PL2116114T3 - Proces produkcji obwodów drukowanych, na których są lutowane elementy elektroniczne bez wyprowadzeń - Google Patents

Proces produkcji obwodów drukowanych, na których są lutowane elementy elektroniczne bez wyprowadzeń

Info

Publication number
PL2116114T3
PL2116114T3 PL07827694T PL07827694T PL2116114T3 PL 2116114 T3 PL2116114 T3 PL 2116114T3 PL 07827694 T PL07827694 T PL 07827694T PL 07827694 T PL07827694 T PL 07827694T PL 2116114 T3 PL2116114 T3 PL 2116114T3
Authority
PL
Poland
Prior art keywords
soldered
electronic components
production process
leading wire
printed circuits
Prior art date
Application number
PL07827694T
Other languages
English (en)
Polish (pl)
Inventor
Faustino Fioretti
Original Assignee
Cisel S R L Circuiti Stampati Per Applicazioni Elettr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cisel S R L Circuiti Stampati Per Applicazioni Elettr filed Critical Cisel S R L Circuiti Stampati Per Applicazioni Elettr
Publication of PL2116114T3 publication Critical patent/PL2116114T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
PL07827694T 2007-02-01 2007-09-17 Proces produkcji obwodów drukowanych, na których są lutowane elementy elektroniczne bez wyprowadzeń PL2116114T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT000018A ITMC20070018A1 (it) 2007-02-01 2007-02-01 Procedimento per la realizzazione di circuiti stampati su cui devono essere saldati componenti elettronici privi di reoforo.
EP07827694A EP2116114B1 (de) 2007-02-01 2007-09-17 Produktionsprozess für leiterplatten, worauf elektronische komponenten ohne anschlussleitung aufgelötet werden
PCT/IT2007/000642 WO2008093373A1 (en) 2007-02-01 2007-09-17 Production process of printed circuits on which electronic components without leading wire are soldered.

Publications (1)

Publication Number Publication Date
PL2116114T3 true PL2116114T3 (pl) 2011-01-31

Family

ID=38890251

Family Applications (1)

Application Number Title Priority Date Filing Date
PL07827694T PL2116114T3 (pl) 2007-02-01 2007-09-17 Proces produkcji obwodów drukowanych, na których są lutowane elementy elektroniczne bez wyprowadzeń

Country Status (8)

Country Link
EP (1) EP2116114B1 (de)
CN (1) CN101611657B (de)
AT (1) ATE477704T1 (de)
DE (1) DE602007008474D1 (de)
ES (1) ES2350804T3 (de)
IT (1) ITMC20070018A1 (de)
PL (1) PL2116114T3 (de)
WO (1) WO2008093373A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2650076C1 (ru) * 2017-01-09 2018-04-06 федеральное государственное бюджетное образовательное учреждение высшего образования "Новгородский государственный университет имени Ярослава Мудрого" Способ установки мощных светодиодов на печатную плату

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5718347A (en) * 1980-07-08 1982-01-30 Citizen Watch Co Ltd Mounting structure of ic
JPS61203695A (ja) * 1985-03-06 1986-09-09 シャープ株式会社 片面配線基板の部品実装方式
DE69118308T2 (de) * 1990-10-24 1996-08-08 Nippon Electric Co Verfahren zur Herstellung einer elektrischen Verbindung für eine integrierte Schaltung
EP0896368A4 (de) * 1997-01-23 2000-03-01 Seiko Epson Corp Filmträgerband, halbleiteranordnung, halbleiter, herstellungsmethode dafür, montageplatte und halbleitergerät
CN100479634C (zh) * 2005-05-11 2009-04-15 华为技术有限公司 一种改善电路板焊接质量的方法及用于该方法中的风刀装置

Also Published As

Publication number Publication date
CN101611657B (zh) 2011-05-11
ATE477704T1 (de) 2010-08-15
CN101611657A (zh) 2009-12-23
DE602007008474D1 (de) 2010-09-23
EP2116114B1 (de) 2010-08-11
WO2008093373A1 (en) 2008-08-07
ITMC20070018A1 (it) 2008-08-02
ES2350804T3 (es) 2011-01-27
EP2116114A1 (de) 2009-11-11

Similar Documents

Publication Publication Date Title
ATE557576T1 (de) Leiterplatine mit elektronischem bauelement
DE602004012910D1 (de) Kupferfolie für gedruckte Leiterplatten mit feinen Strukturen und Herstellungsverfahren
WO2008049006A3 (en) Materials for use with interconnects of electrical devices and related methods
TW200740317A (en) Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method
IN2012DN03163A (de)
GB2437465B (en) Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device, and electronic device using multilayer wiring board
WO2008102266A3 (en) Method and apparatus for rapid fabrication of functional printed circuit board
WO2012024603A3 (en) Sustainable process for reclaiming precious metals and base metals from e-waste
WO2010048653A3 (de) Verfahren zur integration eines elektronischen bauteils in eine leiterplatte
TW200731898A (en) Circuit board structure and method for fabricating the same
FI20070904A7 (fi) Menetelmä piirilevyjen valmistuksessa
TW200703590A (en) Method of fabricating wiring board and method of fabricating semiconductor device
TW200633176A (en) Printed circuit board, flip chip ball grid array board and method of fabricating the same
MY151656A (en) Printed substrate through which very strong currents can pass and corresponding production method
TW200644202A (en) Method of manufacturing flexible circuit substrate
WO2009043670A3 (de) Elektronische schaltung aus teilschaltungen und verfahren zu deren herstellung
TW200629998A (en) Printed circuit board and forming method thereof
WO2008135142A3 (de) Verfahren zur herstellung einer leiterplatte mit einer kavität für die integration von bauteilen und leiterplatte und anwendung
WO2009037145A3 (de) Verfahren zur herstellung einer elektronischen baugruppe sowie elektronische baugruppe
EP1839336A4 (de) Elektronische einrichtungen mit leitfähigen gliedern, die elektroden mit anderen leitfähigen gliedern in einem substrat verbinden, und prozesse zur erzeugung der elektronischen einrichtungen
TW200601915A (en) Flexible wiring board and method for manufacturing the same, semiconductor chip mounted flexible wiring board and electronic apparatus
EP1864559A4 (de) Herstellungsverfahren für eine lot-leiterplatte
PL2116114T3 (pl) Proces produkcji obwodów drukowanych, na których są lutowane elementy elektroniczne bez wyprowadzeń
TWI368231B (en) Conductive paste, and method for producing printed wiring board by using the same
EP1745684A4 (de) Verfahren zur herstellung einer elektronischen leiterplatte