PL2050837T3 - Sposób jonowo-plazmowego nanoszenia powłok cienkowarstwowych i urządzenie do wykonania sposobu - Google Patents

Sposób jonowo-plazmowego nanoszenia powłok cienkowarstwowych i urządzenie do wykonania sposobu

Info

Publication number
PL2050837T3
PL2050837T3 PL06847390T PL06847390T PL2050837T3 PL 2050837 T3 PL2050837 T3 PL 2050837T3 PL 06847390 T PL06847390 T PL 06847390T PL 06847390 T PL06847390 T PL 06847390T PL 2050837 T3 PL2050837 T3 PL 2050837T3
Authority
PL
Poland
Prior art keywords
unbalanced
magnetrons
aid
balanced
ion
Prior art date
Application number
PL06847390T
Other languages
English (en)
Inventor
Dmitry Davidovich Spivakov
Valery Semenovich Mitin
Original Assignee
Naco Tech Sia
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Naco Tech Sia filed Critical Naco Tech Sia
Publication of PL2050837T3 publication Critical patent/PL2050837T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/354—Introduction of auxiliary energy into the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32321—Discharge generated by other radiation
    • H01J37/3233—Discharge generated by other radiation using charged particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
PL06847390T 2006-07-26 2006-07-26 Sposób jonowo-plazmowego nanoszenia powłok cienkowarstwowych i urządzenie do wykonania sposobu PL2050837T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06847390A EP2050837B1 (de) 2006-07-26 2006-07-26 Verfahren zur ionenplasmaapplikation von filmbeschichtungen und vorrichtung zur durchführung des verfahrens
PCT/RU2006/000399 WO2008013469A1 (fr) 2006-07-26 2006-07-26 Procédé d'application à plasma d'ions de revêtements de film à composants multiples et installation correspondante

Publications (1)

Publication Number Publication Date
PL2050837T3 true PL2050837T3 (pl) 2012-05-31

Family

ID=38981713

Family Applications (1)

Application Number Title Priority Date Filing Date
PL06847390T PL2050837T3 (pl) 2006-07-26 2006-07-26 Sposób jonowo-plazmowego nanoszenia powłok cienkowarstwowych i urządzenie do wykonania sposobu

Country Status (5)

Country Link
EP (1) EP2050837B1 (pl)
AT (1) ATE537278T1 (pl)
ES (1) ES2378327T3 (pl)
PL (1) PL2050837T3 (pl)
WO (1) WO2008013469A1 (pl)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008062332A1 (de) * 2008-12-15 2010-06-17 Gühring Ohg Vorrichtung zur Oberflächenbehandlung und/oder -beschichtung von Substratkomponenten
DE102013011072A1 (de) 2013-07-03 2015-01-08 Oerlikon Trading Ag, Trübbach Targetpräparation
CN105091445B (zh) * 2015-08-26 2018-07-13 安徽中山金属有限公司 一种降温快的冶金冷却机构
DE102017128727A1 (de) * 2017-12-04 2019-01-17 Friedrich-Alexander-Universität Erlangen-Nürnberg Schichtsystem, Bauteil und Verfahren zum Beschichten
CN110541155A (zh) * 2019-09-30 2019-12-06 上海治臻新能源装备有限公司 一种燃料电池极板金属碳化物涂层的四腔体沉积系统
US20230032964A1 (en) * 2020-04-20 2023-02-02 Joint-Stock Company "Tvel" Method of ion-plasma application of corrosion-resistant film coatings on articles made from zirconium alloys

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6154112A (ja) 1984-08-24 1986-03-18 中外電気工業株式会社 ブレ−カ−用複合電気接点材
GB9006073D0 (en) 1990-03-17 1990-05-16 D G Teer Coating Services Limi Magnetron sputter ion plating
RU2063472C1 (ru) * 1993-06-11 1996-07-10 Валерий Афанасьевич Богатов Способ плазменной обработки деталей и устройство для его осуществления
JP3766569B2 (ja) * 1998-08-19 2006-04-12 株式会社神戸製鋼所 マグネトロンスパッタ装置
GB0410729D0 (en) * 2004-05-14 2004-06-16 Teer Coatings Ltd Coating with hard wear and non-stick characteristics
JP2006096841A (ja) * 2004-09-29 2006-04-13 Thk Co Ltd 固体潤滑膜およびその製造方法、固体潤滑膜が成膜される転がり摺動部材

Also Published As

Publication number Publication date
EP2050837B1 (de) 2011-12-14
EP2050837A1 (de) 2009-04-22
EP2050837A4 (en) 2010-04-14
WO2008013469A1 (fr) 2008-01-31
ES2378327T3 (es) 2012-04-11
ATE537278T1 (de) 2011-12-15

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