SG11202002991YA - Arc source - Google Patents

Arc source

Info

Publication number
SG11202002991YA
SG11202002991YA SG11202002991YA SG11202002991YA SG11202002991YA SG 11202002991Y A SG11202002991Y A SG 11202002991YA SG 11202002991Y A SG11202002991Y A SG 11202002991YA SG 11202002991Y A SG11202002991Y A SG 11202002991YA SG 11202002991Y A SG11202002991Y A SG 11202002991YA
Authority
SG
Singapore
Prior art keywords
arc source
arc
source
Prior art date
Application number
SG11202002991YA
Inventor
Siegfried Krassnitzer
Juerg Hagmann
Original Assignee
Oerlikon Surface Solutions Ag Pfaeffikon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Surface Solutions Ag Pfaeffikon filed Critical Oerlikon Surface Solutions Ag Pfaeffikon
Publication of SG11202002991YA publication Critical patent/SG11202002991YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/3255—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32559—Protection means, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/48—Generating plasma using an arc
    • H05H1/50—Generating plasma using an arc and using applied magnetic fields, e.g. for focusing or rotating the arc
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15—Means for deflecting or directing discharge
    • H01J2237/152—Magnetic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
SG11202002991YA 2017-10-03 2018-10-04 Arc source SG11202002991YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762567423P 2017-10-03 2017-10-03
PCT/EP2018/000460 WO2019081053A1 (en) 2017-10-03 2018-10-04 Arc source

Publications (1)

Publication Number Publication Date
SG11202002991YA true SG11202002991YA (en) 2020-04-29

Family

ID=64572281

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11202002992TA SG11202002992TA (en) 2017-10-03 2018-10-04 Arc source with confined magnetic field
SG11202002991YA SG11202002991YA (en) 2017-10-03 2018-10-04 Arc source

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11202002992TA SG11202002992TA (en) 2017-10-03 2018-10-04 Arc source with confined magnetic field

Country Status (11)

Country Link
US (2) US11306390B2 (en)
EP (2) EP3692183A1 (en)
JP (2) JP7344483B2 (en)
KR (2) KR20200063203A (en)
CN (2) CN111279014A (en)
BR (2) BR112020006716A2 (en)
CA (2) CA3077570A1 (en)
MX (2) MX2020003372A (en)
RU (2) RU2020113430A (en)
SG (2) SG11202002992TA (en)
WO (2) WO2019081053A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114341395A (en) * 2019-07-03 2022-04-12 欧瑞康表面解决方案股份公司，普费菲孔 Cathode arc source

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4448659A (en) * 1983-09-12 1984-05-15 Vac-Tec Systems, Inc. Method and apparatus for evaporation arc stabilization including initial target cleaning
US4724058A (en) * 1984-08-13 1988-02-09 Vac-Tec Systems, Inc. Method and apparatus for arc evaporating large area targets
US5298136A (en) * 1987-08-18 1994-03-29 Regents Of The University Of Minnesota Steered arc coating with thick targets
RU2074904C1 (en) 1992-11-23 1997-03-10 Евгений Николаевич Ивашов Cathode joint for ionic-plasma application of thin films in vacuum
RU2135634C1 (en) 1998-06-15 1999-08-27 Санкт-Петербургский государственный технический университет Method and device for magnetron sputtering
US6929727B2 (en) * 1999-04-12 2005-08-16 G & H Technologies, Llc Rectangular cathodic arc source and method of steering an arc spot
US6645354B1 (en) * 2000-04-07 2003-11-11 Vladimir I. Gorokhovsky Rectangular cathodic arc source and method of steering an arc spot
BR0116951B1 (en) * 2001-03-27 2011-06-14 Powerful magnetic guide arc evaporator for targets having a large surface area.
DE10127013A1 (en) 2001-06-05 2002-12-12 Gabriel Herbert M Electric arc vaporizing device used for coating substrates with hard material has element of high relative magnetic permeability assigned to at least one annular coil of magnetic arrangement
DE602005019800D1 (en) * 2005-12-16 2010-04-15 Fundacion Tekniker CATHODE EXPANSION MACHINE
BRPI0711644B1 (en) * 2006-05-16 2019-03-19 Oerlikon Trading Ag, Trübbach VOLTAGE ARC SOURCE WITH A TARGET AND PROCESS FOR PRODUCTION OF VOLTAGE ARC COVERED PARTS
CN101358328A (en) 2007-12-28 2009-02-04 中国科学院金属研究所 Arc source of dynamic controlled arc ion plating
JP5496223B2 (en) * 2008-12-26 2014-05-21 フンダシオン テクニケル Arc evaporator and operating method of arc evaporator
JP5494663B2 (en) * 2009-08-19 2014-05-21 日新電機株式会社 Arc evaporation source and vacuum evaporation system
CN106435488A (en) * 2010-05-04 2017-02-22 欧瑞康表面解决方案股份公司，普费菲孔 Method for spark deposition using ceramic targets
UA101678C2 (en) * 2011-04-08 2013-04-25 Национальный Научный Центр "Харьковский Физико-Технический Институт" Vacuum arc evaporator FOR GENERATING cathode plasma
US9153422B2 (en) 2011-08-02 2015-10-06 Envaerospace, Inc. Arc PVD plasma source and method of deposition of nanoimplanted coatings
CN102534513B (en) * 2011-12-19 2014-04-16 东莞市汇成真空科技有限公司 Rectangular plane cathode arc evaporation source of combination magnetic fields
RU2482217C1 (en) * 2012-02-28 2013-05-20 Открытое акционерное общество "Национальный институт авиационных технологий" Vacuum arc plasma source
US9772808B1 (en) 2012-11-29 2017-09-26 Eric Nashbar System and method for document delivery
AT13830U1 (en) * 2013-04-22 2014-09-15 Plansee Se Arc evaporation coating source
CN106756819A (en) * 2016-09-30 2017-05-31 广东省新材料研究所 A kind of MCrAlY high-temperature protection coatings preparation method

Also Published As

Publication number Publication date
RU2020113435A3 (en) 2022-02-22
CA3077570A1 (en) 2019-05-02
JP7344483B2 (en) 2023-09-14
JP2020536171A (en) 2020-12-10
US20200255932A1 (en) 2020-08-13
RU2020113435A (en) 2021-11-08
MX2020004821A (en) 2020-08-13
RU2020113430A (en) 2021-11-08
WO2019081053A1 (en) 2019-05-02
CN111279014A (en) 2020-06-12
SG11202002992TA (en) 2020-04-29
EP3692183A1 (en) 2020-08-12
MX2020003372A (en) 2020-07-29
RU2020113430A3 (en) 2021-11-29
KR20200063203A (en) 2020-06-04
JP2020536170A (en) 2020-12-10
WO2019081052A1 (en) 2019-05-02
US11578401B2 (en) 2023-02-14
EP3692184A1 (en) 2020-08-12
BR112020006715A2 (en) 2020-10-06
US20200299824A1 (en) 2020-09-24
CN111315915A (en) 2020-06-19
US11306390B2 (en) 2022-04-19
CA3078100A1 (en) 2019-05-02
KR20200063204A (en) 2020-06-04
JP7212234B2 (en) 2023-01-25
BR112020006716A2 (en) 2020-10-06
EP3692184B1 (en) 2024-04-17

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