PL3001394T3 - Sposób wytwarzania kombinacji etykiety przeciwkradzieżowej i śledzącej - Google Patents
Sposób wytwarzania kombinacji etykiety przeciwkradzieżowej i śledzącejInfo
- Publication number
- PL3001394T3 PL3001394T3 PL15186493T PL15186493T PL3001394T3 PL 3001394 T3 PL3001394 T3 PL 3001394T3 PL 15186493 T PL15186493 T PL 15186493T PL 15186493 T PL15186493 T PL 15186493T PL 3001394 T3 PL3001394 T3 PL 3001394T3
- Authority
- PL
- Poland
- Prior art keywords
- theft
- manufacturing
- tracking tag
- combination anti
- combination
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
- G06K19/0724—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement being a circuit for communicating at a plurality of frequencies, e.g. for managing time multiplexed communication over at least two antennas of different types
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07767—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the first and second communication means being two different antennas types, e.g. dipole and coil type, or two antennas of the same kind but operating at different frequencies
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
-
- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B13/00—Burglar, theft or intruder alarms
- G08B13/22—Electrical actuation
- G08B13/24—Electrical actuation by interference with electromagnetic field distribution
- G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
- G08B13/2428—Tag details
- G08B13/2437—Tag layered structure, processes for making layered tags
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/32—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Automation & Control Theory (AREA)
- Computer Security & Cryptography (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Details Of Aerials (AREA)
- Burglar Alarm Systems (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/495,359 US9299586B1 (en) | 2014-09-24 | 2014-09-24 | Process for manufacturing a combination anti-theft and tracking tag |
EP15186493.1A EP3001394B1 (en) | 2014-09-24 | 2015-09-23 | Process for manufacturing a combination anti-theft and tracking tag |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3001394T3 true PL3001394T3 (pl) | 2018-10-31 |
Family
ID=54199564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL15186493T PL3001394T3 (pl) | 2014-09-24 | 2015-09-23 | Sposób wytwarzania kombinacji etykiety przeciwkradzieżowej i śledzącej |
Country Status (5)
Country | Link |
---|---|
US (1) | US9299586B1 (pl) |
EP (1) | EP3001394B1 (pl) |
CN (1) | CN105447555A (pl) |
ES (1) | ES2679529T3 (pl) |
PL (1) | PL3001394T3 (pl) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2491447B (en) * | 2010-03-24 | 2014-10-22 | Murata Manufacturing Co | RFID system |
JP6724866B2 (ja) * | 2017-06-05 | 2020-07-15 | 株式会社村田製作所 | コイル部品およびその周波数特性の変更方法 |
CA3068284A1 (en) * | 2017-06-22 | 2018-12-27 | Checkpoint Systems, Inc. | Detectable folded coil |
US11282357B2 (en) * | 2018-05-22 | 2022-03-22 | Tyco Fire & Security Gmbh | Elongate flexible tag |
US11443160B2 (en) | 2019-09-18 | 2022-09-13 | Sensormatic Electronics, LLC | Systems and methods for laser tuning and attaching RFID tags to products |
US10970613B1 (en) | 2019-09-18 | 2021-04-06 | Sensormatic Electronics, LLC | Systems and methods for providing tags adapted to be incorporated with or in items |
US11055588B2 (en) | 2019-11-27 | 2021-07-06 | Sensormatic Electronics, LLC | Flexible water-resistant sensor tag |
US11755874B2 (en) | 2021-03-03 | 2023-09-12 | Sensormatic Electronics, LLC | Methods and systems for heat applied sensor tag |
US11869324B2 (en) | 2021-12-23 | 2024-01-09 | Sensormatic Electronics, LLC | Securing a security tag into an article |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5939984A (en) | 1997-12-31 | 1999-08-17 | Intermec Ip Corp. | Combination radio frequency transponder (RF Tag) and magnetic electronic article surveillance (EAS) material |
US6154137A (en) | 1998-06-08 | 2000-11-28 | 3M Innovative Properties Company | Identification tag with enhanced security |
US7109867B2 (en) | 2004-09-09 | 2006-09-19 | Avery Dennison Corporation | RFID tags with EAS deactivation ability |
US7804411B2 (en) | 2004-11-15 | 2010-09-28 | Sensormatic Electronics, LLC | Combination EAS and RFID label or tag using a hybrid RFID antenna |
JP2008521099A (ja) | 2004-11-15 | 2008-06-19 | センサーマティック・エレクトロニクス・コーポレーション | 可制御読出し範囲を備える組合せeas、rfidラベル又はタグ |
US7812729B2 (en) | 2004-11-15 | 2010-10-12 | Sensormatic Electronics, LLC | Combination EAS and RFID label or tag with controllable read range using a hybrid RFID antenna |
FR2901041B1 (fr) * | 2006-05-12 | 2008-10-10 | Eric Heurtier | Etiquette integrant une antenne anti-vol rf et un transporteur rfid uhf |
US8026818B2 (en) | 2006-12-20 | 2011-09-27 | Checkpoint Systems, Inc. | EAS and UHF combination tag |
US8927353B2 (en) * | 2007-05-07 | 2015-01-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Fin field effect transistor and method of forming the same |
US8633821B2 (en) | 2007-12-03 | 2014-01-21 | Avery Dennison Corporation | Dual use RFID/EAS device |
US8056814B2 (en) | 2008-02-27 | 2011-11-15 | Tagsys Sas | Combined EAS/RFID tag |
KR20110010766A (ko) * | 2008-05-09 | 2011-02-07 | 도요 알루미늄 가부시키가이샤 | Ic카드·태그용 안테나 회로 구성체와 ic카드 |
-
2014
- 2014-09-24 US US14/495,359 patent/US9299586B1/en active Active
-
2015
- 2015-09-23 EP EP15186493.1A patent/EP3001394B1/en active Active
- 2015-09-23 PL PL15186493T patent/PL3001394T3/pl unknown
- 2015-09-23 ES ES15186493.1T patent/ES2679529T3/es active Active
- 2015-09-23 CN CN201510611501.8A patent/CN105447555A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
ES2679529T3 (es) | 2018-08-28 |
US9299586B1 (en) | 2016-03-29 |
EP3001394A1 (en) | 2016-03-30 |
US20160086821A1 (en) | 2016-03-24 |
CN105447555A (zh) | 2016-03-30 |
EP3001394B1 (en) | 2018-03-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IL248153A0 (en) | A method for activating passive metal and its uses | |
PL2993626T3 (pl) | Pasywny znacznik RFID czujnika | |
PL3001394T3 (pl) | Sposób wytwarzania kombinacji etykiety przeciwkradzieżowej i śledzącej | |
SG11201703004XA (en) | Database security | |
GB2528515B (en) | Releasing a security tag | |
IL247441A0 (en) | Plastic can and method for its production | |
SG11201604859RA (en) | Database key identification | |
EP3234869A4 (en) | Identification tag | |
EP3204590A4 (en) | A piping body having an rfid tag | |
HK1259475A1 (zh) | Rfid標籤 | |
EP3207504C0 (en) | RFID TRANSPONDER | |
GB201411107D0 (en) | Object-assisted identification label | |
GB201711863D0 (en) | A system and method for facilitating the provision of goods | |
SG11201607862TA (en) | Gas-phase deposition process | |
EP3092335A4 (en) | A process for recovering polyester | |
SG10201509803SA (en) | Article storage facility | |
PL3142864T3 (pl) | Sposób wytwarzania elementu zabezpieczającego | |
GB2527764B (en) | Process for producing a security film | |
GB201415579D0 (en) | A process | |
GB201404515D0 (en) | A lock | |
GB2552213B (en) | A security tag | |
GB2549699B (en) | Security tag | |
PL3221068T3 (pl) | Sposób wytwarzania kształtki obrotowo-symetrycznej | |
GB201512792D0 (en) | Security tag | |
GB201518851D0 (en) | A lock |