PT2212909T - Sistema e método de inspeção de defeitos de bolacha gravada - Google Patents
Sistema e método de inspeção de defeitos de bolacha gravadaInfo
- Publication number
- PT2212909T PT2212909T PT87941910T PT08794191T PT2212909T PT 2212909 T PT2212909 T PT 2212909T PT 87941910 T PT87941910 T PT 87941910T PT 08794191 T PT08794191 T PT 08794191T PT 2212909 T PT2212909 T PT 2212909T
- Authority
- PT
- Portugal
- Prior art keywords
- inspection system
- defect inspection
- patterned wafer
- wafer defect
- patterned
- Prior art date
Links
- 230000007547 defect Effects 0.000 title 1
- 238000007689 inspection Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/888,827 US8401272B2 (en) | 2007-08-02 | 2007-08-02 | Patterned wafer defect inspection system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PT2212909T true PT2212909T (pt) | 2020-03-31 |
Family
ID=40305081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PT87941910T PT2212909T (pt) | 2007-08-02 | 2008-08-01 | Sistema e método de inspeção de defeitos de bolacha gravada |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US8401272B2 (pt) |
| EP (1) | EP2212909B1 (pt) |
| KR (1) | KR101591374B1 (pt) |
| CN (2) | CN101358935B (pt) |
| CA (1) | CA2638415C (pt) |
| HK (1) | HK1199145A1 (pt) |
| MY (1) | MY160426A (pt) |
| PT (1) | PT2212909T (pt) |
| SG (1) | SG149809A1 (pt) |
| TW (1) | TWI477790B (pt) |
| WO (1) | WO2009017465A2 (pt) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8682056B2 (en) * | 2008-06-30 | 2014-03-25 | Ncr Corporation | Media identification |
| US8571299B2 (en) | 2010-08-30 | 2013-10-29 | International Business Machines Corporation | Identifying defects |
| JP6041865B2 (ja) * | 2011-04-26 | 2016-12-14 | ケーエルエー−テンカー コーポレイション | ハイブリッドレチクル検査のための方法及びシステム |
| PT3005412T (pt) * | 2013-06-07 | 2020-01-20 | Semiconductor Tech & Instruments Pte Ltd | Sistemas e métodos para verificar automaticamente se a remoção de pastilhas desde suportes de película é correta |
| US10127652B2 (en) * | 2014-02-06 | 2018-11-13 | Kla-Tencor Corp. | Defect detection and classification based on attributes determined from a standard reference image |
| US10475178B1 (en) * | 2017-01-30 | 2019-11-12 | Kla-Tencor Corporation | System, method and computer program product for inspecting a wafer using a film thickness map generated for the wafer |
| CN107729635B (zh) * | 2017-09-30 | 2018-12-21 | 英特尔产品（成都）有限公司 | 半导体芯片合格性检查方法及装置 |
| WO2023130432A1 (en) * | 2022-01-10 | 2023-07-13 | Applied Materials, Inc. | Template-based image processing for target segmentation and metrology |
| CN115876784B (zh) * | 2023-01-31 | 2023-05-26 | 眉山博雅新材料股份有限公司 | 一种工件缺陷检测方法、系统和设备 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5640200A (en) * | 1994-08-31 | 1997-06-17 | Cognex Corporation | Golden template comparison using efficient image registration |
| US5850466A (en) * | 1995-02-22 | 1998-12-15 | Cognex Corporation | Golden template comparison for rotated and/or scaled images |
| AU6043998A (en) * | 1997-01-21 | 1998-08-07 | Sekidenko Incorporated | Method for controlling the temperature of a growing semiconductor layer |
| US6330354B1 (en) * | 1997-05-01 | 2001-12-11 | International Business Machines Corporation | Method of analyzing visual inspection image data to find defects on a device |
| JP3534582B2 (ja) * | 1997-10-02 | 2004-06-07 | 株式会社日立製作所 | パターン欠陥検査方法および検査装置 |
| JP2002100660A (ja) * | 2000-07-18 | 2002-04-05 | Hitachi Ltd | 欠陥検出方法と欠陥観察方法及び欠陥検出装置 |
| US6920241B1 (en) * | 2000-09-29 | 2005-07-19 | Cognex Corporation | System and method for bundled location and regional inspection |
| US6627863B2 (en) * | 2000-12-15 | 2003-09-30 | Mitutoyo Corporation | System and methods to determine the settings of multiple light sources in a vision system |
| JP4014379B2 (ja) * | 2001-02-21 | 2007-11-28 | 株式会社日立製作所 | 欠陥レビュー装置及び方法 |
| SE0101486D0 (sv) * | 2001-04-27 | 2001-04-27 | Smart Eye Ab | Method for automatic tracking of a moving body |
| JP4122735B2 (ja) | 2001-07-24 | 2008-07-23 | 株式会社日立製作所 | 半導体デバイスの検査方法および検査条件設定方法 |
| US7265382B2 (en) * | 2002-11-12 | 2007-09-04 | Applied Materials, Inc. | Method and apparatus employing integrated metrology for improved dielectric etch efficiency |
| JP4334927B2 (ja) * | 2003-06-27 | 2009-09-30 | キヤノン株式会社 | 半導体レーザーダイオードチップの検査方法および検査装置 |
| US7366321B2 (en) * | 2004-06-18 | 2008-04-29 | Agilent Technologies, Inc. | System and method for performing automated optical inspection of objects |
| US7813541B2 (en) * | 2005-02-28 | 2010-10-12 | Applied Materials South East Asia Pte. Ltd. | Method and apparatus for detecting defects in wafers |
-
2007
- 2007-08-02 US US11/888,827 patent/US8401272B2/en active Active
-
2008
- 2008-07-30 MY MYPI20082845A patent/MY160426A/en unknown
- 2008-07-30 CA CA2638415A patent/CA2638415C/en active Active
- 2008-07-31 SG SG200805697-0A patent/SG149809A1/en unknown
- 2008-08-01 KR KR1020080075568A patent/KR101591374B1/ko active IP Right Grant
- 2008-08-01 PT PT87941910T patent/PT2212909T/pt unknown
- 2008-08-01 EP EP08794191.0A patent/EP2212909B1/en active Active
- 2008-08-01 TW TW097129438A patent/TWI477790B/zh active
- 2008-08-01 WO PCT/SG2008/000286 patent/WO2009017465A2/en active Application Filing
- 2008-08-04 CN CN200810210608.1A patent/CN101358935B/zh active Active
- 2008-08-04 CN CN201410143477.5A patent/CN103972124B/zh active Active
-
2014
- 2014-12-16 HK HK14112615.4A patent/HK1199145A1/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW200921120A (en) | 2009-05-16 |
| CN101358935A (zh) | 2009-02-04 |
| CA2638415C (en) | 2016-07-19 |
| CN103972124A (zh) | 2014-08-06 |
| TWI477790B (zh) | 2015-03-21 |
| WO2009017465A3 (en) | 2009-04-09 |
| EP2212909B1 (en) | 2019-12-25 |
| US20090034831A1 (en) | 2009-02-05 |
| HK1199145A1 (en) | 2015-06-19 |
| US8401272B2 (en) | 2013-03-19 |
| CN103972124B (zh) | 2021-10-22 |
| EP2212909A2 (en) | 2010-08-04 |
| KR101591374B1 (ko) | 2016-02-04 |
| CA2638415A1 (en) | 2009-02-02 |
| MY160426A (en) | 2017-03-15 |
| KR20090013730A (ko) | 2009-02-05 |
| EP2212909A4 (en) | 2016-05-11 |
| SG149809A1 (en) | 2009-02-27 |
| CN101358935B (zh) | 2014-05-07 |
| WO2009017465A2 (en) | 2009-02-05 |
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