PL2281267T3 - Karta chipowa posiadająca wiele części składowych - Google Patents

Karta chipowa posiadająca wiele części składowych

Info

Publication number
PL2281267T3
PL2281267T3 PL09749578T PL09749578T PL2281267T3 PL 2281267 T3 PL2281267 T3 PL 2281267T3 PL 09749578 T PL09749578 T PL 09749578T PL 09749578 T PL09749578 T PL 09749578T PL 2281267 T3 PL2281267 T3 PL 2281267T3
Authority
PL
Poland
Prior art keywords
components
chip card
card
chip
Prior art date
Application number
PL09749578T
Other languages
English (en)
Inventor
Manfred Rietzler
Raymond Freeman
Original Assignee
Smartrac Ip Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smartrac Ip Bv filed Critical Smartrac Ip Bv
Publication of PL2281267T3 publication Critical patent/PL2281267T3/pl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
    • G06K19/07703—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
PL09749578T 2008-05-23 2009-05-14 Karta chipowa posiadająca wiele części składowych PL2281267T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008024823A DE102008024823A1 (de) 2008-05-23 2008-05-23 Chipkarte mit einer Mehrzahl von Komponenten
PCT/EP2009/003417 WO2009141088A1 (de) 2008-05-23 2009-05-14 Chipkarte mit einer mehrzahl von komponenten
EP09749578A EP2281267B1 (de) 2008-05-23 2009-05-14 Chipkarte mit einer mehrzahl von komponenten

Publications (1)

Publication Number Publication Date
PL2281267T3 true PL2281267T3 (pl) 2012-11-30

Family

ID=40943840

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09749578T PL2281267T3 (pl) 2008-05-23 2009-05-14 Karta chipowa posiadająca wiele części składowych

Country Status (8)

Country Link
US (1) US8415782B2 (pl)
EP (1) EP2281267B1 (pl)
JP (1) JP2011521367A (pl)
KR (1) KR101404279B1 (pl)
CN (1) CN102105894B (pl)
DE (1) DE102008024823A1 (pl)
PL (1) PL2281267T3 (pl)
WO (1) WO2009141088A1 (pl)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010028926A1 (de) * 2010-05-12 2011-11-17 Bundesdruckerei Gmbh Dokument und Verfahren zur Herstellung eines Dokuments
DE102014106062B4 (de) * 2014-04-30 2018-11-22 Infineon Technologies Ag Chipkartenmodul, Chipkartenkörper, Chipkarte und Chipkartenherstellungsverfahren
FR3025634B1 (fr) * 2014-09-10 2016-12-09 Oberthur Technologies Dispositif electronique comportant un composant electronique presentant une zone d'affichage et procede de fabrication d'un tel dispositif
CN105184349B (zh) * 2015-07-29 2018-07-24 飞天诚信科技股份有限公司 一种智能卡及其制造方法
CN105184350B (zh) * 2015-07-29 2018-07-24 飞天诚信科技股份有限公司 一种智能卡及其制造方法
EP3159832B1 (en) * 2015-10-23 2020-08-05 Nxp B.V. Authentication token
KR200482932Y1 (ko) * 2015-11-10 2017-03-17 브릴리언츠 주식회사 Nfc안테나를 구비한 멀티카드
CN106845995B (zh) * 2017-01-19 2018-05-04 飞天诚信科技股份有限公司 一种蓝牙智能卡及其控制交易风险的方法
WO2022176080A1 (ja) * 2021-02-17 2022-08-25 富士通フロンテック株式会社 Ｒｆｉｄタグ

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19500925C2 (de) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte
JPH08276688A (ja) 1995-04-21 1996-10-22 Mahr Reonard Manag Co 回路チップ担持装置及びその製造方法
DE19611237A1 (de) * 1996-03-21 1997-09-25 Siemens Ag Multichipkarte
DE19708617C2 (de) * 1997-03-03 1999-02-04 Siemens Ag Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte
JP2001024107A (ja) 1999-07-09 2001-01-26 New Japan Radio Co Ltd 半導体装置実装構造
DE19942932C2 (de) * 1999-09-08 2002-01-24 Giesecke & Devrient Gmbh Verfahren zum Herstellen von Chipkarten
DE19955537B4 (de) * 1999-11-18 2006-04-13 Orga Kartensysteme Gmbh Verfahren zur Herstellung eines Trägerelementes für einen IC-Baustein
DE10107072B4 (de) * 2001-02-13 2009-11-19 Hid Global Gmbh Verfahren zur Herstellung einer Chipkarte
DE10248393A1 (de) 2002-10-17 2004-05-19 Giesecke & Devrient Gmbh Funktionsinlett für Multifunktionskarte
DE102004042145A1 (de) 2004-08-31 2006-03-02 Infineon Technologies Ag Chipmodul
DE102005020101A1 (de) * 2005-04-29 2007-01-25 Giesecke & Devrient Gmbh Tragbarer Datenträger und Verfahren zum Betreiben eines tragbaren Datenträgers

Also Published As

Publication number Publication date
DE102008024823A1 (de) 2009-12-10
KR20110026427A (ko) 2011-03-15
US20110074001A1 (en) 2011-03-31
KR101404279B1 (ko) 2014-06-05
CN102105894A (zh) 2011-06-22
EP2281267B1 (de) 2012-06-27
JP2011521367A (ja) 2011-07-21
US8415782B2 (en) 2013-04-09
EP2281267A1 (de) 2011-02-09
CN102105894B (zh) 2015-07-15
WO2009141088A1 (de) 2009-11-26

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