PL2961857T3 - Urządzenie do napylania - Google Patents
Urządzenie do napylaniaInfo
- Publication number
- PL2961857T3 PL2961857T3 PL14757416T PL14757416T PL2961857T3 PL 2961857 T3 PL2961857 T3 PL 2961857T3 PL 14757416 T PL14757416 T PL 14757416T PL 14757416 T PL14757416 T PL 14757416T PL 2961857 T3 PL2961857 T3 PL 2961857T3
- Authority
- PL
- Poland
- Prior art keywords
- sputtering apparatus
- sputtering
- Prior art date
Links
- 238000004544 sputter deposition Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3464—Operating strategies
- H01J37/347—Thickness uniformity of coated layers or desired profile of target erosion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3476—Testing and control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3476—Testing and control
- H01J37/3479—Detecting exhaustion of target material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361771460P | 2013-03-01 | 2013-03-01 | |
| US14/019,877 US9418823B2 (en) | 2013-03-01 | 2013-09-06 | Sputtering apparatus |
| PCT/US2014/018212 WO2014134004A1 (en) | 2013-03-01 | 2014-02-25 | Sputtering apparatus |
| EP14757416.4A EP2961857B1 (en) | 2013-03-01 | 2014-02-25 | Sputtering apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2961857T3 true PL2961857T3 (pl) | 2020-09-07 |
Family
ID=51420393
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL20162666T PL3686314T3 (pl) | 2013-03-01 | 2014-02-25 | Urządzenie do rozpylania |
| PL14757416T PL2961857T3 (pl) | 2013-03-01 | 2014-02-25 | Urządzenie do napylania |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL20162666T PL3686314T3 (pl) | 2013-03-01 | 2014-02-25 | Urządzenie do rozpylania |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9418823B2 (pl) |
| EP (2) | EP3686314B1 (pl) |
| JP (1) | JP6416132B2 (pl) |
| KR (1) | KR102147442B1 (pl) |
| CN (1) | CN105026609B (pl) |
| PL (2) | PL3686314T3 (pl) |
| TW (1) | TWI612164B (pl) |
| WO (1) | WO2014134004A1 (pl) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012109424A1 (de) * | 2012-10-04 | 2014-04-10 | Von Ardenne Anlagentechnik Gmbh | Sputtermagnetron und Verfahren zur dynamischen Magnetfeldbeeinflussung |
| US9312108B2 (en) | 2013-03-01 | 2016-04-12 | Sputtering Components, Inc. | Sputtering apparatus |
| EP3117449B1 (en) * | 2014-03-14 | 2020-08-12 | Applied Materials, Inc. | Smart chamber and smart chamber components |
| BE1021296B1 (nl) * | 2014-04-18 | 2015-10-23 | Soleras Advanced Coatings Bvba | Sputter systeem voor uniform sputteren |
| AT14912U1 (de) | 2015-05-06 | 2016-08-15 | Plansee Se | Anschlussstück für Rohrtarget |
| US11052482B2 (en) * | 2016-02-12 | 2021-07-06 | Ipg Photonics Corporation | Laser alignment apparatus and system for alignment of output fiber of a fiber laser |
| CN105714261A (zh) * | 2016-04-15 | 2016-06-29 | 河北物华天宝镀膜科技有限公司 | 一种旋转阴极磁棒装置 |
| KR102170483B1 (ko) * | 2017-07-25 | 2020-10-28 | 가부시키가이샤 알박 | 스퍼터링 장치용 캐소드 유닛 |
| US10727034B2 (en) * | 2017-08-16 | 2020-07-28 | Sputtering Components, Inc. | Magnetic force release for sputtering sources with magnetic target materials |
| BE1026859B1 (nl) * | 2018-10-22 | 2020-07-14 | Soleras Advanced Coatings Bv | Magnetron met geïntegreerd circuit voor het monitoren en controle |
| GB2588425B (en) * | 2019-10-23 | 2021-10-27 | Elekta ltd | Magnetron condition monitoring |
| JP7813569B2 (ja) * | 2021-12-14 | 2026-02-13 | キヤノントッキ株式会社 | 成膜装置および成膜方法 |
| CN119956303A (zh) * | 2023-11-08 | 2025-05-09 | 北京北方华创微电子装备有限公司 | 磁控管驱动机构和磁控溅射设备 |
| CN119800314B (zh) * | 2025-03-12 | 2025-07-01 | 晓睿真空设备(嘉兴)有限公司 | 一种磁控溅射用在线摆动式可调磁棒 |
| CN120210752B (zh) * | 2025-05-09 | 2025-09-23 | 中科纳微真空科技(合肥)有限公司 | 一种磁控溅射镀膜设备、旋转阴极及在线可调磁棒 |
| CN120138588A (zh) * | 2025-05-15 | 2025-06-13 | 宏舜(浙江)真空科技有限公司 | 一种远程可控的旋转阴极磁组件 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3047113A1 (de) | 1980-12-13 | 1982-07-29 | Leybold-Heraeus GmbH, 5000 Köln | Katodenanordnung und regelverfahren fuer katodenzerstaeubungsanlagen mit einem magnetsystem zur erhoehung der zerstaeubungsrate |
| JPH0234780A (ja) * | 1988-07-25 | 1990-02-05 | Matsushita Electric Ind Co Ltd | マグネトロンスパッタ用磁気回路 |
| JPH0733573B2 (ja) * | 1988-10-14 | 1995-04-12 | 日本電信電話株式会社 | 薄膜形成方法 |
| JPH0363567U (pl) * | 1989-10-26 | 1991-06-20 | ||
| US5047131A (en) | 1989-11-08 | 1991-09-10 | The Boc Group, Inc. | Method for coating substrates with silicon based compounds |
| US5096562A (en) | 1989-11-08 | 1992-03-17 | The Boc Group, Inc. | Rotating cylindrical magnetron structure for large area coating |
| JPH1161403A (ja) | 1997-08-20 | 1999-03-05 | Mitsubishi Electric Corp | スパッタリング装置及びスパッタリング方法 |
| US6406599B1 (en) | 2000-11-01 | 2002-06-18 | Applied Materials, Inc. | Magnetron with a rotating center magnet for a vault shaped sputtering target |
| WO2002047110A1 (en) | 2000-12-05 | 2002-06-13 | Trikon Holdings Limited | Magnetron sputtering apparatus |
| GB0118803D0 (en) * | 2001-08-02 | 2001-09-26 | Bekaert Sa Nv | Adjustable magnet configuration and method for magnetron sputtering |
| DE502006008952D1 (de) | 2006-11-14 | 2011-04-07 | Applied Materials Inc | Magnetron-Sputterquelle, Sputter-Beschichtungsanlage und Verfahren zur Beschichtung eines Substrats |
| KR101166396B1 (ko) * | 2007-03-30 | 2012-07-23 | 도쿄엘렉트론가부시키가이샤 | 회전 마그넷 스퍼터 장치 |
| US8137519B2 (en) * | 2008-03-13 | 2012-03-20 | Canon Anelva Corporation | Sputtering cathode, sputtering apparatus provided with sputtering cathode, film-forming method, and method for manufacturing electronic device |
| DE102008000943B4 (de) * | 2008-04-02 | 2015-02-19 | Zf Friedrichshafen Ag | Diagnostizierbarer Hallsensor und Verfahren zur Funktionsdiagnose einer Hall-Sensoreinrichtung |
| US8349156B2 (en) * | 2008-05-14 | 2013-01-08 | Applied Materials, Inc. | Microwave-assisted rotatable PVD |
| EP2301060B1 (en) | 2008-05-16 | 2014-07-09 | Soleras Advanced Coatings bvba | A rotatable sputtering magnetron with high stiffness |
| WO2010076862A1 (ja) | 2008-12-29 | 2010-07-08 | キヤノンアネルバ株式会社 | 均一膜厚分布のためのスパッタ装置の磁界制御 |
| US8182662B2 (en) | 2009-03-27 | 2012-05-22 | Sputtering Components, Inc. | Rotary cathode for magnetron sputtering apparatus |
| US20110062220A1 (en) * | 2009-09-15 | 2011-03-17 | General Electric Company | Superalloy composition and method of forming a turbine engine component |
| WO2011068263A1 (ko) | 2009-12-03 | 2011-06-09 | (주)에스엔텍 | 원통형 스퍼터링 캐소드 |
| WO2012110105A1 (en) | 2011-02-18 | 2012-08-23 | Toyota Motor Europe Nv/Sa | Sputtering magnetron assembly |
| EP2626887A1 (en) | 2012-02-13 | 2013-08-14 | Soleras Advanced Coatings bvba | Online adjustable magnet bar |
| DE102012109424A1 (de) * | 2012-10-04 | 2014-04-10 | Von Ardenne Anlagentechnik Gmbh | Sputtermagnetron und Verfahren zur dynamischen Magnetfeldbeeinflussung |
| US9312108B2 (en) | 2013-03-01 | 2016-04-12 | Sputtering Components, Inc. | Sputtering apparatus |
-
2013
- 2013-09-06 US US14/019,877 patent/US9418823B2/en active Active
-
2014
- 2014-02-25 KR KR1020157017634A patent/KR102147442B1/ko active Active
- 2014-02-25 PL PL20162666T patent/PL3686314T3/pl unknown
- 2014-02-25 CN CN201480011904.2A patent/CN105026609B/zh active Active
- 2014-02-25 PL PL14757416T patent/PL2961857T3/pl unknown
- 2014-02-25 JP JP2015560242A patent/JP6416132B2/ja active Active
- 2014-02-25 EP EP20162666.0A patent/EP3686314B1/en active Active
- 2014-02-25 WO PCT/US2014/018212 patent/WO2014134004A1/en not_active Ceased
- 2014-02-25 EP EP14757416.4A patent/EP2961857B1/en active Active
- 2014-02-26 TW TW103106441A patent/TWI612164B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016514207A (ja) | 2016-05-19 |
| KR20150126818A (ko) | 2015-11-13 |
| TW201441402A (zh) | 2014-11-01 |
| CN105026609B (zh) | 2018-12-14 |
| KR102147442B1 (ko) | 2020-08-25 |
| US9418823B2 (en) | 2016-08-16 |
| TWI612164B (zh) | 2018-01-21 |
| EP2961857A4 (en) | 2016-08-31 |
| EP2961857A1 (en) | 2016-01-06 |
| EP3686314A1 (en) | 2020-07-29 |
| EP3686314B1 (en) | 2021-09-29 |
| CN105026609A (zh) | 2015-11-04 |
| JP6416132B2 (ja) | 2018-10-31 |
| WO2014134004A1 (en) | 2014-09-04 |
| PL3686314T3 (pl) | 2022-01-31 |
| US20140246310A1 (en) | 2014-09-04 |
| EP2961857B1 (en) | 2020-05-13 |
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