PL3751975T3 - Sprężynowy element nośny - Google Patents

Sprężynowy element nośny

Info

Publication number
PL3751975T3
PL3751975T3 PL20173576.8T PL20173576T PL3751975T3 PL 3751975 T3 PL3751975 T3 PL 3751975T3 PL 20173576 T PL20173576 T PL 20173576T PL 3751975 T3 PL3751975 T3 PL 3751975T3
Authority
PL
Poland
Prior art keywords
bearing element
spring bearing
spring
bearing
Prior art date
Application number
PL20173576.8T
Other languages
English (en)
Inventor
Neil Short
Sam Staniland
Original Assignee
Asmpt Smt Singapore Pte. Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asmpt Smt Singapore Pte. Ltd filed Critical Asmpt Smt Singapore Pte. Ltd
Publication of PL3751975T3 publication Critical patent/PL3751975T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B5/00—Clamps
    • B25B5/06—Arrangements for positively actuating jaws
    • B25B5/08—Arrangements for positively actuating jaws using cams
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F1/00—Springs
    • F16F1/02—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant
    • F16F1/025—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant characterised by having a particular shape
    • F16F1/027—Planar, e.g. in sheet form; leaf springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PL20173576.8T 2019-06-11 2020-05-07 Sprężynowy element nośny PL3751975T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1908304.7A GB2584680A (en) 2019-06-11 2019-06-11 Sprung carrier

Publications (1)

Publication Number Publication Date
PL3751975T3 true PL3751975T3 (pl) 2023-07-31

Family

ID=67386239

Family Applications (1)

Application Number Title Priority Date Filing Date
PL20173576.8T PL3751975T3 (pl) 2019-06-11 2020-05-07 Sprężynowy element nośny

Country Status (9)

Country Link
US (1) US11305404B2 (pl)
EP (1) EP3751975B1 (pl)
JP (1) JP7000502B2 (pl)
KR (1) KR102394018B1 (pl)
CN (1) CN112074083B (pl)
GB (1) GB2584680A (pl)
HU (1) HUE062344T2 (pl)
PL (1) PL3751975T3 (pl)
TW (1) TWI731644B (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113766744A (zh) * 2021-09-01 2021-12-07 北京机械设备研究所 用于印制板制造的托盘载具及其散热方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4591053A (en) * 1984-07-06 1986-05-27 Gibson-Egan Company Integrated circuit carrier
US4549651A (en) * 1984-12-21 1985-10-29 Alemanni James C Carrier for pin grid array
US4620632A (en) * 1984-12-21 1986-11-04 Alemanni James C Carriers for pin grid array
JPH06180345A (ja) 1992-12-14 1994-06-28 Fujitsu Ltd 半導体装置収納用トレイ及び半導体装置の試験装置，試験方法
KR100398321B1 (ko) * 1996-11-06 2004-01-24 삼성전자주식회사 단배열 모쥴 인쇄회로기판 로딩/언로딩 방법
JPH11233997A (ja) * 1998-02-10 1999-08-27 Daishinku:Kk 電子部品用位置決め装置
KR100276826B1 (ko) * 1998-04-20 2001-01-15 윤종용 패키지되지않은칩을테스트하기위한케리어
US6012713A (en) * 1998-12-23 2000-01-11 Gleason Service Company, L.C. Reflow pallet with lever arm
US6636060B1 (en) * 1999-07-16 2003-10-21 Advantest Corporation Insert for electric devices testing apparatus
TWI271837B (en) * 2005-11-25 2007-01-21 Ind Tech Res Inst Clamping device for a flexible and method for fabricating the same
GB2443659A (en) * 2006-11-13 2008-05-14 Dek Int Gmbh Workpiece carrier for supporting a plurality of workpieces
JP2009096523A (ja) * 2007-10-17 2009-05-07 Panasonic Corp 電子部品の搬送フレームおよび電子部品の製造方法
US8485511B2 (en) * 2009-03-11 2013-07-16 Centipede Systems, Inc. Method and apparatus for holding microelectronic devices
MY154258A (en) 2009-08-18 2015-05-29 Multitest Elektronische Syst Elastic unit exerting two angled force components on an abutting section of an align fixture
MY151553A (en) * 2009-08-18 2014-06-13 Multitest Elektronische Syst Two abutting sections of an align fixture together floatingly engaging an electronic component
MY160276A (en) * 2009-08-18 2017-02-28 Multitest Elektronische Systeme Gmbh An elastic unit as a separate elastic member to be mounted at an elastic unit receiving section of an align fixture
US8931772B2 (en) * 2010-02-03 2015-01-13 Steven E. Phillips Method and apparatus for securing a workpiece to a fixture plate using an adjustable, low-profile, light-duty workpiece clamp
US8622764B2 (en) * 2011-02-09 2014-01-07 Intel Corporation Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices
US20130250471A1 (en) 2012-03-22 2013-09-26 Component Re-Engineering Company, Inc. Compressible conductive element for use in current-carrying structure
JP6396133B2 (ja) * 2014-09-17 2018-09-26 京セラ株式会社 クランパー及び搬送治具
EP3007217A1 (en) * 2014-10-10 2016-04-13 Rasco GmbH Chip tray
TWM499643U (zh) * 2014-11-03 2015-04-21 Unimicron Technology Corp 夾持組件與承載治具
JP6816870B2 (ja) * 2016-08-02 2021-01-20 東洋精密工業株式会社 部品一体型クランプトレイ
CN108698209B (zh) * 2017-12-29 2021-03-19 深圳市大疆创新科技有限公司 一种定位夹具及组装设备

Also Published As

Publication number Publication date
KR102394018B1 (ko) 2022-05-06
CN112074083A (zh) 2020-12-11
JP2020202376A (ja) 2020-12-17
KR20200141928A (ko) 2020-12-21
TW202045296A (zh) 2020-12-16
JP7000502B2 (ja) 2022-01-19
US11305404B2 (en) 2022-04-19
EP3751975B1 (en) 2023-03-29
GB2584680A (en) 2020-12-16
EP3751975A1 (en) 2020-12-16
TWI731644B (zh) 2021-06-21
GB201908304D0 (en) 2019-07-24
HUE062344T2 (hu) 2023-10-28
CN112074083B (zh) 2024-07-23
US20200391355A1 (en) 2020-12-17

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