RU152788U1 - MICROELECTRONIC UNIT - Google Patents

Abstract

1. A microelectronic unit comprising a housing divided by partitions into compartments, a cover fixed by soldering along the perimeter of the housing, a sealing assembly, pressure glands and microwave connectors, the housing being made in one piece with the partitions, while the partitions are thickened, which are stops for additional fastening the cover to the case with screws, and on the inside of the cover at the places of its interfacing with the partitions, recesses are made in which the current collectors are sealed, characterized in that the case is made with the possibility of installing in its compartments microstrip boards made of flexible-rigid material, single-layer and multi-layer printed circuit boards, voluminous electro-radio elements, as well as with the possibility of installing control devices on its outside, on the outside of the lid there are screw cavities in which the petals sealed with solder are installed In addition, the housing additionally contains a protective cover fixed to it that shields the pressure glands, and for fixation in the 3U cell, mounting elements in the form of new mechanisms and lever demontazha.2. The microelectronic unit according to claim 1, characterized in that the housing is made of aluminum alloy. 3. The microelectronic unit according to claim 1, characterized in that the housing has walls of 3-7 mm thick, the bottom is 5.5-7 mm thick and partitions 1-1.5 mm thick, and at the location of the microwave connectors, the wall thickness of the housing is 4, 8 mm. 4. The microelectronic unit according to claim 1, characterized in that the housing is configured to fasten the control device through a fiberglass gasket by means of screws. 5. Micro

Description

The utility model relates to microelectronic technology, namely to the design of microelectronic units intended for use in integrated modular avionics (IMA).

Known strip node of the microwave range of the microelectronic unit with general sealing [Patent RU No. 13460, IPC: H05K 1/00, published 04/10/2000], containing strip boards mounted on the carrier frame, including at least one functional board and interconnect boards, as well as connecting jumpers and shielding jumpers, which are installed in the cutouts of the supporting frame, and surround electro-radio elements with their own bases and strip leads.

The disadvantage of this design is the limited scope due to the structural and technological features of the device. Such designs do not allow the design of modules built on the basis of IMA principles.

The closest in technical essence and the achieved result to the proposed technical solution is a microelectronic unit with general sealing [Patent RU No. 11644, IPC: H05K 1/00, published 16.10.1999], comprising a case divided by baffles into compartments, a cover fixed around the perimeter of the case soldering, sealing unit, pressure glands and microwave connectors. The body is made integral with the partitions. In the partitions, thickenings are made, which are stops for additional fastening of the lid to the case with sealed compound screws, and recesses are made on the inside of the lid in places of its interfacing with the partitions, in which contact springs are installed.

The disadvantages of this microelectronic unit with general sealing are the limited possibilities for use due to its structural and technological features, namely the impossibility of installation in a standard 3U cell, as well as the insufficiently high tightness of the unit.

The technical result of the claimed utility model is aimed at increasing the tightness of the microelectronic unit, providing additional shielding of the pressure glands and the possibility of installation in a standard 3U cell.

The technical result is achieved by the fact that the microelectronic unit comprises a housing divided by partitions into compartments, a lid fixed by soldering along the perimeter of the housing, a sealing assembly, hermetic inputs and microwave connectors. The casing is made in one piece with the partitions, while the partitions are thickened, which are stops for additional fastening of the cover to the casing with screws. On the inside of the lid in places of its interfacing with the partitions, recesses are made in which the current collectors are sealed. The housing is made with the possibility of installing in its compartments microstrip boards made of flexible-rigid material, single-layer and multi-layer printed circuit boards, bulk electro-radio elements, as well as with the possibility of installing a control device from its outside. On the outside of the lid there are cavities for screws in which the petals are sealed with solder. In addition, the housing additionally contains a protective cover fixed thereto, which screens the pressure glands, and for fixation in the 3U cell, mounting elements in the form of wedge mechanisms and a lever for dismantling are installed on the housing.

The essence of the utility model is illustrated by drawings, which show:

FIG. 1 is a general view of a microelectronic unit;

FIG. 2 is a section AA in FIG. 1 (increased);

FIG. 3 is a view B in FIG. one;

FIG. 4 is a view B in FIG. 3;

FIG. 5 is a section GG in FIG. 4 (pressure seal);

FIG. 6 is a general view of a microelectronic unit without a control device and fasteners;

FIG. 7 is a section DD in FIG. 6 (place of attachment of the cover).

The microelectronic unit (Fig. 1, 3, 4) contains a housing 1 on which a control device 2 with a combined connector 3 is fixed, a cover 4, a sealing unit 5, made in the form of a tube for pumping air and forcing inert gas, pressure glands 6, microwave connectors 7, connected by microwave cables 8 with a combined connector 3, fasteners 9 and lever 10.

Housing 1 (Fig. 1, 2, 3, 4, 6) of cup type with dimensions 100 × 146.5 × 19 mm is made by milling from a monolithic blank of aluminum alloy (for example, grade D16, GOST 4784-74) with separation into shielding compartments the partitions 11 (Fig. 2, 6) with a thickness of 1-1.5 mm, which are made integrally with the housing 1. At the same time, the bulkheads 12 are made thickenings 12 (Fig. 6), which are stops for additional fastening of the cover 4 to the housing 1 screws 13 (Fig. 7). The housing 1 has walls 3–7 mm thick and the bottom 5.5–7 mm thick, and at the location of the microwave connectors 7, the wall thickness of the housing 1 is 4.8 mm (the required thickness for mounting the microwave connector, determined by its type).

In the compartments of the housing 1 microstrip boards 14, 15, 16 are installed, made using flexible-rigid material (for example, ADRL 1000 from ARLON), single-layer and multi-layer printed circuit boards 17, 18, 19, 20 made, for example, from FR- material 4, as well as voluminous electro-radio elements - decoupling device 21, powerful microwave transistors 22, attenuator 23 (Fig. 6). All boards are attached

metallized (screen) side directly to the housing 1 with screws 24 (Fig. 6), which improves heat dissipation from sections of the circuit in which electromagnetic energy is dissipated. Contact pads of adjacent boards are connected by jumpers.

Sealing the housing 1 is carried out by soldering along the contour of the cover 4 using wire to enable opening and a rubber gasket to prevent solder and flux from entering the housing 1. On the inside of the cover 4, recesses 25 are made in the places of its interfacing with the partitions 11, into which the current collectors 26 are sealed for additional contact of the cover 4 with the housing 1 and shielding placed in the compartments of the components of the electrical circuit from mutual influence (Fig. 2). For attaching the cover 4 to the housing 1 from its outer side, cavities 27 (Fig. 1, 7) are provided for the screws 13 into which the petals 28 are installed, sealed with solder to ensure the best tightness of the block (Fig. 7). In addition, the petals 28 provide conditions for more convenient dismantling of the cover 4.

On the outside of the housing 1, a control device 2 is installed with a combined connector 3 (Fig. 1-4), for example, of type VIPER (connector for highly reliable high-speed interfaces). The control device 2 performs the function of forming the required operating modes of the microelectronic unit and is a multilayer printed circuit board made of FR-4 material, fixed with screws 29 (Fig. 4) on the housing 1 through a fiberglass gasket. On the circuit board of the control device 2, surface mounted radio electronic devices (ERI) are installed, and a screw connector 3 is installed and fixed with screws 30 (Fig. 4), including a combination of plates from low-frequency contacts, pressed into the board, and an insert with coaxial contacts for connecting microwave cables 8. Combined connector 3 is designed to supply power voltages and control signals of the microelectronic unit to

the control device 2, as well as the output generated by the circuit response microwave signal.

To supply power and control signals to the pressurized chamber, low-frequency hermetic inputs 6 are used (Figs. 2, 4, 5, 6) installed in the bottom of the housing 1 with a corresponding distribution over its entire area (Fig. 4). Each hermetic inlet 6 (Fig. 5) contains a central conductor fixed in an insulator for tight installation in the corresponding socket of the housing 1. The hermetic inlets 6 are connected by mounting wires 31 to the contact pads of the boards inside the hermetic chamber and the board of the control device 2 (Fig. 5).

Input and output of microwave signals is carried out through standard microwave connectors 7 of the type SRG-751 by means of microwave cables 8 connected to a combined connector 3 (Fig. 1).

A protective cover 32 is installed on top of the control device 2 (Figs. 2, 3, 4), which provides the best shielding of the cable glands 6 from external electric fields, as well as increasing operational reliability. The protective cover 32 is in contact with the housing 1 and secured to it by means of screws 33 (Fig. 4).

The fastening elements 9 provide fixation of the microelectronic unit in the cell 3U, and the lever 10 is designed for its dismantling (Fig. 1-3). In this case, wedge mechanisms installed on the sides of the housing 1 are used as fasteners 9 (Figs. 1-3). The need for placement of wedge mechanisms on housing 1 is due to the feature of the standard 3U cell of the integrated surveillance system rack, while the lever 10 makes it easy to remove the unit from the cell.

The assembly of the microelectronic unit is as follows.

A lever 10 is mounted in the housing 1 using a pin connection, the microwave connectors 7, the pressure glands 6 and the sealing unit 5 (rod pipe) are soldered (Fig. 6). Then into the compartments of the housing 1

microstrip 14, 15, 16 and printed circuit boards 17, 18, 19, 20, decoupling device 21, powerful microwave transistors 22, attenuator 23 are installed (Fig. 6). All assemblies (boards and surround electro-radio elements) are fixed with screws 24 on the housing 1 (Fig. 6). The contact pads of the assemblies are interconnected, as well as with the microwave connectors 7 and pressure glands 6 according to the electrical circuit. After that, the microelectronic unit is subject to adjustment with subsequent sealing. In addition to soldering the lid 4, the sealing includes pumping air from the internal volume of the housing 1 and filling it with inert gas through the sealing unit 5. The lid 4 is additionally fixed with screws 13 placed in the cavities 27, into which the petals 28 are then sealed (Fig. 7), providing additional block sealing. To adjust the unit, a contacting device is used (a device containing a control board technological board).

An ERI is installed on the control device board 2, then a combined connector 3, for example, of the VIPER type, is installed and fixed with screws 30, after which the board is fixed by screws 29 from the outside of the housing 1 through a fiberglass gasket (Fig. 4). Next, according to the electric circuit, the functional parts of the circuit are mounted using wires, the microwave connectors 7 are connected via microwave cables 8 with the combined connector 3, and the final adjustment of the microelectronic unit is performed. A protective cover 32 (Fig. 2-4) is installed above the control device board 2, which is fixed to the housing 1 with screws 33 (Fig. 4). After that, fasteners 9 are installed on the sides of the housing 1 (Figs. 1–3), which use wedge mechanisms designed to fix the unit at the place of operation. At the same time, the lever 10 is used to dismantle the block (Fig. 1, 2, 6).

Thus, the inventive microelectronic unit has a 3U (100 × 160 mm) design, adapted to the IMA standard, and is installed in the crate of the integrated monitoring system, providing it with secondary supply voltages and communication with external systems. The design of the microelectronic unit allows you to optimally place heterogeneous fragments of the electronic device with a complex morphology of interconnections of nodes and elements. The use of flexible-rigid microwave boards increases the manufacturability of the manufacture and assembly of the unit. The combination combiner used provides a highly reliable connection to high-speed interfaces.

The direct purpose of the microelectronic unit is to perform the functions of providing surveillance of an aircraft by ground-based air traffic control devices.

The industrial applicability of the utility model is determined by the fact that the microelectronic unit can be made on the basis of the above description and drawings using well-known materials and technological equipment used in the modern production of electronic devices.

Claims (6)

1. A microelectronic unit comprising a housing divided by partitions into compartments, a cover fixed by soldering along the perimeter of the housing, a sealing assembly, pressure glands and microwave connectors, the housing being made in one piece with the partitions, while the partitions are thickened, which are stops for additional fastening the cover to the case with screws, and on the inside of the cover at the places of its interfacing with the partitions, recesses are made in which the current collectors are sealed, characterized in that the case is made with the possibility of installing in its compartments microstrip boards made of flexible-rigid material, single-layer and multi-layer printed circuit boards, voluminous electro-radio elements, as well as with the possibility of installing control devices on its outside, on the outside of the lid there are screw cavities in which the petals sealed with solder are installed In addition, the housing additionally contains a protective cover fixed to it that shields the pressure glands, and for fixation in the 3U cell, mounting elements in the form of new mechanisms and lever disassembly. 2. The microelectronic unit according to claim 1, characterized in that the housing is made of aluminum alloy. 3. The microelectronic unit according to claim 1, characterized in that the housing has walls of 3-7 mm thick, the bottom is 5.5-7 mm thick and partitions 1-1.5 mm thick, and at the location of the microwave connectors, the wall thickness of the housing is 4.8 mm. 4. The microelectronic unit according to claim 1, characterized in that the housing is configured to fasten the control device through a fiberglass gasket by means of screws. 5. The microelectronic unit according to claim 1, characterized in that the pressure glands are installed in the bottom of the housing with a distribution over its entire area, respectively, with the possibility of connection with the contact pads of the boards inside the pressure chamber and the control device board by means of mounting wires. 6. The microelectronic unit according to claim 1, characterized in that the protective cover is fixed to the housing by screws.

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