CN205987617U - Miniaturized circuit module device - Google Patents
Miniaturized circuit module device Download PDFInfo
- Publication number
- CN205987617U CN205987617U CN201620944829.1U CN201620944829U CN205987617U CN 205987617 U CN205987617 U CN 205987617U CN 201620944829 U CN201620944829 U CN 201620944829U CN 205987617 U CN205987617 U CN 205987617U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- box body
- lower floor
- cover plate
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a miniaturized circuit module device, including box body, upper strata apron, lower floor's apron, first circuit board and second Circuit Board, the box body include shell, baffle and radiating block, the three structurally is one whole, the baffle two -layer about divideing into with the box body, second Circuit Board is installed on the baffle upper strata, baffle lower floor installs the first circuit board, the box body upper strata seal by upper strata apron, the lower floor is sealed by lower floor's apron. With the attend lower floor of multistage circuit configuration in the box body, whole double -layer design with size reduction for individual layer the half the of structure of arranging, has reduced the structure size greatly and has occupied the space. Effectual heat dissipation has been guaranteed to the rational design radiating block, does not influence that the device is arranged and signal transmission simultaneously. The glass insulator position of lower floor is attend in input, output interface position and the connection of the whole module of rational design, has avoided the emergence of electromagnetic compatibility problem.
Description
Technical field
This utility model is related to miniaturized circuit plate field, more particularly, to a kind of miniaturized circuit modular device.
Background technology
With the fast development of electronic technology, modern electronic product function becomes increasingly complex, and leads to increasing equipment
Towards miniaturization, integrated development, all devices all develop towards integrated and miniaturization direction accordingly.And it is each now
Under the integrated environment of kind of microwave device, module height, solid power amplifier due to needing corresponding match circuit, in one side
Size in the case of arrangement is generally in TR assembly（The critical component of Connectors for Active Phased Array Radar）In be significantly greater than other modules, seriously
Affect the realization of TR component miniaturization design.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of miniaturized circuit modular device, knot
Clutch part physical features and actual functional capability demand, multi-level pmultistage circuit are arranged in the levels of box body, solve TR component miniaturization
Problem.
The purpose of this utility model is achieved through the following technical solutions：A kind of miniaturized circuit modular device, bag
Include box body, cover plate of upper layer, lower floor's cover plate, first circuit board and second circuit board；Described box body includes shell, dividing plate and radiating
Block, three is an entirety in structure, and box body is divided into upper and lower two-layer by described dividing plate, and dividing plate upper strata is provided with second circuit
Plate, dividing plate lower floor is provided with first circuit board；Described box body upper strata is sealed by cover plate of upper layer, and lower floor is entered by lower floor's cover plate
Row sealing.
Round hole, described first circuit board and second circuit board are had on described first circuit board and second circuit board
Between be attached by the glass insulator in round hole and signal transmission.
Power transistor is also equipped with described dividing plate, immediately below described power transistor, has enough heat dissipation region
It is connected with the dividing plate in the middle of box body and radiating block.
Described first circuit board equally reserves an equal amount of space with heat dissipation region, the radiator portion of first circuit board
It is connected with radiating block by dividing plate.
Various surface-mounted devices are welded with described first circuit board and second circuit board.
Described box body is metal case, and cover plate of upper layer is metal overlayer cover plate, and lower floor's cover plate is metal lower layer cover plate.
Described metal includes aluminium alloy.
Described cover plate of upper layer, lower floor's cover plate and box body are welded as a whole using Laser seal welding.
Described first circuit board and second circuit board all include power amplification circuit.
The beneficial effects of the utility model are：A kind of miniaturized circuit modular device, by multi-level pmultistage circuit arrangement and box body
Levels, size is reduced to the half of monolayer arrangement by overall double layer design, substantially reduces the volume of structure and occupies
Space.Appropriate design radiating block ensure that effective radiating, does not affect device arrangement and signal transmission simultaneously.Appropriate design is whole
The input of module, output interface position and the glass insulator position connecting levels, it is to avoid the sending out of electromagnetic compatibility problem
Raw.
Brief description
Fig. 1 is structure drawing of device；
Fig. 2 is apparatus structure upward view.
Specific embodiment
Below in conjunction with the accompanying drawings the technical solution of the utility model is described in further detail, but protection domain of the present utility model
It is not limited to described below.
As shown in figure 1, a kind of miniaturized circuit modular device, including box body, cover plate of upper layer, lower floor's cover plate, the first circuit
Plate and second circuit board；Described box body includes shell, dividing plate and radiating block, and three is one overall in structure, described every
Box body is divided into upper and lower two-layer by plate, and dividing plate upper strata is provided with second circuit board, and dividing plate lower floor is provided with first circuit board；Described
Box body upper strata is sealed by cover plate of upper layer, and lower floor is sealed by lower floor's cover plate.
As shown in Fig. 2 round hole is had on described first circuit board and second circuit board, described first circuit board with
Be attached by the glass insulator in round hole between second circuit board and signal transmission.
Power transistor is also equipped with described dividing plate, immediately below described power transistor, has enough heat dissipation region
It is connected with the dividing plate in the middle of box body and radiating block.
Described first circuit board equally reserves an equal amount of space with heat dissipation region, the radiator portion of first circuit board
It is connected with radiating block by dividing plate.
Various surface-mounted devices are welded with described first circuit board and second circuit board.
Described box body is metal case, and cover plate of upper layer is metal overlayer cover plate, and lower floor's cover plate is, metal lower layer cover plate.
Described metal includes aluminium alloy.
Described cover plate of upper layer, lower floor's cover plate and box body are welded as a whole using Laser seal welding.
Described first circuit board and second circuit board all include power amplification circuit.
All glass insulators of the present utility model, first circuit board, second circuit board and various surface-mounted device are all logical
Cross Reflow Soldering once to complete.After completing circuit performance debugging, then using Laser seal welding by cover plate of upper layer, lower floor's cover plate and metal screen
Cover box body to be welded as a whole.
The above is only preferred implementation of the present utility model it should be understood that this utility model is not limited to herein
Disclosed form, is not to be taken as the exclusion to other embodiment, and can be used for various other combinations, modification and environment, and
Can be modified by the technology or knowledge of above-mentioned teaching or association area in contemplated scope described herein.And this area
Change that personnel are carried out and change, then all should be in rights appended by this utility model without departing from spirit and scope of the present utility model
In the protection domain requiring.
Claims (9)
1. a kind of miniaturized circuit modular device it is characterised in that：Including box body, cover plate of upper layer, lower floor's cover plate, first circuit board
And second circuit board；Described box body includes shell, dividing plate and radiating block, and three is overall, a described dividing plate in structure
Box body is divided into upper and lower two-layer, dividing plate upper strata is provided with second circuit board, dividing plate lower floor is provided with first circuit board；Described box
Body upper strata is sealed by cover plate of upper layer, and lower floor is sealed by lower floor's cover plate.
2. a kind of miniaturized circuit modular device according to claim 1 it is characterised in that：Described first circuit board and
Round hole is had on second circuit board, the glass passing through in round hole between described first circuit board and second circuit board is exhausted
Edge be attached and signal transmission.
3. a kind of miniaturized circuit modular device according to claim 1 it is characterised in that：Also install on described dividing plate
There is power transistor, immediately below described power transistor, have the dividing plate in the middle of enough heat dissipation region and box body and radiating block phase
Even.
4. a kind of miniaturized circuit modular device according to claim 1 it is characterised in that：Described first circuit board is same
Sample reserves an equal amount of space with heat dissipation region, and the radiator portion of first circuit board is connected with radiating block by dividing plate.
5. a kind of miniaturized circuit modular device according to claim 1 it is characterised in that：Described first circuit board and
Various surface-mounted devices are welded with second circuit board.
6. a kind of miniaturized circuit modular device according to claim 1 it is characterised in that：Described box body is can
Body, cover plate of upper layer is metal overlayer cover plate, and lower floor's cover plate is metal lower layer cover plate.
7. a kind of miniaturized circuit modular device according to claim 6 it is characterised in that：Described metal includes aluminum and closes
Gold.
8. a kind of miniaturized circuit modular device according to claim 1 it is characterised in that：Described cover plate of upper layer, under
Layer cover plate and box body are welded as a whole using Laser seal welding.
9. a kind of miniaturized circuit modular device according to claim 1 it is characterised in that：Described first circuit board and
Second circuit board all includes power amplification circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620944829.1U CN205987617U (en) | 2016-08-26 | 2016-08-26 | Miniaturized circuit module device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620944829.1U CN205987617U (en) | 2016-08-26 | 2016-08-26 | Miniaturized circuit module device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205987617U true CN205987617U (en) | 2017-02-22 |
Family
ID=58035741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620944829.1U Active CN205987617U (en) | 2016-08-26 | 2016-08-26 | Miniaturized circuit module device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205987617U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107645900A (en) * | 2017-09-26 | 2018-01-30 | 天津光电通信技术有限公司 | A kind of shielding box based on radio frequency connector |
-
2016
- 2016-08-26 CN CN201620944829.1U patent/CN205987617U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107645900A (en) * | 2017-09-26 | 2018-01-30 | 天津光电通信技术有限公司 | A kind of shielding box based on radio frequency connector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |