PL3001394T3 - Sposób wytwarzania kombinacji etykiety przeciwkradzieżowej i śledzącej - Google Patents

Sposób wytwarzania kombinacji etykiety przeciwkradzieżowej i śledzącej

Info

Publication number
PL3001394T3
PL3001394T3 PL15186493T PL15186493T PL3001394T3 PL 3001394 T3 PL3001394 T3 PL 3001394T3 PL 15186493 T PL15186493 T PL 15186493T PL 15186493 T PL15186493 T PL 15186493T PL 3001394 T3 PL3001394 T3 PL 3001394T3
Authority
PL
Poland
Prior art keywords
theft
manufacturing
tracking tag
combination anti
combination
Prior art date
Application number
PL15186493T
Other languages
English (en)
Inventor
George West
Takeshi Matsumoto
Kenichiro Uemizu
Original Assignee
Checkpoint Systems, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Checkpoint Systems, Inc. filed Critical Checkpoint Systems, Inc.
Publication of PL3001394T3 publication Critical patent/PL3001394T3/pl

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321After treatment
    • H01L21/3213Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G06K19/0724Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement being a circuit for communicating at a plurality of frequencies, e.g. for managing time multiplexed communication over at least two antennas of different types
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07767Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the first and second communication means being two different antennas types, e.g. dipole and coil type, or two antennas of the same kind but operating at different frequencies
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07775Antenna details the antenna being on-chip
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428Tag details
    • G08B13/2437Tag layered structure, processes for making layered tags
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/32Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers using masks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40Capacitors
    • H01L28/60Electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Computer Security & Cryptography (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Details Of Aerials (AREA)
  • Burglar Alarm Systems (AREA)
PL15186493T 2014-09-24 2015-09-23 Sposób wytwarzania kombinacji etykiety przeciwkradzieżowej i śledzącej PL3001394T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/495,359 US9299586B1 (en) 2014-09-24 2014-09-24 Process for manufacturing a combination anti-theft and tracking tag
EP15186493.1A EP3001394B1 (en) 2014-09-24 2015-09-23 Process for manufacturing a combination anti-theft and tracking tag

Publications (1)

Publication Number Publication Date
PL3001394T3 true PL3001394T3 (pl) 2018-10-31

Family

ID=54199564

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15186493T PL3001394T3 (pl) 2014-09-24 2015-09-23 Sposób wytwarzania kombinacji etykiety przeciwkradzieżowej i śledzącej

Country Status (5)

Country Link
US (1) US9299586B1 (pl)
EP (1) EP3001394B1 (pl)
CN (1) CN105447555A (pl)
ES (1) ES2679529T3 (pl)
PL (1) PL3001394T3 (pl)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2491447B (en) * 2010-03-24 2014-10-22 Murata Manufacturing Co RFID system
JP6724866B2 (ja) * 2017-06-05 2020-07-15 株式会社村田製作所 コイル部品およびその周波数特性の変更方法
CA3068284A1 (en) * 2017-06-22 2018-12-27 Checkpoint Systems, Inc. Detectable folded coil
US11282357B2 (en) * 2018-05-22 2022-03-22 Tyco Fire & Security Gmbh Elongate flexible tag
US11443160B2 (en) 2019-09-18 2022-09-13 Sensormatic Electronics, LLC Systems and methods for laser tuning and attaching RFID tags to products
US10970613B1 (en) 2019-09-18 2021-04-06 Sensormatic Electronics, LLC Systems and methods for providing tags adapted to be incorporated with or in items
US11055588B2 (en) 2019-11-27 2021-07-06 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
US11755874B2 (en) 2021-03-03 2023-09-12 Sensormatic Electronics, LLC Methods and systems for heat applied sensor tag
US11869324B2 (en) 2021-12-23 2024-01-09 Sensormatic Electronics, LLC Securing a security tag into an article

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5939984A (en) 1997-12-31 1999-08-17 Intermec Ip Corp. Combination radio frequency transponder (RF Tag) and magnetic electronic article surveillance (EAS) material
US6154137A (en) 1998-06-08 2000-11-28 3M Innovative Properties Company Identification tag with enhanced security
US7109867B2 (en) 2004-09-09 2006-09-19 Avery Dennison Corporation RFID tags with EAS deactivation ability
US7804411B2 (en) 2004-11-15 2010-09-28 Sensormatic Electronics, LLC Combination EAS and RFID label or tag using a hybrid RFID antenna
JP2008521099A (ja) 2004-11-15 2008-06-19 センサーマティック・エレクトロニクス・コーポレーション 可制御読出し範囲を備える組合せeas、rfidラベル又はタグ
US7812729B2 (en) 2004-11-15 2010-10-12 Sensormatic Electronics, LLC Combination EAS and RFID label or tag with controllable read range using a hybrid RFID antenna
FR2901041B1 (fr) * 2006-05-12 2008-10-10 Eric Heurtier Etiquette integrant une antenne anti-vol rf et un transporteur rfid uhf
US8026818B2 (en) 2006-12-20 2011-09-27 Checkpoint Systems, Inc. EAS and UHF combination tag
US8927353B2 (en) * 2007-05-07 2015-01-06 Taiwan Semiconductor Manufacturing Co., Ltd. Fin field effect transistor and method of forming the same
US8633821B2 (en) 2007-12-03 2014-01-21 Avery Dennison Corporation Dual use RFID/EAS device
US8056814B2 (en) 2008-02-27 2011-11-15 Tagsys Sas Combined EAS/RFID tag
KR20110010766A (ko) * 2008-05-09 2011-02-07 도요 알루미늄 가부시키가이샤 Ic카드·태그용 안테나 회로 구성체와 ic카드

Also Published As

Publication number Publication date
ES2679529T3 (es) 2018-08-28
US9299586B1 (en) 2016-03-29
EP3001394A1 (en) 2016-03-30
US20160086821A1 (en) 2016-03-24
CN105447555A (zh) 2016-03-30
EP3001394B1 (en) 2018-03-28

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