle for the placement of analog and digital signal processing zones for such modules - not one after another along a multilayer printed circuit board, as is done in the module prototype and analogs, and under each other on opposite sides of a multilayer printed circuit board, and which provides on-board electromagnetic compatibility of analog and digital zones signal processing in the new environment, characterized by increasing the area of their common border, defined as above, an area of the zones themselves.

The invention consists in the following. The SRNS signal receiver module contains a multilayer printed circuit board with N conductive layers and vias, through which interlayer electrical connections are made, carrying printed conductors and electrical components of an electrical circuit designed to receive and process SRNS signals, a high-frequency connector designed to supply signals to the multilayer printed circuit board SRNS, and a low-frequency connector, designed to supply voltage to the multilayer printed circuit board and control incoming signals from it and discharging the processed signals. In this case, the printed conductors and radio-electronic elements are grouped according to the zones of analog and digital signal processing, shielded with the help of barrier and planar screens, moreover, the barrier screens are formed by the shielded printed conductors connected by the corresponding vias, made in the conductive layers under each other, and the planar screens are formed by earthen planes, serving power conductors of the Earth potential for radio-electronic elements of the corresponding zones. In this case, the ground plane of the digital signal processing zone is electrically connected to the ground terminal of the low-frequency connector, and the “Power” terminal of the low-frequency connector is electrically connected to the input terminal of the input power filter located in the digital signal processing zone. Unlike the prototype, the zone of analog signal processing occupies the conducting layers from the first to the n-th, and the zone of digital signal processing is located below the zone of the analog signal processing and occupies the conducting layers from the (n + 1) th to the N-th, where n≥5 , Nn> 5, moreover, interlayer electrical connections in each of these zones are carried out using blind vias, and interlayer electrical connections between these zones are carried out using vias. In this case, in the nth conductive layer, there is a first additional shielding plane connected by the corresponding blind vias with the shielding printed conductors of the barrier screen of the analog signal processing zone located along the perimeter of this zone in the conductive layers from the first to the (n-1) th, and in the (n + 1) th conductive layer, there is a second additional shielding plane connected by corresponding blind vias to the shielding printed conductors of the digital zone barrier screen new processing of signals located along the perimeter of this zone in the conducting layers from the (n + 2) th to the N th. In this case, the ground planes of the zones of analog and digital signal processing, located respectively in the i-th conductive layer between the first and n-th conductive layers and in the k-th conductive layer between the (n + 1) -th and N-th conductive layers, are connected with each other and with both additional shielding planes using the corresponding through vias. The output terminal of the input power filter is electrically connected to the input terminal of the digital power supply voltage generator located in the nth conductive layer in the digital signal processing zone, the output terminal of which is electrically connected to the digital power plane located in the mth conductive layer between (n + 1) th and Nth conductive layers, where m ≠ k. In addition, the output terminal of the input power filter is electrically connected to the input terminal of the analog power voltage conditioner located in the first conductive layer in the analog signal processing zone, the output terminal of which is electrically connected to the common point of the analog power conductors located in the jth conductive layer between the first and nth conducting layers, where j ≠ i.

In embodiments of practical importance, high-frequency and low-frequency connectors with planar leads intended for surface mounting are used as high-frequency and low-frequency connectors.

The invention and its feasibility are illustrated by the drawings presented in figures 1-16, illustrating an example of the implementation of the receiver module signals SRNS on a twelve-layer (N = 12) printed circuit board.

Figure 1 shows a sectional view of a twelve-layer printed circuit board (conditional arrangement of printed conductors and vias);

figure 2 is a fragment of the location of the electrical elements in the first conductive layer (view from the side of the elements of the first conductive layer, printed conductors are not conventionally shown);

figure 3 is a fragment of the location of the radio elements in the twelfth conductive layer (view from the side of the first layer, the layers are conditionally transparent, the printed conductors are not conventionally shown);

figure 4 is a fragment of the print pattern of the first conductive layer;

figure 5 is a fragment of the print pattern of the second conductive layer (view from the side of the first layer, the layers are conditionally transparent);

figure 6 is a fragment of the print pattern of the third conductive layer (view from the side of the first layer, the layers are conditionally transparent);

7 is a fragment of the print pattern of the fourth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig - a fragment of the print pattern of the fifth conductive layer (view from the side of the first layer, layers conditionally transparent);

figure 9 is a fragment of the print pattern of the sixth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

figure 10 is a fragment of the print pattern of the seventh conductive layer (view from the side of the first layer, layers conditionally transparent);

11 is a fragment of the print pattern of the eighth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig - a fragment of the print pattern of the ninth conductive layer (view from the side of the first layer, layers conditionally transparent);

in Fig.13 is a fragment of the print pattern of the tenth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig - a fragment of the print pattern of the eleventh conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig is a fragment of the print pattern of the twelfth conductive layer (view from the side of the first layer, the layers are conditionally transparent);

on Fig is a fragment of a functional diagram explaining the features of the power wiring.

The inventive signal receiver module SRNS (hereinafter module) contains a multilayer printed circuit board 1 with N conductive layers 2. In this example, a multilayer printed circuit board 1 has twelve (N = 12) conductive layers 2, namely the first conductive layer 2 ₁ , the second conductive layer 2 ₂ , the third conductive layer 2 ₃ , the fourth conductive layer 2 ₄ , the fifth conductive layer 2 ₅ , the sixth conductive layer 2 ₆ , the seventh conductive layer 2 ₇ , the eighth conductive layer 2 ₈ , the ninth conductive layer 2 ₉ , the tenth conductive layer 2 ₁₀ , eleventh conductive layer 2 ₁₁ and twelve second conductive layer _{12 February} (fig.1-15). The conductive layers 2 ₁ and 2 ₁₂ are external, and the conductive layers 2 ₂ ÷ 2 ₁₁ are internal; all conductive layers 2 (2 ₁ , 2 ₂ , 2 ₃ , 2 ₄ , 2 ₅ , 2 ₆ , 2 ₇ , 2 ₈ , 2 ₉ , 2 ₁₀ , 2 ₁₁ , 2 ₁₂ ) are separated from each other by the corresponding insulating layers 3 ( figure 1).

The multilayer printed circuit board 1 carries a high-frequency connector 4, a low-frequency connector 5, as well as printed conductors and electrical radio elements of an electrical circuit designed for receiving and processing SRNS signals, grouped by zones of analog 6 and digital 7 signal processing (Figs. 1-3). This electrical circuit can be performed, for example, as in the SRNS signal receiver, presented in [8] - RU No. 2178894 (C1), G 01 S 5/14, 09.25.2000.

The high-frequency connector 4 serves to connect a coaxial cable leading to the multilayer printed circuit board 1 signals SRNS coming from an external antenna device. In this example, the high-frequency connector 4 is located in the first conductive layer 2 ₁ on the edge of the zone 6 of the analog signal processing (figure 2). As a high-frequency connector 4, a high-frequency connector with planar leads intended for surface mounting can be used, for example, a socket of the type "UMP Н3 К107 303 040W" of the company "RADIALL".

The low-frequency connector 5 is used to connect a wire bundle supplying a voltage from an external power source and control signals from an external control device (control panel) to the multilayer printed circuit board 1 and outputting processed signals that carry navigation information and / or information about the exact time. In this example, the low-frequency connector 5 is located in the twelfth conductive layer 2 ₁₂ outside the zone 7 of the digital signal processing (figure 3). As a low-frequency connector 5, a low-frequency connector with planar leads intended for surface mounting can be used, for example, a socket of the type "MLE-125-01-G-DV-K" of the company "SAMTEC".

Zone 6 of the analog signal processing occupies the conducting layers from the first to the n-th, and zone 7 of the digital signal processing is located below the zone 6 of the analog signal processing and occupies the conducting layers from the (n + 1) th to the N-th, where n≥5, Nn≥5. In this example, corresponding to the case N = 12, n = 6, Nn = 6, zone 6 of the analog signal processing occupies the first six conductive layers 2 ₁ , 2 ₂ , 2 ₃ , 2 ₄ , 2 ₅ , 2 ₆ (Fig. 1, 2, 4-9), and zone 7 of digital signal processing occupies the remaining six conductive layers 2 ₇ , 2 ₈ , 2 ₉ , 2 ₁₀ , 2 ₁₁ , 2 ₁₂ (Figs. 1, 3, 10-15).

The interlayer electrical connections inside the zone 6 of the analog signal processing are carried out using blind vias 8, the interlayer electrical connections inside the zone 7 of digital signal processing are carried out using the blind vias 9, and the interlayer electrical connections between the zones of the analog 6 and digital 7 are processed using through vias 10. Examples of the implementation and placement of some of these vias are presented in figures 1, 4-15.

On-board shielding of the analog 6 and digital 7 signal processing zones is carried out using planar and barrier screens.

In zone 6 of the analog signal processing, a planar screen is formed by an earthen plane 11 located in the i-th conductive layer between the first and nth conductive layers, which serves as a power supply conductor of the Earth potential for radio-electronic elements of this zone. In this example, the ground plane 11 is located in the second (i = 2) conductive layer 2 ₂ (figure 5). With the ground plane 11 are connected (using the corresponding deaf vias 8) the ground leads of the electro-radio elements of zone 6 of the analog signal processing.

In zone 7 of the digital signal processing, a planar screen is formed located in the k-th conductive layer between the (n + 1) -th and N-th conductive layers earthen plane 12, which serves as a power supply conductor of the Earth potential for the radio-electronic elements of this zone. In this example, the ground plane 12 is located in the eleventh (k = 11) conductive layer 2 ₁₁ (Fig. 14). With the earthen plane 12 are connected (using the corresponding deaf vias 9) the earth terminals of the electronic components of zone 7 of the digital signal processing.

Earth planes 11 and 12 are connected to each other using a through-hole 10 _A (Figs. 4-15).

The barrier screen in zone 6 of the analog signal processing is formed by shielding printed conductors 13 made along the perimeter of this zone one above the other in the conducting layers from the first to the (n-1) th. In this example, this barrier screen is formed by shielding printed conductors 13 ₁ , 13 ₂ , 13 ₃ , 13 ₄ , 13 ₅ located respectively in the conductive layers 2 ₁ , 2 ₂ , 2 ₃ , 2 ₄ , 2 ₅ (Figs. 4-8 ) The shielding printed conductors 13 (13 ₁ , 13 ₂ , 13 ₃ , 13 ₄ , 13 ₅ ) are connected by the corresponding blind vias 8 to each other and to the first additional shielding plane 14 located in the nth conductive layer (in the sixth example in this example) conductive layer 2 ₆ , Fig.9). If necessary, in the shielded printed conductors 13, gaps are made for the printed conductors crossing the barrier screen formed by them. In this example, the gap is made in the shielding printed conductor 13 ₁ located in the first conductive layer 2 ₁ . Through this gap are printed conductors associated with a high-frequency connector 4 (Fig.2, 4). The remaining shielding printed conductors 13 ₂ ÷ 13 ₅ located in the conductive layers 2 ₂ ÷ 2 ₅ , in this example, are made without gaps (Fig.5-8).

The set of shielding printed conductors 13 (13 ₁ , 13 ₂ , 13 ₃ , 13 ₄ , 13 ₅ ) of the barrier screen of zone 6 of the analog signal processing and the first additional shielding plane 14, interconnected by respective blind vias 8, forms a multilayer printed circuit board in the body 1 is an electrically conductive frame of the first on-board surround screen, inside of which are located the radio-electronic elements, printed conductors and the earth plane 11 of zone 6 of the analog signal processing. In this on-board surround screen, the additional shielding plane 14, unlike the ground plane 11, does not carry the function of a power supply conductor of the “Earth” potential for the radio-electronic elements of zone 6 of the analog signal processing, the earth conclusions of the electric-radio elements of this zone are not connected to it.

The barrier screen in zone 7 of the digital signal processing is formed by shielding printed conductors 15 made along the perimeter of this zone one above the other in the conducting layers from the (n + 2) th to the N th. In this example, this barrier screen is formed by shielding printed conductors 15 ₈ , 15 ₉ , 15 ₁₀ , 15 ₁₁ , 15 ₁₂ , located respectively in the conductive layers 2 ₈ , 2 ₉ , 2 ₁₀ , 2 ₁₁ , 2 ₁₂ (11-15 ) The shielding printed conductors 15 (15 ₈ , 15 ₉ , 15 ₁₀ , 15 ₁₁ , 15 ₁₂ ) are connected by the corresponding blind vias 9 to each other and to the second additional shielding plane 16 located in the (n + 1) th conductive layer (in the considered example in the seventh conductive layer 2 ₇ , Fig. 10). If necessary, gaps are made in the shielded printed conductors 15 for printed conductors crossing the barrier screen formed by them. In this example, the gaps are made in the shielded printed conductors 15 ₈ ÷ 15 ₁₁ located in the conductive layers 2 ₈ ÷ 2 ₁₁ . Through these gaps pass printed conductors associated with the low-frequency connector 5 (figure 3, 11-14). The shielding printed conductor 15 ₁₂ located in the twelfth conductive layer 2 ₁₂ , in this example is made without breaks (Fig.15).

The set of shielding printed conductors 15 (15 ₈ , 15 ₉ , 15 ₁₀ , 15 ₁₁ , 15 ₁₂ ) of the barrier screen of the digital signal processing zone 7 and the second additional shielding plane 16 connected to each other by corresponding blind vias 9 forms in the body of the multilayer printed circuit board 1 is an electrically conductive frame of a second internal circuit board three-dimensional screen, inside of which are located the radio-electronic elements, printed conductors and the earth plane 12 of the zone 7 of digital signal processing. In this on-board surround screen, the additional shielding plane 16, unlike the ground plane 12, does not carry the function of a power supply conductor of the “Earth” potential for the radio-electronic elements of zone 7 of digital signal processing, and the earth conclusions of the electric-radio elements of this zone are not connected to it.

Additional shielding planes 14 and 16 are connected to each other and to the earthen planes 11 and 12 using a through-hole 10 _A (FIGS. 5, 9, 10, 14).

The shielded printed conductors 13 ₁ and 15 ₁₂ located in the first and twelfth conductive layers can be used, if necessary, to install external metal screens on them, intended for additional screening of the zones of analog 6 and digital 7 signal processing from the outside (in figure 1 -16 not shown). To ensure this, the width of the shielding printed conductors 13 ₁ and 15 ₁₂ is selected, for example, from 1.5 mm to 2.5 mm. In this case, blind vias 8 connecting the shielding printed conductors 13 with each other and with the first additional shielding plane 14, and blind vias 9 connecting the shielding printed conductors 15 with each other and with the second additional shielding plane 16 can be used as reference points for installing these external screens.

The power supply circuit in the zone of analog 6 and digital 7 signal processing in the inventive module is made as follows.

The findings of "Earth" and "Power" of the low-frequency connector 5, designed to connect an external power source, are connected in the twelfth conductive layer 2 _12, respectively, with the pads 17 "Earth" and 18 "Power" (Fig, 16).

The contact pad 17 "Earth", which serves as the point of supply of the potential "Earth" on a multilayer printed circuit board 1, is electrically connected to the ground plane 12 of the zone 7 of digital signal processing. In this example, this connection is made as follows: with the contact pad 17 "Earth" using blind vias 9 _A connected located under the low-frequency connector 5 in the eleventh conductive layer 2 ₁₁ ground section 19, which is connected to the ground plane 12 using the earth bridge 20 zone 7 of digital signal processing (Fig.14, 15, 16). In turn, as indicated above, the earth plane 12 of the digital signal processing zone 7 is connected via a through hole 10 _A to the earth plane 11 of the analog signal processing zone 6 (Fig. 5).

The contact pad 18 "Power", which acts as a supply point of the potential "Power" on the multilayer printed circuit board 1, is electrically connected to the input terminal of the input power filter 21, located in zone 7 of the digital signal processing in the twelfth conductive layer 2 ₁₂ (Fig.3, 16 ) In the present example, this connection is made via the deaf vias 9 _B 9 and _B and the printed conductors 22, located in the eighth conductive layer _{8 February} (11, 15, 16).

The input power filter 21, which implements, for example, the function of a low-pass filter, serves to suppress high-frequency components in the input supply voltage coming from an external power source. As the input power filter 21 can be used, for example, a filter type "NFM 4516 P 13 C 204 F" company "MURATA", designed for surface mounting.

The output terminal of the input power filter 21 is electrically connected to the input terminal of the digital power voltage driver 23 located in the digital signal processing zone 7 in the twelfth conductive layer 2 ₁₂ (FIGS. 3, 16). In this example, this connection is made using the printed conductor 24 located in the twelfth conductive layer 2 ₁₂ (Fig.15, 16).

In addition, the output terminal of the input power filter 21 is electrically connected to the input terminal of the analog power supply voltage driver 25 located in the analog signal processing zone 6 in the first conductive layer 2 ₁ (FIGS. 2, 16). In this example, this connection is made using a through-hole 10 _B and located in the first conductive layer 2 _{1 of the} printed conductor 26 connected to the input terminal of the shaper 25 voltage analog power (2, 4-16).

Shapers 23 and 25 of the voltage of digital and analog power supply function as secondary power sources, forming at their outputs stabilized voltages of a certain level, necessary to power the active elements of the respective zones. As shapers 23 and 25 of the voltage of digital and analog power can be used, for example, stabilized DC-DC converters of the type "ADP3333ARM-3.15 RM-8" company "Analog Devices" or the like.

The output terminal of the digital power voltage generator 23 is electrically connected to the digital power plane 27 located in the mth conductive layer between the (n + 1) th and Nth conductive layers, where m ≠ k. In this example, corresponding to the case N = 12, n = 6, i = 2, k = 11, the digital power plane 27 is located in the eighth (m = 8) conducting layer 2 ₈ (Fig. 11), and its indicated electrical connection with the output terminal of the driver 23 of the digital power voltage is carried out using a blind vias 9 g (Fig.10-16). With the digital power plane 27, the power terminals of the respective electronic components of zone 7 of the digital signal processing are electrically connected.

The output terminal of the analog power voltage generator 25 is electrically connected to a common point 28 of the analog power conductors 29 located in the jth conductive layer between the first and nth conductive layers, where j ≠ i. In this example, the analog power conductors 29 are located in the fifth (j = 5) conductive layer 2 ₅ (Fig. 8), and the indicated electrical connection of their common point 28 with the output terminal of the analog power voltage shaper 25 is carried out using a blind transition hole 8 _A ( 4-8, 16). The conductors 29 of the analog power supply are electrically connected to the power terminals of the corresponding electro-radio elements of zone 6 of the analog signal processing.

Practical implementations of the claimed module, which are prototypes of the SRNS GLONASS / GPS signal receiver modules of the frequency range F1 / L1, are characterized by the following design parameters: dimensions of the twelve-layer printed circuit board 1 are approximately 50 × 50 × 2.5 mm; the thickness of the central insulating layer 3 between the conductive layers 2 ₆ and 2 ₇ is approximately 0.37 mm, and the remaining insulating layers 3 are approximately 0.19 mm; the width of the shielded printed conductors 13 and 15 is at least 1.5 mm; the distance between the shielding printed conductors 13 and 15 and the nearest printing elements in the respective conductive layers is at least 0.5 mm.

The operation of the claimed module is as follows.

Through the high-frequency connector 4 on the multilayer printed circuit board 1 from the external antenna device receives signals SRNS, for example, SRNS GLONASS and GPS signals in the frequency range of 1.2-1.7 GHz. Through the low-frequency connector 5, the control signals necessary for the module to operate from the external control device and the supply voltage from the external power source are supplied to the multilayer printed circuit board 1. Through the same low-frequency connector 5, the processed signals are carried that carry navigation information and / or exact time information for the consumer.

The supply voltage from an external power source - the input supply voltage - is supplied to the contact pads 17 "Earth" and 18 "Power".

From the contact pad 18 "Power", the input power voltage of the potential "Power" passes through the input power filter 21 to the input of the digital power voltage driver 23, and also to the input of the analog power voltage driver 25. The input power filter 21 attenuates the high-frequency components of the input supply voltage, and the drivers 23 and 25 form from the filtered input supply voltage the stabilized voltages of the required levels for powering the radio-electronic elements of the digital 7 and analog 6 signal processing zones.

From the output of the former 23, the voltage of the digital power is supplied to the plane 27 of the digital power, and from it to the power leads of the corresponding electro-radio elements of zone 7 of the digital signal processing.

From the output of the driver 25, the voltage of the analog power is supplied to a common point 28 of the conductors 29 of the analog power, and from them to the power leads of the corresponding radio-electronic elements of zone 6 of the analog signal processing.

The supply voltage of the Earth potential comes from the ground pad 17 first to the earth plane 12, which serves as the power supply conductor of the Earth potential for the electronic components of zone 7 of the digital signal processing, and from it through the through hole 10 _A to the earth plane 11 serving as a power conductor of the Earth potential for the radio-electronic elements of zone 6 of analog signal processing.

In zone 6 of the analog signal processing, the SRNS signals are amplified, filtered from interference, frequency conversion with a decrease in the carrier frequency to tens of megahertz, as well as analog-to-digital conversion, using heterodyne and clock signals generated in the same zone. The SRNS signals converted in zone 6 of the analog signal processing together with the clock signals are transmitted to the digital signal processing zone 7 through the corresponding through vias 10 intersecting the ground planes 11 and 12, additional shielding planes 14 and 16 and the digital power plane 27 through the windows made in them deprived of metallization. In zone 7 of digital signal processing, SRNS signals are subjected to multichannel correlation processing, processing in a digital processor, and then conversion in the interface converter, using clock signals generated in zone 6 of analog signal processing. Processed in this way, the signals carrying navigation information and / or information about the exact time are supplied to the corresponding terminals of the low-frequency connector 5, from where they are removed by the consumer.

The considered signal processing of the SRNS is carried out in the inventive module in the conditions when the analogue 6 and digital 7 signal processing zones are located under each other on different sides of the multilayer printed circuit board 1 and the area of their joint border is determined by the area of the zones themselves (in contrast to the prototype and analogues, where the area the boundaries between similar zones is determined by the cross-sectional area of a multilayer printed circuit board). Despite such an unfavorable (from the point of view of electromagnetic compatibility) arrangement of the zones of analog 6 and digital 7 signal processing in the claimed module, due to the combination of the above-considered design measures for on-board shielding and power wiring, it is possible to reduce to an acceptable level the mutual negative influence of the electrical radio elements of these zones (i.e. e. reduce the level of mutual interference and induced interference) and thereby ensure the possibility of obtaining undistorted navigation information and / or information about the accuracy ohm time.

The above shows that the claimed invention is feasible and ensures the achievement of the required technical result, which consists in creating the design of a single-board module of the SRNS signal receiver with the placement of the zones of analog and digital signal processing under each other on different sides of the multilayer printed circuit board and providing in these conditions their internal electromagnetic compatibility.

Information sources

1. RU No. 2125775 (C1), H 05 K 1/00, 3/46, publ. 27.01.1999.

2. RU No. 2172080 (C1), H 05 K 1/00, 1/11, 1/14, 3/46, publ. 10.08.2001.

3. RU No. 2188522 (C1), H 05 K 1/14, H 01 P 11/00, publ. 27.08.2002.

4. RU No. 2192108 (C1), H 05 K 1/00, 1/11, 1/14, 3/46, 9/00, publ. 27.10.2002.

5. RU No. 2194375 (C1), H 05 K 1/00, 1/11, 1/14, 3/46, 9/00, publ. 10.12.2002.

6. RU No. 2199839 (C1), H 05 K 1/00, 1/11, 1/14, 3/46, 9/00, publ. 02.27.2003.

7. RU No. 2173036 (C1), H 05 K 1/00, 1/11, 1/14, 3/46, publ. 27.08.2001.

8. RU No. 2178894 (C1), G 01 S 5/14, publ. 09/25/2000.

Claims (2)

1. The receiver module of the signals of satellite radio navigation systems, containing a multilayer printed circuit board with N conductive layers and vias, through which interlayer electrical connections are made, carrying printed conductors and radio electronic elements of an electrical circuit designed to receive and process signals from satellite radio navigation systems (SRNS), high-frequency a connector for supplying SRNS signals to a multilayer printed circuit board, and a low-frequency connector for started for supplying the supply voltage and control signals to the multilayer printed circuit board and for removing processed signals from it, while the printed conductors and radio-electronic elements are grouped into zones of analog and digital signal processing, shielded with the help of barrier and planar screens, and the barrier screens are formed by connected corresponding vias shielding printed conductors made in conductive layers under each other, and planar screens formed by earthen planes serving as power conductors of the Earth potential for the radio elements of the respective zones, while the earth plane of the digital signal processing zone is electrically connected to the Earth terminal of the low-frequency connector, and the power terminal of the low-frequency connector is electrically connected to the input terminal of the input power filter located in the zone digital signal processing, characterized in that the zone of analog signal processing occupies the conductive layers from the first to the n-th, and the zone of digital signal processing has It is located under the zone of analog signal processing and occupies the conducting layers from the (n + 1) th to the Nth, where n≥5, Nn≥5, and the interlayer electrical connections in each of these zones are made using blind vias, and the interlayer electrical connections between these zones are made through through vias, while in the nth conductive layer there is a first additional shielding plane connected by corresponding blind vias with shielding printed conductors of the barrier screen on the zones of analog signal processing located along the perimeter of this zone in the conductive layers from the first to the (n-1) th, and in the (n + 1) th conductive layer there is a second additional shielding plane connected by corresponding blind vias to the shielding printed the conductors of the barrier screen of the digital signal processing zone located along the perimeter of this zone in the conducting layers from the (n + 2) th to the Nth, while the earth planes of the zones of analog and digital signal processing, located, respectively, in the ith the conductive layer between the first and nth conductive layers and in the kth conductive layer between the (n + 1) th and Nth conductive layers are connected to each other and to both additional shielding planes using the corresponding through vias, the output the output of the input power filter is electrically connected to the input terminal of the digital power supply voltage generator located in the Nth conducting layer in the digital signal processing zone, the output terminal of which is electrically connected to the digital power plane located in the m-th conductive layer between the (n + 1) -th and N-th conductive layers, where m ≠ k, and, in addition, the output terminal of the input power filter is electrically connected to the input terminal located in the first conductive layer in the analog processing zone signals of the analog power voltage conditioner, the output terminal of which is electrically connected to the common point of the analog power conductors located in the jth conductive layer between the first and nth conductive layers, where j ≠ i. 2. The module according to claim 1, characterized in that the high-frequency and low-frequency connectors with planar leads intended for surface mounting are used as high-frequency and low-frequency connectors.

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