RO102011B1 - Punching mould for printed circuits - Google Patents

Punching mould for printed circuits

Info

Publication number
RO102011B1
RO102011B1 RO135213A RO13521388A RO102011B1 RO 102011 B1 RO102011 B1 RO 102011B1 RO 135213 A RO135213 A RO 135213A RO 13521388 A RO13521388 A RO 13521388A RO 102011 B1 RO102011 B1 RO 102011B1
Authority
RO
Romania
Prior art keywords
mold
printed circuits
punching mould
guiding
plate
Prior art date
Application number
RO135213A
Other languages
Romanian (ro)
Other versions
RO102011A2 (en
Inventor
Dan Boboc
Original Assignee
Centrul De Cercetare Stiintifica Si Inginerie Tehnologica Pentru Utilaj Metalurgic Si Prese
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centrul De Cercetare Stiintifica Si Inginerie Tehnologica Pentru Utilaj Metalurgic Si Prese filed Critical Centrul De Cercetare Stiintifica Si Inginerie Tehnologica Pentru Utilaj Metalurgic Si Prese
Priority to RO1988135213A priority Critical patent/RO102011A2/en
Publication of RO102011B1 publication Critical patent/RO102011B1/en
Publication of RO102011A2 publication Critical patent/RO102011A2/en

Links

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

Inventia se refera la o matrita pentru perforarea circuitelor imprimate, în vederea plantarii componentelor electronice. Matrita, conform inventiei, se compune din niste poansoane dispuse dupa doua coordonate, blocate cu o placa de presiune pe care se prinde un compensator de cursa în sentrul de presiune al matritei, închis cu un capac în care se afla un piston cu cep de prindere si un amortizor, poansoanele patrunzând într-o placa port-poanson prevzuta cu perforatii si în care sunt presate niste bucse de ghidare prin care trec niste coloane de ghidare prevazute cu niste arcuri distantier sprijinite pe o placa de ghidare ce se aseaza peste semifabricatul dispus pe o placa activa.The invention relates to a mold for perforating printed circuit boards for planting electronic components. According to the invention, the mold consists of pins arranged in two coordinates, locked with a pressure plate on which a stroke compensator is attached to the mold depressor, closed with a lid having a piston with a clamping pin and a damper, the punches piercing into a perforated punch plate and in which there are pressed some guiding bushings through which some guiding columns provided with some spaced arcs are supported on a guide plate which is placed over the blank placed on an active plaque.

RO1988135213A 1988-09-21 1988-09-21 Punching mould for printed circuits RO102011A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
RO1988135213A RO102011A2 (en) 1988-09-21 1988-09-21 Punching mould for printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
RO1988135213A RO102011A2 (en) 1988-09-21 1988-09-21 Punching mould for printed circuits

Publications (2)

Publication Number Publication Date
RO102011B1 true RO102011B1 (en) 1991-08-30
RO102011A2 RO102011A2 (en) 1991-11-25

Family

ID=20122494

Family Applications (1)

Application Number Title Priority Date Filing Date
RO1988135213A RO102011A2 (en) 1988-09-21 1988-09-21 Punching mould for printed circuits

Country Status (1)

Country Link
RO (1) RO102011A2 (en)

Also Published As

Publication number Publication date
RO102011A2 (en) 1991-11-25

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