RU2030023C1 - Semiconductor converter - Google Patents

Abstract

FIELD: semiconductor devices. SUBSTANCE: semiconductor converter has cooler, semiconductor instruments mounted on it, power supply and control units and output panel. Cooler is manufactured in the form of unit of heat sinks and insulators closed over perimeter to form case of converter to which butts covers are attached to provide for sealing of case. Semiconductor instruments are put on inner surface of heat sinks and have thermal or electric and thermal contact with them. Arrangement of heat sinks and insulators depends on functional diagram of converter. Such design of converter due to combination of unified insulation elements and heat sinks enables power modules to be connected in rigid structure in the form of unit by means of connecting elements for all possible versions of different circuits and simultaneously problem of manufacture of small-dimension converter with high convective heat transfer to be solved. EFFECT: reduced dimensions of converter, effective convective heat transfer. 3 cl, 7 dwg

Description

 The invention relates to semiconductor converting technology and can be used in devices for various purposes, for example, to power electric drives in various sectors of the economy.

 Known thyristor converter mainly with natural air cooling [1], comprising a housing, coolers included in an antiparallel bridge circuit, tablet thyristors installed between coolers and located on the same axis passing through the center of their circular symmetry, power and control units and an output panel, the cathode of one and the anode of the other thyristor connected to the input terminal are in thermal contact with each other, and the anode and cathode of the indicated thyristor connected to the output terminal are in thermal contact each with a separate cooler.

 The disadvantage of this converter is the low cooling efficiency due to the presence of shielding elements (fasteners, thyristor blocks).

 The cooling efficiency is improved in a semiconductor reversing converter with a natural air cooling system [2], which is the closest in technical essence to the proposed invention. The converter comprises a housing with perforations in its walls, group coolers with cooling fins installed in it along the airflow direction, connected to current-carrying buses, semiconductor elements with individual coolers with cooling fins, placed on each of the group coolers and forming the anode and cathode groups of the opposite parallel-connected electric bridges, fuses located between the group coolers, power and control units and the output panel. The end ends of the cooling fins of group and individual coolers are located in planes parallel to the corresponding walls with perforation.

 The cooling efficiency of this converter is also not high enough, since the vertical arrangement of semiconductor elements (thyristors) does not allow efficient cooling of the upper semiconductor elements, which reduces the reliability of the entire unit.

 The common disadvantages of these converters are as follows: large dimensions and weight due to the presence of a supporting body, long communication lines and a large number of fasteners; the complexity of the Assembly of the Converter in the formation of various options for power single or complete power circuits associated with the joint solution of the problems of electrical isolation and cooling efficiency of semiconductor elements; design complexity associated with the presence of numerous fasteners and a bearing housing; the inability to use the converter for operation in aggressive, difficult and dusty atmospheric conditions.

 The invention is aimed at creating a small-sized transducer with high cooling efficiency, at the same time solving the problem of simplifying the assembly of the converter with all possible options for various circuits (power and control circuits) and protecting semiconductor devices in aggressive, humid and dusty atmospheric conditions.

 The essence of the invention lies in the fact that in the known semiconductor converter containing a cooler, semiconductor devices mounted on a cooler, power supply and control units and an output panel, the cooler is made in the form of a block of radiators and insulators, closed around the perimeter and forming a converter housing, to the ends of which lids are attached, and semiconductor devices are installed on the inner surface of the radiators and have thermal or electrical and thermal contact with them.

 One or more semiconductor devices in this converter may have thermal or electrical contact with two radiators.

 In addition, in a semiconductor converter, power and control units can be installed at one end of the cooler case, and an output panel can be installed on the other.

 This embodiment of the device due to the combination of unified insulating elements and radiators allows connecting power modules in a rigid structure in the form of a block with all possible variants of various circuits (power and control circuits) and simultaneously solving the problem of creating a small-sized converter with efficient heat transfer.

 In FIG. 1 shows a semiconductor converter, general view; in FIG. 2 - design of a reversible power unit; in FIG. 3 - design of a non-reversible power unit; in FIG. 4 - power unit design with on-parallel switching of thyristors; in FIG. 5 is a circuit diagram of a reversing converter; in FIG. 6 is a circuit diagram of a non-reversible converter; in FIG. 7 is a circuit diagram of a converter with on-parallel switching of thyristors.

 The semiconductor converter comprises a cooler 1, semiconductor devices 2 mounted on a cooler, a box 3 with power and control units, a box 4 with an output panel and a protective casing 5.

 The cooler 1 is made in the form of a block of radiators 6 and insulators 7 and 8, closed around the perimeter. The block of radiators and insulating elements forms the housing of the converter, to the ends of which are attached the covers 9, which ensure the tightness of the housing. On the inner surface of the radiators in thermal or electrical and thermal contact with them are semiconductor devices 2 connected to current-carrying buses 10.

 One or more semiconductor devices can have thermal and electrical contact with two radiators.

 The layout of radiators and insulators depends on the functional diagram of the converter (Fig. 2-4).

 Radiators and insulators are interconnected by pins 11 and tightened by nuts 12. On pins isolated from radiators 6, covers 9 and boxes 3 and 4 are installed through insulators 8 with power supply, control units and an output panel.

 The covers 9 also serve as a support for the converter. The casing 5 of the Converter is designed for electrical safety and can be performed, for example, in the form of a grid. The material of the insulators can be phenolic, textolite, heat-resistant rubber or electrochemical coating on radiators. As a material for radiators, for example, duralumin can serve. In the embodiment of the reversible converter (Fig. 2), the cooler 1 is made of five frames a, b, c, d, e, consisting of four radiators 6, and one frame f, consisting of two radiators 6 and two insulators 7. On the basis of a and e three thyristors are installed, on frames b, c and d - two each. The anode and cathode groups of thyristors are mounted directly on radiators. The radiators of the frame f serve to cool the cathode group of thyristors (Fig. 5).

 In an embodiment of a non-reversible converter (Fig. 3), the cooler is made of one frame K, consisting of four radiators 6, and two frames L, M, consisting of two radiators and two insulators each. One radiator frame M serves to cool the cathode group. Frame K contains three thyristors, two radiators of the frame L and one radiator of the frame M each have one thyristor (Fig. 6).

 In the variant with on-parallel switching of thyristors (Fig. 4), the cooler is made of three frames, consisting of two radiators and two insulators. Thyristors are located on radiators in accordance with FIG. 7.

 Assembly of the semiconductor Converter is as follows.

 Four studs 11 through insulating sleeves are fitted with frames representing a combination of radiators and insulators. From both ends on the studs are installed covers 9.

 If necessary, frames and covers are installed on the sealant. Next, a box 3 with power and control units and a box 4 with an output panel are installed on the studs through connectors.

 When you turn on the semiconductor converter in accordance with the electrical circuits (Fig. 5, 6 and 7), depending on the given mode, the groups of semiconductor elements are heated and give off heat, on the one hand, to individual coolers b, c, d, f (Fig. 2), L, M (Fig. 3), and on the other hand, group coolers a, e (Fig. 2) and K (Fig. 3). Since the inclusion of a group of thyristor elements occurs alternately, heat transfer by group coolers also occurs alternately. Thus, the surface of the heat sink of the working elements increases. The horizontal arrangement of thyristors relative to each other with cooling of the cathode and anode groups through radiators provides the same conditions for the effective cooling of each thyristor.

 The present invention allows to create a small-sized converter with efficient cooling during the formation of all possible variants of various circuits (control circuits and power circuits with the ability to control drives both direct current and alternating) with different designs of semiconductor devices, such as tablet or pin thyristors, and also transistors. The tightness of the converter housing allows its use in aggressive, humid and dustproof environments. The use of standardized prefabricated elements, the absence of a bearing housing, the reduction of communication lines, the reduction of fasteners significantly reduce the weight and dimensions of the converter, make it possible to simplify known designs, and reduce the complexity of their manufacture and assembly. The small size and weight of the proposed Converter can eliminate the lifting and handling mechanisms for its transportation.

Claims (3)

 1. SEMICONDUCTOR CONVERTER containing a cooler, semiconductor devices mounted on a cooler, power and control units and an output panel, characterized in that the cooler is made in the form of a block of radiators and insulators, closed around the perimeter and forming a converter housing, to the ends of which are newly inserted covers, and semiconductor devices are installed on the inner surface of the radiators and have thermal or electrical and thermal contact with them.  2. The Converter according to claim 1, characterized in that one or more semiconductor devices have thermal and electrical contact with two radiators.  3. The Converter according to claim 1, characterized in that on one end of the cooler body, power and control units are installed, and on the other an output panel.

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