RU146558U1 - DEVICE FOR ASSEMBLING A WAVEGUIDE TREATMENT UNDER SOLDERING - Google Patents

Abstract

A device for assembly under soldering of a part in the form of a waveguide path, consisting of two flanges and a waveguide tube, containing a base, racks mounted on it and a plate mounted on racks with the ability to move and fix in a predetermined position, while the base and plate are made with rings of material with a low coefficient of thermal expansion for mounting the flanges of the waveguide path on them, and the plate is made with an opening for passing through the waveguide tube.

Description

The utility model relates to technological equipment and can be used for assembly under high-temperature soldering of waveguide paths.

A device for assembling parts (turbine blades and rings) for soldering is known, comprising a mounting ring with ring collars along its outer and inner generatrices. On the ring between the shoulders there are base places for installing the parts to be soldered and clamping elements for their fixation.

To carry out soldering, turbine blades are installed on the base places of the mounting ring and fixed with clamping elements. A disc is applied to the connecting places of the blades and the brazed disc is soldered to obtain the turbine impeller (see RF patent No. 2120567, class F04D 29/28, 1998).

As a result of the analysis of the known fixture, it should be noted that its design does not compensate for the temperature deformation of the structural elements of the fixture during heating, which leads to a change in the position of the soldered parts during the soldering process, and, consequently, to a decrease in the quality of the resulting product.

A device is known for assembling ceramic-metal assemblies for soldering, comprising a hollow body in which there are elements for installing parts of the soldered product, and elements for installing parts of the soldered product are made in the form of two sleeves that can be moved on which the base surfaces for installing the brazed are made parts, and studs, located in the holes of the bushings and equipped with threaded fasteners mounted on the threaded ends of the studs, while the fasteners are made and h material having a coefficient of thermal expansion greater than the coefficient of thermal expansion of the material of the brazed product.

(see RF patent for utility model No. 137222, class B23K 1/00, 2014).

As a result of the analysis of the known device, it should be noted that during the brazing process using this device, the brazed parts can be shifted relative to each other, due to the pressure exerted by the fastening with a large coefficient of thermal expansion, in comparison with the main material.

The technical result of this utility model is to improve the quality of the brazed joint, increasing the reliability of the brazed units by reducing the forces that arise in the tooling during the soldering process, and leading to a change in the position of the brazed parts.

The specified technical result is ensured by the fact that the device for assembling for soldering the part in the form of a waveguide path, consisting of two flanges and a waveguide tube, contains a base, racks mounted on it, and a plate mounted on racks with the ability to move and fix in a predetermined position, while the base and the plate are made with rings of material with a low coefficient of thermal expansion for mounting flanges of the waveguide path on them, and the plate is made with an opening for passing through it into water pipe, which allows us to solve the problem, that is, improves the quality of soldered joints

The essence of the claimed utility model is illustrated by graphic materials on which:

- in FIG. 1 - device, side view;

- in FIG. 2 - device, top view.

A device for assembling the waveguide path for soldering, consists of a base 1, on which the guide posts 2 are mounted. On the posts 2 with the possibility of movement and fixing in a predetermined position by means of screws 3, a plate 4 is placed.

On the basis of 1 and plate 4 there are places for installation of product elements, which are made in the form of rings 5 made of a material having a low coefficient of thermal linear expansion, for example, of ceramic. On the base 1 there is a mounting surface 6, and on the plate there is a hole (not indicated by the position).

It is very important to achieve the indicated technical result that the rings 5, on which the product flanges are laid, have a relatively small coefficient of thermal expansion and, when heated during brazing, practically do not change their geometric position relative to the initial one. As a result of this, during the entire soldering process, the initial relative arrangement of the elements of the brazed structure is maintained, the leashes and warpage of the brazed assembly are reduced.

The claimed device operates as follows.

We will consider the operation of the device using the example of soldering waveguide paths made in the form of a waveguide tube “a”, for example, a square section, and two flanges “b” along its ends.

To test the operability of the device, 5 waveguide paths were made from a temperature-stable 32NKD alloy, consisting of two flanges and a waveguide tube. Five waveguide paths were collected before soldering using the proposed device as follows. The waveguide pipe “a” was assembled with one of the flanges “b”, the assembly was mounted by a flange on the lower ring 5 with the positioning of the pipe “a” along the mounting surface 6 of the base 1. On the upper surface of the flange around the pipe, a PM17 solder ring was placed.

The plate 4 was moved along the uprights 2 and fixed with screws 3 in a predetermined position. In this case, the upper end of the pipe is passed through the hole of the plate. A second flange was put on the upper part of the pipe and moved until its surface contacted with a ring 5 mounted on the plate 4. On the upper surface of the flange around the pipe, a PM17 solder ring was placed. The remaining four waveguide paths were assembled in the same way.

Further, the fixtures with the assemblies were alternately placed in a vertical position on the working table of the bell-shaped vacuum furnace SGV-2.4-2 / 15. Soldering was carried out at a temperature of 1010-1020 ° C for 5 min under a vacuum of at least 10 ^-2 Pa. Cooling was carried out with the furnace. After soldering, product samples were subjected to visual inspection and measurement of deviations of geometric dimensions. As a result, it was found that the use of the claimed device allows to obtain soldered products with a deviation of geometric dimensions from the original to 0.1 mm., Instead of 0.5 mm., Using standard devices.

Claims (1)

A device for assembly under soldering of a part in the form of a waveguide path, consisting of two flanges and a waveguide tube, containing a base, racks fixed to it and a plate mounted on racks with the ability to move and fix in a predetermined position, while the base and plate are made with rings of material with a low coefficient of thermal expansion for mounting the flanges of the waveguide path on them, and the plate is made with an opening for passing through the waveguide tube.

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