PT2414425E - Material de enchimento nuclear à base de resina de epoxi desenvolvendo baixo calor exotérmico - Google Patents

Material de enchimento nuclear à base de resina de epoxi desenvolvendo baixo calor exotérmico Download PDF

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Publication number
PT2414425E
PT2414425E PT107234114T PT10723411T PT2414425E PT 2414425 E PT2414425 E PT 2414425E PT 107234114 T PT107234114 T PT 107234114T PT 10723411 T PT10723411 T PT 10723411T PT 2414425 E PT2414425 E PT 2414425E
Authority
PT
Portugal
Prior art keywords
epoxy resin
filler material
resin based
based core
exothermic heat
Prior art date
Application number
PT107234114T
Other languages
English (en)
Portuguese (pt)
Inventor
Sohaib Elgimiabi
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of PT2414425E publication Critical patent/PT2414425E/pt

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C08K5/1539—Cyclic anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PT107234114T 2009-03-30 2010-03-26 Material de enchimento nuclear à base de resina de epoxi desenvolvendo baixo calor exotérmico PT2414425E (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0905362.0A GB0905362D0 (en) 2009-03-30 2009-03-30 Fire resistant epoxy resin based core filler material developing low exothermic heat

Publications (1)

Publication Number Publication Date
PT2414425E true PT2414425E (pt) 2014-06-25

Family

ID=40671879

Family Applications (1)

Application Number Title Priority Date Filing Date
PT107234114T PT2414425E (pt) 2009-03-30 2010-03-26 Material de enchimento nuclear à base de resina de epoxi desenvolvendo baixo calor exotérmico

Country Status (12)

Country Link
US (1) US8779032B2 (OSRAM)
EP (1) EP2414425B1 (OSRAM)
JP (1) JP5508516B2 (OSRAM)
KR (1) KR101709360B1 (OSRAM)
CN (1) CN102378772B (OSRAM)
BR (1) BRPI1014695A2 (OSRAM)
CA (1) CA2756886C (OSRAM)
ES (1) ES2473968T3 (OSRAM)
GB (1) GB0905362D0 (OSRAM)
PL (1) PL2414425T3 (OSRAM)
PT (1) PT2414425E (OSRAM)
WO (1) WO2010117669A1 (OSRAM)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0905362D0 (en) 2009-03-30 2009-05-13 3M Innovative Properties Co Fire resistant epoxy resin based core filler material developing low exothermic heat
EP2470583A1 (en) * 2009-08-27 2012-07-04 ABB Research Ltd. Curable epoxy resin composition
JP2014520937A (ja) * 2011-07-15 2014-08-25 ビーエーエスエフ ソシエタス・ヨーロピア エポキシ系における促進剤としてのポリエーテルアミン
EP2653486B1 (en) * 2012-04-20 2014-12-03 3M Innovative Properties Company Low density epoxy composition with low water uptake
EP2818490B1 (en) * 2013-06-28 2019-04-10 3M Innovative Properties Company Use of an epoxy resin-based composition as a filler honeycomb cells
JP6200715B2 (ja) * 2013-07-24 2017-09-20 ナミックス株式会社 エポキシ樹脂組成物、アンダーフィル剤、接着剤、および半導体装置
ES2625552T3 (es) 2014-06-17 2017-07-19 3M Innovative Properties Company Composición de adhesivo epoxídico de curado rápido
US20170218237A1 (en) 2014-08-12 2017-08-03 3M Innovative Properties Company Film adhesive
US10662302B2 (en) * 2014-09-23 2020-05-26 The Boeing Company Polymer nanoparticles for improved distortion capability in composites
CN105000129B (zh) * 2015-04-08 2017-04-05 江苏宏强船舶重工有限公司 一种小型船滑油循环舱保护结构的施工工艺
EP3162829B1 (en) * 2015-10-29 2018-08-15 3M Innovative Properties Company Rapid curing and high thixotropy epoxy adhesive compositions
EP3239207B1 (en) 2016-04-27 2021-07-28 3M Innovative Properties Company Curable epoxy compositions
EP3333211B1 (en) 2016-12-09 2020-10-14 3M Innovative Properties Company Composite article comprising a honeycomb structure comprising hot/wet resistant low density epoxy compositions
WO2018160520A1 (en) * 2017-03-01 2018-09-07 Purdue Research Foundation Epoxy tannin reaction product compositions
CA3109888A1 (en) * 2018-08-21 2020-02-27 Evonik Operations Gmbh Fast curing epoxy system for producing rigid foam and use of the foam in composites or as insulation material
EP3666812B1 (en) * 2018-12-13 2021-10-13 3M Innovative Properties Company Room temperature stable one-part void filler
WO2020131946A1 (en) * 2018-12-18 2020-06-25 Cytec Industries Inc. Flame-retardant epoxy composition and method of using the same
RU2747941C1 (ru) * 2020-03-03 2021-05-17 Общество с ограниченной ответственностью "Архитектурно-конструкторское бюро Монолит" (ООО "АКБ Монолит") Ячеистая негорючая эпоксидная композиция
CN112646521B (zh) * 2020-12-18 2022-02-11 深圳市彩田化工有限公司 一种低放热环氧树脂胶的制备工艺
CN113789034B (zh) * 2021-10-13 2023-07-14 航天特种材料及工艺技术研究所 一种低放热量环氧树脂组合物及其制备方法
EP4310127B1 (en) 2022-07-19 2025-05-14 3M Innovative Properties Company Low density potting adhesive

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3205914B2 (ja) * 1991-09-13 2001-09-04 大倉工業株式会社 エポキシ樹脂組成物
US5679719A (en) * 1993-03-24 1997-10-21 Loctite Corporation Method of preparing fiber/resin composites
JPH07216057A (ja) * 1994-01-27 1995-08-15 Bridgestone Corp エポキシ樹脂組成物
ES2118521T3 (es) 1994-03-10 1998-09-16 Ciba Geigy Ag Sistemas de resinas epoxi reticulables termicamente con un buen comportamiento de reactividad/estabilidad.
US5597886A (en) * 1994-03-10 1997-01-28 Ciba-Geigy Corporation Heat-curable epoxy resin systems having a good reactivity/stability ratio
ATE238369T1 (de) 1995-11-18 2003-05-15 Vantico Ag Pulverförmige reaktionsharzzusammensetzungen
CA2346952C (en) 1998-10-23 2008-03-18 Vantico Ag Method for filling and reinforcing honeycomb sandwich panels
US6534181B2 (en) * 2000-03-27 2003-03-18 Neltec, Inc. Styrene-maleic anhydride copolymer and epoxy resin blend crosslinked with multifunctional amine compounds
EP1674518A1 (en) * 2004-12-23 2006-06-28 3M Innovative Properties Company Fire-retardant low-density epoxy composition
US8475694B2 (en) * 2005-10-25 2013-07-02 Zephyros, Inc. Shaped expandable material
GB0905362D0 (en) 2009-03-30 2009-05-13 3M Innovative Properties Co Fire resistant epoxy resin based core filler material developing low exothermic heat

Also Published As

Publication number Publication date
US20120022185A1 (en) 2012-01-26
CN102378772B (zh) 2014-07-09
CA2756886C (en) 2017-06-13
EP2414425A1 (en) 2012-02-08
CA2756886A1 (en) 2010-10-14
JP5508516B2 (ja) 2014-06-04
PL2414425T3 (pl) 2014-09-30
JP2012522113A (ja) 2012-09-20
GB0905362D0 (en) 2009-05-13
CN102378772A (zh) 2012-03-14
BRPI1014695A2 (pt) 2016-04-12
EP2414425B1 (en) 2014-04-23
WO2010117669A1 (en) 2010-10-14
US8779032B2 (en) 2014-07-15
KR20120013349A (ko) 2012-02-14
KR101709360B1 (ko) 2017-02-22
ES2473968T3 (es) 2014-07-08

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