RU2007116018A - Контакт термоэлектрических материалов - Google Patents
Контакт термоэлектрических материалов Download PDFInfo
- Publication number
- RU2007116018A RU2007116018A RU2007116018/28A RU2007116018A RU2007116018A RU 2007116018 A RU2007116018 A RU 2007116018A RU 2007116018/28 A RU2007116018/28 A RU 2007116018/28A RU 2007116018 A RU2007116018 A RU 2007116018A RU 2007116018 A RU2007116018 A RU 2007116018A
- Authority
- RU
- Russia
- Prior art keywords
- borides
- nickel
- layer
- solder
- barrier layer
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract 10
- 230000004888 barrier function Effects 0.000 claims abstract 5
- 229910000679 solder Inorganic materials 0.000 claims abstract 5
- 229910000990 Ni alloy Inorganic materials 0.000 claims abstract 3
- 150000001247 metal acetylides Chemical class 0.000 claims abstract 3
- 150000004767 nitrides Chemical class 0.000 claims abstract 3
- 229910021332 silicide Inorganic materials 0.000 claims abstract 3
- 238000004519 manufacturing process Methods 0.000 claims abstract 2
- 238000005476 soldering Methods 0.000 claims abstract 2
- 229910052725 zinc Inorganic materials 0.000 claims abstract 2
- 229910052759 nickel Inorganic materials 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 238000007751 thermal spraying Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
Landscapes
- Powder Metallurgy (AREA)
- Ceramic Products (AREA)
- Physical Vapour Deposition (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Silicon Compounds (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Stringed Musical Instruments (AREA)
- Adornments (AREA)
- Gloves (AREA)
- Coating By Spraying Or Casting (AREA)
Claims (6)
1. Термоэлектрический модуль, отличающийся тем, что термоэлектрически проводящий материал снабжен запирающим слоем из боридов, исключая бориды никеля, нитриды, карбиды и/или силициды и этот слой посредством пайки соединен с собственным контактным материалом, причем припой содержит сплавы никеля.
2. Термоэлектрический модуль по п.1, отличающийся тем, что припой содержит сплавы никеля с Mg, Sn или Zn.
3. Способ изготовления термоэлектрического модуля, отличающийся тем, что на термоэлектрически проводящий материал наносят запирающий слой из боридов, исключая бориды никеля, нитриды, карбиды и/или силициды и затем этот слой посредством пайки соединяют с собственным контактным материалом, причем в качестве припоя используют сплавы никеля.
4. Способ по п.3, отличающийся тем, что припой наносят на контактный лист посредством термического напыления.
5. Способ по п.3 или 4, отличающийся тем, что соединение запирающего слоя с контактным материалом осуществляют посредством пайки электросопротивлением.
6. Термоэлектрический генератор или установка Пельтье, содержащие термоэлектрический модуль по п.1 или 2.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102004048219A DE102004048219A1 (de) | 2004-09-30 | 2004-09-30 | Kontaktierung thermoelektrischer Materialien |
| DE102004048219.5 | 2004-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| RU2007116018A true RU2007116018A (ru) | 2008-11-10 |
Family
ID=36062179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2007116018/28A RU2007116018A (ru) | 2004-09-30 | 2005-09-24 | Контакт термоэлектрических материалов |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US20080060693A1 (ru) |
| EP (1) | EP1797598B1 (ru) |
| JP (1) | JP2008515212A (ru) |
| KR (1) | KR20070083845A (ru) |
| CN (1) | CN101027796A (ru) |
| AT (1) | ATE480871T1 (ru) |
| CA (1) | CA2582558A1 (ru) |
| DE (2) | DE102004048219A1 (ru) |
| RU (1) | RU2007116018A (ru) |
| SG (1) | SG155926A1 (ru) |
| TW (1) | TW200620722A (ru) |
| WO (1) | WO2006087018A1 (ru) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008005694B4 (de) * | 2008-01-23 | 2015-05-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung eines thermoelektrischen Bauelementes |
| WO2010125411A1 (en) * | 2009-04-27 | 2010-11-04 | Szenergia Kft. | Procedure for producing a device containing metal and intermetallic semiconductor parts joined together with an electrically conductive and heat conducting connection, especially a rod suitable for use with thermoelectric modules |
| TWI446982B (zh) * | 2011-12-20 | 2014-08-01 | Ind Tech Res Inst | 熱電模組之固液擴散接合結構及其製造方法 |
| TWI605620B (zh) | 2011-12-30 | 2017-11-11 | 財團法人工業技術研究院 | 熱電模組及其製造方法 |
| TWI499101B (zh) * | 2012-07-13 | 2015-09-01 | Ind Tech Res Inst | 熱電轉換結構及使用其之散熱結構 |
| JP6365951B2 (ja) | 2013-09-09 | 2018-08-01 | エルジー・ケム・リミテッド | 熱電材料の製造方法 |
| KR101624306B1 (ko) * | 2013-09-09 | 2016-05-25 | 주식회사 엘지화학 | 열전 재료 제조 방법 |
| EP3026719B1 (en) | 2013-09-09 | 2019-06-26 | LG Chem, Ltd. | Thermoelectric materials and their manufacturing method |
| US10323305B2 (en) * | 2014-02-18 | 2019-06-18 | University Of Houston System | Thermoelectric compositions and methods of fabricating high thermoelectric performance MgAgSb-based materials |
| JP2017107925A (ja) * | 2015-12-08 | 2017-06-15 | 日立化成株式会社 | 熱電変換モジュールおよびその製造方法 |
| CN109402449B (zh) * | 2018-12-29 | 2021-03-23 | 太原理工大学 | 一种Zn-TiB2高效变质中间合金及丝的制备方法 |
| CN110635020B (zh) * | 2019-08-30 | 2021-05-25 | 中国科学院物理研究所 | 一种镁锑基热电元件及其制备方法和应用 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1033018A (en) * | 1963-01-21 | 1966-06-15 | Rue Frigistor S A De | Thermoelectric unit and method of formation thereof |
| US3880674A (en) * | 1970-01-20 | 1975-04-29 | Rockwell International Corp | Thermoelectric elements and devices and process therefor |
| US3859143A (en) * | 1970-07-23 | 1975-01-07 | Rca Corp | Stable bonded barrier layer-telluride thermoelectric device |
| DE3875444D1 (de) * | 1987-09-29 | 1992-11-26 | Vacuumschmelze Gmbh | Nickel-basis-lot fuer hochtemperatur-loetverbindungen. |
| US5127969A (en) * | 1990-03-22 | 1992-07-07 | University Of Cincinnati | Reinforced solder, brazing and welding compositions and methods for preparation thereof |
| TW520072U (en) * | 1991-07-08 | 2003-02-01 | Samsung Electronics Co Ltd | A semiconductor device having a multi-layer metal contact |
| US5429680A (en) | 1993-11-19 | 1995-07-04 | Fuschetti; Dean F. | Thermoelectric heat pump |
| US5385868A (en) * | 1994-07-05 | 1995-01-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Upward plug process for metal via holes |
| US6103967A (en) * | 1998-06-29 | 2000-08-15 | Tellurex Corporation | Thermoelectric module and method of manufacturing the same |
| US7771547B2 (en) * | 1998-07-13 | 2010-08-10 | Board Of Trustees Operating Michigan State University | Methods for producing lead-free in-situ composite solder alloys |
| JP2000043637A (ja) | 1998-07-30 | 2000-02-15 | Hino Motors Ltd | 車輛用簡易ベッド |
| JP2002094131A (ja) * | 2000-09-13 | 2002-03-29 | Sumitomo Special Metals Co Ltd | 熱電変換素子 |
| KR20040060919A (ko) * | 2001-08-24 | 2004-07-06 | 엠씨엔씨 리서치 앤드 디벨럽먼트 인스티튜트 | 관통 바이어형 수직 상호접속부, 관통 바이어형 히트 싱크및 관련 제작 방법 |
-
2004
- 2004-09-30 DE DE102004048219A patent/DE102004048219A1/de not_active Withdrawn
-
2005
- 2005-09-24 US US11/576,103 patent/US20080060693A1/en not_active Abandoned
- 2005-09-24 KR KR1020077009705A patent/KR20070083845A/ko not_active Application Discontinuation
- 2005-09-24 RU RU2007116018/28A patent/RU2007116018A/ru not_active Application Discontinuation
- 2005-09-24 EP EP05857307A patent/EP1797598B1/de not_active Not-in-force
- 2005-09-24 DE DE502005010236T patent/DE502005010236D1/de active Active
- 2005-09-24 SG SG200906155-7A patent/SG155926A1/en unknown
- 2005-09-24 WO PCT/EP2005/010364 patent/WO2006087018A1/de active Application Filing
- 2005-09-24 CA CA002582558A patent/CA2582558A1/en not_active Abandoned
- 2005-09-24 CN CNA2005800323100A patent/CN101027796A/zh active Pending
- 2005-09-24 JP JP2007533924A patent/JP2008515212A/ja active Pending
- 2005-09-24 AT AT05857307T patent/ATE480871T1/de not_active IP Right Cessation
- 2005-09-30 TW TW094134140A patent/TW200620722A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006087018A1 (de) | 2006-08-24 |
| US20080060693A1 (en) | 2008-03-13 |
| SG155926A1 (en) | 2009-10-29 |
| KR20070083845A (ko) | 2007-08-24 |
| EP1797598B1 (de) | 2010-09-08 |
| ATE480871T1 (de) | 2010-09-15 |
| CN101027796A (zh) | 2007-08-29 |
| JP2008515212A (ja) | 2008-05-08 |
| TW200620722A (en) | 2006-06-16 |
| CA2582558A1 (en) | 2006-08-24 |
| DE502005010236D1 (de) | 2010-10-21 |
| EP1797598A1 (de) | 2007-06-20 |
| DE102004048219A1 (de) | 2006-04-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FA92 | Acknowledgement of application withdrawn (lack of supplementary materials submitted) |
Effective date: 20100107 |