RU2020113430A3 - - Google Patents
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- Publication number
- RU2020113430A3 RU2020113430A3 RU2020113430A RU2020113430A RU2020113430A3 RU 2020113430 A3 RU2020113430 A3 RU 2020113430A3 RU 2020113430 A RU2020113430 A RU 2020113430A RU 2020113430 A RU2020113430 A RU 2020113430A RU 2020113430 A3 RU2020113430 A3 RU 2020113430A3
- Authority
- RU
- Russia
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32055—Arc discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32541—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/3255—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32559—Protection means, e.g. coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
- H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/48—Generating plasma using an arc
- H05H1/50—Generating plasma using an arc and using applied magnetic fields, e.g. for focusing or rotating the arc
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/15—Means for deflecting or directing discharge
- H01J2237/152—Magnetic means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Analytical Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Discharge Heating (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762567423P | 2017-10-03 | 2017-10-03 | |
| US62/567,423 | 2017-10-03 | ||
| PCT/EP2018/000459 WO2019081052A1 (en) | 2017-10-03 | 2018-10-04 | CONFINED MAGNETIC FIELD ARC SOURCE |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| RU2020113430A RU2020113430A (ru) | 2021-11-08 |
| RU2020113430A3 true RU2020113430A3 (ru) | 2021-11-29 |
Family
ID=64572281
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2020113435A RU2020113435A (ru) | 2017-10-03 | 2018-10-04 | Дуговой источник |
| RU2020113430A RU2020113430A (ru) | 2017-10-03 | 2018-10-04 | Дуговой источник с ограниченным магнитным полем |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2020113435A RU2020113435A (ru) | 2017-10-03 | 2018-10-04 | Дуговой источник |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US11578401B2 (ru) |
| EP (2) | EP3692184B1 (ru) |
| JP (2) | JP7212234B2 (ru) |
| KR (2) | KR102667844B1 (ru) |
| CN (2) | CN111315915A (ru) |
| BR (1) | BR112020006715A2 (ru) |
| CA (2) | CA3077570A1 (ru) |
| MX (2) | MX2020003372A (ru) |
| RU (2) | RU2020113435A (ru) |
| SG (2) | SG11202002992TA (ru) |
| WO (2) | WO2019081053A1 (ru) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114341395A (zh) * | 2019-07-03 | 2022-04-12 | 欧瑞康表面解决方案股份公司，普费菲孔 | 阴极电弧源 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4448659A (en) * | 1983-09-12 | 1984-05-15 | Vac-Tec Systems, Inc. | Method and apparatus for evaporation arc stabilization including initial target cleaning |
| US4724058A (en) * | 1984-08-13 | 1988-02-09 | Vac-Tec Systems, Inc. | Method and apparatus for arc evaporating large area targets |
| US5298136A (en) | 1987-08-18 | 1994-03-29 | Regents Of The University Of Minnesota | Steered arc coating with thick targets |
| RU2074904C1 (ru) | 1992-11-23 | 1997-03-10 | Евгений Николаевич Ивашов | Катодный узел для ионно-плазменного нанесения тонких пленок в вакууме |
| RU2135634C1 (ru) | 1998-06-15 | 1999-08-27 | Санкт-Петербургский государственный технический университет | Способ и устройство магнетронного распыления |
| US6929727B2 (en) * | 1999-04-12 | 2005-08-16 | G & H Technologies, Llc | Rectangular cathodic arc source and method of steering an arc spot |
| US6645354B1 (en) * | 2000-04-07 | 2003-11-11 | Vladimir I. Gorokhovsky | Rectangular cathodic arc source and method of steering an arc spot |
| ES2228830T3 (es) * | 2001-03-27 | 2005-04-16 | Fundacion Tekniker | Evaporador de arco con guia magnetica intensa para blancos de superficie amplia. |
| DE10127013A1 (de) | 2001-06-05 | 2002-12-12 | Gabriel Herbert M | Lichtbogen-Verdampfungsvorrichtung |
| ES2342835T3 (es) * | 2005-12-16 | 2010-07-15 | Fundacion Tekniker | Maquina de evaporacion catodica. |
| EP2018653B1 (de) * | 2006-05-16 | 2014-08-06 | Oerlikon Trading AG, Trübbach | Arcquelle und magnetanordnung |
| CN101358328A (zh) | 2007-12-28 | 2009-02-04 | 中国科学院金属研究所 | 一种动态受控电弧离子镀弧源 |
| WO2010072850A1 (es) * | 2008-12-26 | 2010-07-01 | Fundacion Tekniker | Evaporador de arco y método para operar el evaporador |
| JP5494663B2 (ja) * | 2009-08-19 | 2014-05-21 | 日新電機株式会社 | アーク蒸発源及び真空蒸着装置 |
| CN102859027A (zh) | 2010-05-04 | 2013-01-02 | 欧瑞康贸易股份公司(特吕巴赫) | 用于借助陶瓷靶进行电弧气相沉积的方法 |
| UA101678C2 (ru) | 2011-04-08 | 2013-04-25 | Национальный Научный Центр "Харьковский Физико-Технический Институт" | ВАКУУМНОДУГОВОЙ испаритель для генерирования катодной ПЛАЗМЫ |
| US9153422B2 (en) * | 2011-08-02 | 2015-10-06 | Envaerospace, Inc. | Arc PVD plasma source and method of deposition of nanoimplanted coatings |
| CN102534513B (zh) * | 2011-12-19 | 2014-04-16 | 东莞市汇成真空科技有限公司 | 一种组合磁场的矩形平面阴极电弧蒸发源 |
| RU2482217C1 (ru) * | 2012-02-28 | 2013-05-20 | Открытое акционерное общество "Национальный институт авиационных технологий" | Вакуумно-дуговой источник плазмы |
| US9772808B1 (en) | 2012-11-29 | 2017-09-26 | Eric Nashbar | System and method for document delivery |
| AT13830U1 (de) * | 2013-04-22 | 2014-09-15 | Plansee Se | Lichtbogenverdampfungs-Beschichtungsquelle |
| CN106756819A (zh) * | 2016-09-30 | 2017-05-31 | 广东省新材料研究所 | 一种MCrAlY高温防护涂层制备方法 |
-
2018
- 2018-10-04 SG SG11202002992TA patent/SG11202002992TA/en unknown
- 2018-10-04 CN CN201880069225.9A patent/CN111315915A/zh active Pending
- 2018-10-04 CA CA3077570A patent/CA3077570A1/en active Pending
- 2018-10-04 SG SG11202002991YA patent/SG11202002991YA/en unknown
- 2018-10-04 JP JP2020519063A patent/JP7212234B2/ja active Active
- 2018-10-04 BR BR112020006715-6A patent/BR112020006715A2/pt active Search and Examination
- 2018-10-04 MX MX2020003372A patent/MX2020003372A/es unknown
- 2018-10-04 KR KR1020207012635A patent/KR102667844B1/ko active IP Right Grant
- 2018-10-04 JP JP2020519070A patent/JP7344483B2/ja active Active
- 2018-10-04 MX MX2020004821A patent/MX2020004821A/es unknown
- 2018-10-04 WO PCT/EP2018/000460 patent/WO2019081053A1/en unknown
- 2018-10-04 CA CA3078100A patent/CA3078100A1/en active Pending
- 2018-10-04 US US16/753,565 patent/US11578401B2/en active Active
- 2018-10-04 EP EP18812054.7A patent/EP3692184B1/en active Active
- 2018-10-04 US US16/753,734 patent/US11306390B2/en active Active
- 2018-10-04 RU RU2020113435A patent/RU2020113435A/ru unknown
- 2018-10-04 CN CN201880069245.6A patent/CN111279014A/zh active Pending
- 2018-10-04 RU RU2020113430A patent/RU2020113430A/ru unknown
- 2018-10-04 WO PCT/EP2018/000459 patent/WO2019081052A1/en unknown
- 2018-10-04 EP EP18812053.9A patent/EP3692183A1/en active Pending
- 2018-10-04 KR KR1020207012634A patent/KR102667843B1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| JP7344483B2 (ja) | 2023-09-14 |
| CA3078100A1 (en) | 2019-05-02 |
| JP2020536171A (ja) | 2020-12-10 |
| EP3692184A1 (en) | 2020-08-12 |
| WO2019081053A1 (en) | 2019-05-02 |
| US20200299824A1 (en) | 2020-09-24 |
| SG11202002992TA (en) | 2020-04-29 |
| CN111279014A (zh) | 2020-06-12 |
| US11578401B2 (en) | 2023-02-14 |
| KR102667844B1 (ko) | 2024-05-22 |
| KR20200063204A (ko) | 2020-06-04 |
| CA3077570A1 (en) | 2019-05-02 |
| RU2020113435A (ru) | 2021-11-08 |
| KR102667843B1 (ko) | 2024-05-22 |
| RU2020113435A3 (ru) | 2022-02-22 |
| MX2020004821A (es) | 2020-08-13 |
| EP3692184B1 (en) | 2024-04-17 |
| WO2019081052A1 (en) | 2019-05-02 |
| US20200255932A1 (en) | 2020-08-13 |
| EP3692183A1 (en) | 2020-08-12 |
| JP7212234B2 (ja) | 2023-01-25 |
| US11306390B2 (en) | 2022-04-19 |
| MX2020003372A (es) | 2020-07-29 |
| CN111315915A (zh) | 2020-06-19 |
| SG11202002991YA (en) | 2020-04-29 |
| KR20200063203A (ko) | 2020-06-04 |
| JP2020536170A (ja) | 2020-12-10 |
| RU2020113430A (ru) | 2021-11-08 |
| BR112020006716A2 (pt) | 2020-10-06 |
| BR112020006715A2 (pt) | 2020-10-06 |