RU165459U1 - Многослойная конструкция светодиодного модуля на кремниевой подложке - Google Patents

Многослойная конструкция светодиодного модуля на кремниевой подложке Download PDF

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Publication number
RU165459U1
RU165459U1 RU2015153042/28U RU2015153042U RU165459U1 RU 165459 U1 RU165459 U1 RU 165459U1 RU 2015153042/28 U RU2015153042/28 U RU 2015153042/28U RU 2015153042 U RU2015153042 U RU 2015153042U RU 165459 U1 RU165459 U1 RU 165459U1
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RU
Russia
Prior art keywords
layer
groove
drive
module
substrate
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Application number
RU2015153042/28U
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English (en)
Russian (ru)
Inventor
Минфэн ЛИНЬ
Цзя ВЭЙ
Чжэньлэй СЮЙ
Жуньюань ЛЯН
Чуньван ЧЖАН
Дань ХУ
Хоухуа БАО
Original Assignee
Гуандун Юнилумин Энерджи Сейвингс Текнолоджи Ко., Лтд
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Publication of RU165459U1 publication Critical patent/RU165459U1/ru

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
RU2015153042/28U 2013-07-15 2013-07-17 Многослойная конструкция светодиодного модуля на кремниевой подложке RU165459U1 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201310296592.1 2013-07-15
CN201310296592.1A CN103367351B (zh) 2013-07-15 2013-07-15 基于硅基的led模组多层叠加结构及制作方法
PCT/CN2013/079509 WO2015006936A1 (zh) 2013-07-15 2013-07-17 基于硅基的led模组多层叠加结构及制作方法

Publications (1)

Publication Number Publication Date
RU165459U1 true RU165459U1 (ru) 2016-10-20

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ID=49368369

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2015153042/28U RU165459U1 (ru) 2013-07-15 2013-07-17 Многослойная конструкция светодиодного модуля на кремниевой подложке

Country Status (3)

Country Link
CN (1) CN103367351B (zh)
RU (1) RU165459U1 (zh)
WO (1) WO2015006936A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103646620B (zh) * 2013-12-25 2016-01-20 深圳市洲明科技股份有限公司 Led显示模组及其制造方法
CN109064913B (zh) * 2017-07-19 2022-05-20 广州超维光电科技有限责任公司 基于类舞台结构的内嵌集成式行单元
CN113359248B (zh) * 2021-06-02 2022-11-15 青岛海信宽带多媒体技术有限公司 一种光模块
CN115547206B (zh) * 2022-09-29 2024-07-09 上海天马微电子有限公司 发光模组及其制作方法、背光源、显示面板、显示装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7008820B2 (en) * 2004-06-10 2006-03-07 St Assembly Test Services Ltd. Chip scale package with open substrate
WO2006003563A2 (en) * 2004-06-29 2006-01-12 Koninklijke Philips Electronics N.V. Light emitting diode module
KR100646094B1 (ko) * 2005-07-04 2006-11-14 엘지전자 주식회사 표면 실장형 발광 소자 패키지 및 그의 제조 방법
KR100817075B1 (ko) * 2006-11-09 2008-03-26 삼성전자주식회사 멀티스택 패키지 및 그 제조 방법
CN102011952A (zh) * 2009-09-04 2011-04-13 佛山市国星光电股份有限公司 Led光源模块的制造方法及该方法的产品
CN202100964U (zh) * 2011-03-11 2012-01-04 义乌市菲莱特电子有限公司 一种宽光谱led节能灯管
CN203386751U (zh) * 2013-07-15 2014-01-08 广东洲明节能科技有限公司 基于硅基的led模组多层叠加结构

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Publication number Publication date
CN103367351B (zh) 2015-12-30
WO2015006936A1 (zh) 2015-01-22
CN103367351A (zh) 2013-10-23

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MM9K Utility model has become invalid (non-payment of fees)

Effective date: 20180718

NF9K Utility model reinstated

Effective date: 20190515