RU2326148C1 - Method of obtaining foam compound - Google Patents

Abstract

FIELD: chemistry.

SUBSTANCE: invention pertains to the method of obtaining a foam compound, used as sealing material for radio engineering products, which operate in shock and vibration load conditions. The method lies in that, the following components with the given percentage mass ratios are put in the mixing volume in turns: 75-85 epoxy-diane resin ED-20, 19-21 titanium-silicone-organic olygomer product, a mixture of triglycidyl ethers of polyoxypropylene triol - 43-49 laproxide 703 and 10-12 laproxide 301, 1.5-1.7 foam regulator Penta-483, 30-34 low-molecular polyamide resin "ПО"-300, 30-34 diethylene diamino metylphenol "АФ-2", 15-17 polyhydroxyloxane liquid 136-41, 1.5-1.7 catalyst K-1 mark A. The components are then mixed mechanically at 25±10°C for a period of 1-1.5 minutes at a rate of 700-900 rpm. The mixture is hardened initially at 25±10°C for not less than 24 hours, and then later at 180±10°C for a period of 1-1.5 hours.

EFFECT: lower density and dielectric coefficient of the foam compound; increased plastic deformation stress; provision for homogeneity and stability of the structure with simultaneous action of high temperature and vibration loads.

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Description

The invention relates to the field of production of polymer compositions for epoxy foam compounds used as a sealing material for products for radio engineering, working under shock and vibration loads.

A known method of producing a polymer composition for foam [A.S. 355198, publ. 10.16.72 g.], Containing, parts by weight:

Epoxy Dianne Resin  one hundred Surface-active substance  0.1-5 Freon  3-15 Iso- or diisocyanate  2-17 Hardener  12-20

The production method is based on heating the epoxy resin to 60-70 ° C, introducing into it a surfactant under pressure - freon. The components are mixed for 10-20 minutes and a hardener is added to the resulting mixture. The mixing time of the mixture and hardener is fractions of a second. Next, pour it into the mold, and curing is carried out stepwise at 80-150 ° C for 3-4 hours.

However, this foam has a high dielectric constant and low heat resistance, which does not allow its use in radio devices at significant temperatures.

A known composition for the foam compound [RU 2224001 C1 p. 2, publ. 02/20/04], including an epoxy compound, polyamine, polyhydrosiloxane, foam regulator, low molecular weight polyamide resin in the following ratios of components, parts by weight:

Epoxy Dianova Resin  75-85 Polyoxypropylene triol triglycidyl ether  24-14 Ethylenediaminomethylphenol  8-12 Aliphatic amines  4-6 Low molecular weight polyamide resin  18-24 Foam regulator  1-1.5 Polyhydrosiloxane  1.5-2.5

The method of preparation consists in mixing weighed portions of resins of the type ED-20, Laproxide 703, a foam regulator, weighed portions of hardeners M-4, 602, AF-2, PO-300, mixed, added the product 136-41. The composition is thoroughly mixed, poured into molds and utverjdayut at 20-25 ° C for 48 hours.

However, this composition, prepared according to the above method, has a high density (0.4-0.5 g / cm ³ ), high dielectric constant (1.9 ± 0.2), insufficient strength (plastic strain ≤1 N / cm ² ), the violation of the structure and shape under the simultaneous influence of a temperature of 180 ° C and vibration loads of up to 10 g and therefore cannot be used in antenna devices on board aircraft.

The technical result of the invention is to reduce the density, dielectric constant of the foam compound, increase the stress of plastic deformation, ensure the stability of the structure and shape while being exposed to elevated temperature and vibration loads.

The essence of the invention consists in mixing the components and curing the composition.

New in the proposed method for producing the foam compound is the sequential introduction into the tank for mixing the following composition, parts by weight:

Epoxy Dianovy resin ED-20  75-85 Organosilicon oligomer product TMFT  19-21 Polyoxypropylene triol triglycidyl ethers Laproxide 703  43-49 Laproxid 301  10-12 Penta-483 foam regulator  1.5-1.7 Low molecular weight polyamide resin PO-300  30-34 Ethylenediaminomethylphenol AF-20  30-34 Polyhydrosiloxane Liquid 136-41  15-17 Catalyst K-1 Grade A  1.5-1.7

then, all components are mechanically mixed simultaneously at a temperature of 25 ± 10 ° С for 1-1.5 min at a speed of 700-900 rpm and curing at first at 25 ± 10 ° С for at least 24 hours, then at 180 ± 10 ° C for 1-1.5 hours.

To obtain a foam compound according to the claimed method, 80 g of ED-20 epoxy diane resin, 20 g of organotitanium titanosilicon oligomer, 46 g of polyoxypropylene triol Laproxide-703 triglycidyl ether, polyoxypropylene trihydroxyol-3013, 1,1 g triglycidyl ether polyoxypropylene, 1,3 g of polyoxypropylene are introduced alternately into the mixing tank Penta-483 foam regulator, 32 g of low molecular weight resin PO-300, 32 g of ethylene diaminomethylphenol AF-2, 16 g of polyhydrosiloxane liquid 136-41, 1.6 g of catalyst K-1 grade A. Then we mix all the components mechanically at a speed Aturi 30 ° C for 1m 15 seconds at a speed of 700 rev / min, pour into a mold and cured at a temperature of 25 ° C for at least 25 hours, then at 180 ° C for 1 h 20 min.

The specified method of producing the foam compound provides a homogeneous and stable structure of low density, reducing dielectric constant and high resistance to mechanical stress.

The table shows the properties of the foam compound obtained by the claimed method and patent 2224001.

No. p / p Indicators According to patent 2224001 According to the claimed method one Density, g / cm ³ 0.4-0.5 0.13-0.15 2 Dielectric constant at 20 ° С at a frequency of 10 ⁶ Hz 1.9 ± 0.2 Not> 1.1 3 Plastic strain stresses, N / cm ² ≤1 ≥5 four Change in structure and shape with simultaneous exposure to temperatures of 180 ° C and vibration loads up to 10 g Violation of structure and form Does not change

As can be seen from the table, the claimed method of producing the foam compound provides:

- decrease in density (0.13-0.15 g / cm ³ against 0.4-0.5 g / cm ³ );

- decrease in dielectric constant (not more than 1.1 against 1.9 ± 0.2);

- increased plastic deformation (≥5 N / cm ² versus ≤1 N / cm ² );

- the stability of the structure and shape under the simultaneous influence of a temperature of 180 ° C and vibration loads up to 10 g.

Claims (1)

A method of producing a foam compound based on mixing its components and curing, characterized in that they produce alternately the following composition into the mixing tank, wt.h .: Epoxy Dianovy resin ED-20 75-85 Organosilicon oligomer product TMFT 19-21 Polyoxypropylene triol triglycidyl ethers Laproxide 703 43-49 Laproxid 301 10-12 Penta-483 foam regulator 1.5-1.7 Low molecular weight polyamide resin PO-300 30-34 Ethylenediaminomethylphenol AF-2 30-34 Polyhydrosiloxane Liquid 136-41 15-17 Catalyst K-1 Grade A 1.5-1.7 then, all components are mechanically mixed simultaneously at a temperature of 25 ± 10 ° C for 1-1.5 min at a speed of 700-900 rpm and cured at first at 25 ± 10 ° C for at least 24 hours, then at 180 ± 10 ° C for 1-1.5 hours