RU2140335C1 - Производство частиц и изделий с запроектированными свойствами - Google Patents

Производство частиц и изделий с запроектированными свойствами Download PDF

Info

Publication number
RU2140335C1
RU2140335C1 RU98103729A RU98103729A RU2140335C1 RU 2140335 C1 RU2140335 C1 RU 2140335C1 RU 98103729 A RU98103729 A RU 98103729A RU 98103729 A RU98103729 A RU 98103729A RU 2140335 C1 RU2140335 C1 RU 2140335C1
Authority
RU
Russia
Prior art keywords
particles
copper
coated
thermal conductivity
coating
Prior art date
Application number
RU98103729A
Other languages
English (en)
Russian (ru)
Inventor
Алан Ф. Бин
Гленн Л. Бин
Original Assignee
Материэлз Инновэйшн, Инк.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Материэлз Инновэйшн, Инк. filed Critical Материэлз Инновэйшн, Инк.
Priority claimed from PCT/US1995/009572 external-priority patent/WO1997004884A1/en
Application granted granted Critical
Publication of RU2140335C1 publication Critical patent/RU2140335C1/ru

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
    • B01J2/006—Coating of the granules without description of the process or the device by which the granules are obtained
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Wood Science & Technology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Glanulating (AREA)
  • Medicinal Preparation (AREA)
  • Paints Or Removers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
RU98103729A 1995-07-27 1995-07-27 Производство частиц и изделий с запроектированными свойствами RU2140335C1 (ru)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1995/009572 WO1997004884A1 (en) 1994-11-14 1995-07-27 Manufacturing particles and articles having engineered properties

Publications (1)

Publication Number Publication Date
RU2140335C1 true RU2140335C1 (ru) 1999-10-27

Family

ID=22249548

Family Applications (1)

Application Number Title Priority Date Filing Date
RU98103729A RU2140335C1 (ru) 1995-07-27 1995-07-27 Производство частиц и изделий с запроектированными свойствами

Country Status (6)

Country Link
KR (1) KR100289248B1 (es)
AU (1) AU715872B2 (es)
BR (1) BR9510637A (es)
MX (1) MX9710484A (es)
RU (1) RU2140335C1 (es)
UA (1) UA34504C2 (es)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2527458C1 (ru) * 2012-12-13 2014-08-27 Открытое акционерное общество "Государственный оптический институт им. С.И. Вавилова" Способ нанесения электропроводящего покрытия светозащитной бленды
RU2526683C2 (ru) * 2009-06-26 2014-08-27 ТАЙКО ЭЛЕКТРОНИКС Ю-КЕЙ ЛТД, Великобритания Высокоэффективная, высокотемпературная легкая пленка, лента или кожух для изоляции проводов

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT7522U1 (de) * 2004-04-29 2005-04-25 Plansee Ag Wärmesenke aus borhaltigem diamant-kupfer-verbundwerkstoff

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Новые материалы в технике / Под ред.Е.В.Тростянской и др. - М.: Химия, 1964, с.532 - 644. *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2526683C2 (ru) * 2009-06-26 2014-08-27 ТАЙКО ЭЛЕКТРОНИКС Ю-КЕЙ ЛТД, Великобритания Высокоэффективная, высокотемпературная легкая пленка, лента или кожух для изоляции проводов
RU2527458C1 (ru) * 2012-12-13 2014-08-27 Открытое акционерное общество "Государственный оптический институт им. С.И. Вавилова" Способ нанесения электропроводящего покрытия светозащитной бленды

Also Published As

Publication number Publication date
MX9710484A (es) 1998-03-29
UA34504C2 (uk) 2001-03-15
KR19990036099A (ko) 1999-05-25
BR9510637A (pt) 1999-05-11
AU715872B2 (en) 2000-02-10
KR100289248B1 (ko) 2001-05-02
AU5414196A (en) 1997-02-26

Similar Documents

Publication Publication Date Title
US6162497A (en) Manufacturing particles and articles having engineered properties
US5453293A (en) Methods of manufacturing coated particles having desired values of intrinsic properties and methods of applying the coated particles to objects
US5698081A (en) Coating particles in a centrifugal bed
US6264882B1 (en) Process for fabricating composite material having high thermal conductivity
US5043535A (en) Hermetic cerglass and cermet electronic packages
US20120003465A1 (en) Sintering material, sintered bond and method for producing a sintered bond
US5188985A (en) Surface mount device with high thermal conductivity
KR20010079642A (ko) 복합 재료 및 그를 이용한 반도체 장치
EP0577731A4 (es)
Liu et al. Modified Ni/Pd/Au-finished DBA substrate for deformation-resistant Ag–Au joint during long-term thermal shock test
US11876030B2 (en) Clad material and method for producing same
EP0977260B1 (en) Semiconductor-supporting devices, processes for the production of the same, joined bodies and processes for the production of the same
RU2140335C1 (ru) Производство частиц и изделий с запроектированными свойствами
JPH06268117A (ja) 半導体装置用放熱基板およびその製造方法
AU732924B2 (en) Manufacturing particles and articles having engineered properties
AU731877B2 (en) Manufacturing particles and articles having engineered properties
AU741059B2 (en) Manufacturing particles and articles having engineered properties
CA2228009A1 (en) Manufacturing particles and articles having engineered properties
KR101063576B1 (ko) 다이아몬드 복합 방열기판 및 그 제조방법
JPH11510561A (ja) 工学的に処理された特性を有する粒子および物品の製造方法
JP2000154081A (ja) セラミックス部品およびその製造方法
CZ1898A3 (cs) Způsob zhotovení částic o požadované celkové vlastnosti, částice zhotovené tímto způsobem a výrobek zhotovený z těchto částic
RU198076U1 (ru) Теплоотвод из композита алюминий-карбид кремния
RO117240B1 (ro) Procedeu de producere de particule si articole cu proprietati fizice proiectate si de acoperire a unui obiect, particule si articole rezultate
JP2820566B2 (ja) 半導体パッケージ用放熱部材の製造方法