CA2756886C - Epoxy resin based core filler material developing low exothermic heat - Google Patents
Epoxy resin based core filler material developing low exothermic heat Download PDFInfo
- Publication number
- CA2756886C CA2756886C CA2756886A CA2756886A CA2756886C CA 2756886 C CA2756886 C CA 2756886C CA 2756886 A CA2756886 A CA 2756886A CA 2756886 A CA2756886 A CA 2756886A CA 2756886 C CA2756886 C CA 2756886C
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- CA
- Canada
- Prior art keywords
- composition
- curable composition
- epoxy resin
- weight
- amine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 60
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 59
- 239000000945 filler Substances 0.000 title claims abstract description 39
- 239000000463 material Substances 0.000 title claims abstract description 24
- 239000000203 mixture Substances 0.000 claims abstract description 166
- 150000001412 amines Chemical class 0.000 claims abstract description 61
- 239000004848 polyfunctional curative Substances 0.000 claims abstract description 27
- 238000002844 melting Methods 0.000 claims abstract description 22
- 230000008018 melting Effects 0.000 claims abstract description 22
- 150000002118 epoxides Chemical class 0.000 claims abstract description 21
- 125000003118 aryl group Chemical group 0.000 claims abstract description 20
- -1 aluminium group hydroxides Chemical class 0.000 claims abstract description 17
- 239000003063 flame retardant Substances 0.000 claims abstract description 17
- 150000001875 compounds Chemical class 0.000 claims abstract description 15
- 150000003141 primary amines Chemical group 0.000 claims abstract description 15
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 14
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910001860 alkaline earth metal hydroxide Inorganic materials 0.000 claims abstract description 7
- 150000004982 aromatic amines Chemical group 0.000 claims abstract description 7
- 238000011049 filling Methods 0.000 claims abstract description 5
- 230000008569 process Effects 0.000 claims abstract description 4
- 238000001125 extrusion Methods 0.000 claims description 19
- 150000002989 phenols Chemical class 0.000 claims description 11
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 10
- 229920003986 novolac Polymers 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 9
- 125000004122 cyclic group Chemical group 0.000 claims description 7
- 239000007795 chemical reaction product Substances 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 description 38
- 239000002243 precursor Substances 0.000 description 37
- 238000001723 curing Methods 0.000 description 33
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 25
- 238000012360 testing method Methods 0.000 description 20
- 239000004005 microsphere Substances 0.000 description 14
- 239000000126 substance Substances 0.000 description 13
- 239000000779 smoke Substances 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 9
- 150000008064 anhydrides Chemical class 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 6
- 238000009472 formulation Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 239000004615 ingredient Substances 0.000 description 5
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- 239000000843 powder Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
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- 238000010998 test method Methods 0.000 description 5
- 239000013008 thixotropic agent Substances 0.000 description 5
- 239000000080 wetting agent Substances 0.000 description 5
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
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- 238000004132 cross linking Methods 0.000 description 4
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 4
- 239000003085 diluting agent Substances 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
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- 239000012766 organic filler Substances 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000011800 void material Substances 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
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- 239000012745 toughening agent Substances 0.000 description 3
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 3
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- 229920003344 Epilox® Polymers 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- 230000009970 fire resistant effect Effects 0.000 description 2
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
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- SLBDZIKCTKBNEB-UHFFFAOYSA-N 1,1-diphenylpentane-2,2-diol Chemical compound C=1C=CC=CC=1C(C(O)(O)CCC)C1=CC=CC=C1 SLBDZIKCTKBNEB-UHFFFAOYSA-N 0.000 description 1
- XPRCUIHVISJANL-UHFFFAOYSA-N 1,3,3-triphenylpropan-1-ol Chemical compound C=1C=CC=CC=1C(O)CC(C=1C=CC=CC=1)C1=CC=CC=C1 XPRCUIHVISJANL-UHFFFAOYSA-N 0.000 description 1
- WTFAGPBUAGFMQX-UHFFFAOYSA-N 1-[2-[2-(2-aminopropoxy)propoxy]propoxy]propan-2-amine Chemical class CC(N)COCC(C)OCC(C)OCC(C)N WTFAGPBUAGFMQX-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- KLQLCYSCZWVHPO-UHFFFAOYSA-N 2,2-diphenylcyclohexan-1-ol Chemical compound OC1CCCCC1(C=1C=CC=CC=1)C1=CC=CC=C1 KLQLCYSCZWVHPO-UHFFFAOYSA-N 0.000 description 1
- LCVCUJWKJNFDMY-UHFFFAOYSA-N 2,2-diphenylpropane-1,1-diol Chemical compound C=1C=CC=CC=1C(C(O)O)(C)C1=CC=CC=C1 LCVCUJWKJNFDMY-UHFFFAOYSA-N 0.000 description 1
- RLGJEXKWRUSFFN-UHFFFAOYSA-N 2-(1,1-diphenylpentyl)phenol Chemical compound C=1C=CC=CC=1C(C=1C(=CC=CC=1)O)(CCCC)C1=CC=CC=C1 RLGJEXKWRUSFFN-UHFFFAOYSA-N 0.000 description 1
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- IHANUNPCBRUNKB-UHFFFAOYSA-N 3-(1-bicyclo[2.2.1]hept-2-enyl)-2-methoxycarbonylbenzoic acid Chemical compound COC(=O)C1=C(C=CC=C1C23CCC(C2)C=C3)C(=O)O IHANUNPCBRUNKB-UHFFFAOYSA-N 0.000 description 1
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- 239000011236 particulate material Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- XZTOTRSSGPPNTB-UHFFFAOYSA-N phosphono dihydrogen phosphate;1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.OP(O)(=O)OP(O)(O)=O XZTOTRSSGPPNTB-UHFFFAOYSA-N 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- QVJYHZQHDMNONA-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1.NC1=NC(N)=NC(N)=N1 QVJYHZQHDMNONA-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N phthalic anhydride Chemical class C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
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- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
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- 229910052725 zinc Inorganic materials 0.000 description 1
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Classifications
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1535—Five-membered rings
- C08K5/1539—Cyclic anhydrides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0905362.0A GB0905362D0 (en) | 2009-03-30 | 2009-03-30 | Fire resistant epoxy resin based core filler material developing low exothermic heat |
| GB0905362.0 | 2009-03-30 | ||
| PCT/US2010/028778 WO2010117669A1 (en) | 2009-03-30 | 2010-03-26 | Epoxy resin based core filler material developing low exothermic heat |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2756886A1 CA2756886A1 (en) | 2010-10-14 |
| CA2756886C true CA2756886C (en) | 2017-06-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2756886A Expired - Fee Related CA2756886C (en) | 2009-03-30 | 2010-03-26 | Epoxy resin based core filler material developing low exothermic heat |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US8779032B2 (OSRAM) |
| EP (1) | EP2414425B1 (OSRAM) |
| JP (1) | JP5508516B2 (OSRAM) |
| KR (1) | KR101709360B1 (OSRAM) |
| CN (1) | CN102378772B (OSRAM) |
| BR (1) | BRPI1014695A2 (OSRAM) |
| CA (1) | CA2756886C (OSRAM) |
| ES (1) | ES2473968T3 (OSRAM) |
| GB (1) | GB0905362D0 (OSRAM) |
| PL (1) | PL2414425T3 (OSRAM) |
| PT (1) | PT2414425E (OSRAM) |
| WO (1) | WO2010117669A1 (OSRAM) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0905362D0 (en) | 2009-03-30 | 2009-05-13 | 3M Innovative Properties Co | Fire resistant epoxy resin based core filler material developing low exothermic heat |
| EP2470583A1 (en) * | 2009-08-27 | 2012-07-04 | ABB Research Ltd. | Curable epoxy resin composition |
| JP2014520937A (ja) * | 2011-07-15 | 2014-08-25 | ビーエーエスエフ ソシエタス・ヨーロピア | エポキシ系における促進剤としてのポリエーテルアミン |
| EP2653486B1 (en) * | 2012-04-20 | 2014-12-03 | 3M Innovative Properties Company | Low density epoxy composition with low water uptake |
| EP2818490B1 (en) * | 2013-06-28 | 2019-04-10 | 3M Innovative Properties Company | Use of an epoxy resin-based composition as a filler honeycomb cells |
| JP6200715B2 (ja) * | 2013-07-24 | 2017-09-20 | ナミックス株式会社 | エポキシ樹脂組成物、アンダーフィル剤、接着剤、および半導体装置 |
| ES2625552T3 (es) | 2014-06-17 | 2017-07-19 | 3M Innovative Properties Company | Composición de adhesivo epoxídico de curado rápido |
| US20170218237A1 (en) | 2014-08-12 | 2017-08-03 | 3M Innovative Properties Company | Film adhesive |
| US10662302B2 (en) * | 2014-09-23 | 2020-05-26 | The Boeing Company | Polymer nanoparticles for improved distortion capability in composites |
| CN105000129B (zh) * | 2015-04-08 | 2017-04-05 | 江苏宏强船舶重工有限公司 | 一种小型船滑油循环舱保护结构的施工工艺 |
| EP3162829B1 (en) * | 2015-10-29 | 2018-08-15 | 3M Innovative Properties Company | Rapid curing and high thixotropy epoxy adhesive compositions |
| EP3239207B1 (en) | 2016-04-27 | 2021-07-28 | 3M Innovative Properties Company | Curable epoxy compositions |
| EP3333211B1 (en) | 2016-12-09 | 2020-10-14 | 3M Innovative Properties Company | Composite article comprising a honeycomb structure comprising hot/wet resistant low density epoxy compositions |
| WO2018160520A1 (en) * | 2017-03-01 | 2018-09-07 | Purdue Research Foundation | Epoxy tannin reaction product compositions |
| CA3109888A1 (en) * | 2018-08-21 | 2020-02-27 | Evonik Operations Gmbh | Fast curing epoxy system for producing rigid foam and use of the foam in composites or as insulation material |
| EP3666812B1 (en) * | 2018-12-13 | 2021-10-13 | 3M Innovative Properties Company | Room temperature stable one-part void filler |
| WO2020131946A1 (en) * | 2018-12-18 | 2020-06-25 | Cytec Industries Inc. | Flame-retardant epoxy composition and method of using the same |
| RU2747941C1 (ru) * | 2020-03-03 | 2021-05-17 | Общество с ограниченной ответственностью "Архитектурно-конструкторское бюро Монолит" (ООО "АКБ Монолит") | Ячеистая негорючая эпоксидная композиция |
| CN112646521B (zh) * | 2020-12-18 | 2022-02-11 | 深圳市彩田化工有限公司 | 一种低放热环氧树脂胶的制备工艺 |
| CN113789034B (zh) * | 2021-10-13 | 2023-07-14 | 航天特种材料及工艺技术研究所 | 一种低放热量环氧树脂组合物及其制备方法 |
| EP4310127B1 (en) | 2022-07-19 | 2025-05-14 | 3M Innovative Properties Company | Low density potting adhesive |
Family Cites Families (11)
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| JP3205914B2 (ja) * | 1991-09-13 | 2001-09-04 | 大倉工業株式会社 | エポキシ樹脂組成物 |
| US5679719A (en) * | 1993-03-24 | 1997-10-21 | Loctite Corporation | Method of preparing fiber/resin composites |
| JPH07216057A (ja) * | 1994-01-27 | 1995-08-15 | Bridgestone Corp | エポキシ樹脂組成物 |
| ES2118521T3 (es) | 1994-03-10 | 1998-09-16 | Ciba Geigy Ag | Sistemas de resinas epoxi reticulables termicamente con un buen comportamiento de reactividad/estabilidad. |
| US5597886A (en) * | 1994-03-10 | 1997-01-28 | Ciba-Geigy Corporation | Heat-curable epoxy resin systems having a good reactivity/stability ratio |
| ATE238369T1 (de) | 1995-11-18 | 2003-05-15 | Vantico Ag | Pulverförmige reaktionsharzzusammensetzungen |
| CA2346952C (en) | 1998-10-23 | 2008-03-18 | Vantico Ag | Method for filling and reinforcing honeycomb sandwich panels |
| US6534181B2 (en) * | 2000-03-27 | 2003-03-18 | Neltec, Inc. | Styrene-maleic anhydride copolymer and epoxy resin blend crosslinked with multifunctional amine compounds |
| EP1674518A1 (en) * | 2004-12-23 | 2006-06-28 | 3M Innovative Properties Company | Fire-retardant low-density epoxy composition |
| US8475694B2 (en) * | 2005-10-25 | 2013-07-02 | Zephyros, Inc. | Shaped expandable material |
| GB0905362D0 (en) | 2009-03-30 | 2009-05-13 | 3M Innovative Properties Co | Fire resistant epoxy resin based core filler material developing low exothermic heat |
-
2009
- 2009-03-30 GB GBGB0905362.0A patent/GB0905362D0/en not_active Ceased
-
2010
- 2010-03-26 EP EP10723411.4A patent/EP2414425B1/en active Active
- 2010-03-26 ES ES10723411.4T patent/ES2473968T3/es active Active
- 2010-03-26 PL PL10723411T patent/PL2414425T3/pl unknown
- 2010-03-26 PT PT107234114T patent/PT2414425E/pt unknown
- 2010-03-26 CA CA2756886A patent/CA2756886C/en not_active Expired - Fee Related
- 2010-03-26 JP JP2012503527A patent/JP5508516B2/ja not_active Expired - Fee Related
- 2010-03-26 BR BRPI1014695A patent/BRPI1014695A2/pt not_active Application Discontinuation
- 2010-03-26 US US13/258,665 patent/US8779032B2/en active Active
- 2010-03-26 WO PCT/US2010/028778 patent/WO2010117669A1/en not_active Ceased
- 2010-03-26 KR KR1020117025459A patent/KR101709360B1/ko not_active Expired - Fee Related
- 2010-03-26 CN CN201080014967.5A patent/CN102378772B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20120022185A1 (en) | 2012-01-26 |
| CN102378772B (zh) | 2014-07-09 |
| EP2414425A1 (en) | 2012-02-08 |
| CA2756886A1 (en) | 2010-10-14 |
| JP5508516B2 (ja) | 2014-06-04 |
| PL2414425T3 (pl) | 2014-09-30 |
| JP2012522113A (ja) | 2012-09-20 |
| GB0905362D0 (en) | 2009-05-13 |
| CN102378772A (zh) | 2012-03-14 |
| BRPI1014695A2 (pt) | 2016-04-12 |
| EP2414425B1 (en) | 2014-04-23 |
| WO2010117669A1 (en) | 2010-10-14 |
| US8779032B2 (en) | 2014-07-15 |
| KR20120013349A (ko) | 2012-02-14 |
| PT2414425E (pt) | 2014-06-25 |
| KR101709360B1 (ko) | 2017-02-22 |
| ES2473968T3 (es) | 2014-07-08 |
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| EEER | Examination request |
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| MKLA | Lapsed |
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