NZ280015A - Heat sink assembly: heat sinks juxtaposed so that the two non parallel pnuematic pathways of each heat sink align with one another - Google Patents

Heat sink assembly: heat sinks juxtaposed so that the two non parallel pnuematic pathways of each heat sink align with one another

Info

Publication number
NZ280015A
NZ280015A NZ280015A NZ28001595A NZ280015A NZ 280015 A NZ280015 A NZ 280015A NZ 280015 A NZ280015 A NZ 280015A NZ 28001595 A NZ28001595 A NZ 28001595A NZ 280015 A NZ280015 A NZ 280015A
Authority
NZ
New Zealand
Prior art keywords
heat
heat sink
pathways
pneumatic pathways
sinks
Prior art date
Application number
NZ280015A
Other languages
English (en)
Inventor
Robert Brian Widmayer
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of NZ280015A publication Critical patent/NZ280015A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
NZ280015A 1994-09-19 1995-09-14 Heat sink assembly: heat sinks juxtaposed so that the two non parallel pnuematic pathways of each heat sink align with one another NZ280015A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/308,316 US5582240A (en) 1994-09-19 1994-09-19 Pneumatically coupled heat sink assembly

Publications (1)

Publication Number Publication Date
NZ280015A true NZ280015A (en) 1997-07-27

Family

ID=23193489

Family Applications (1)

Application Number Title Priority Date Filing Date
NZ280015A NZ280015A (en) 1994-09-19 1995-09-14 Heat sink assembly: heat sinks juxtaposed so that the two non parallel pnuematic pathways of each heat sink align with one another

Country Status (10)

Country Link
US (1) US5582240A (cg-RX-API-DMAC10.html)
EP (1) EP0702405B1 (cg-RX-API-DMAC10.html)
KR (1) KR0182794B1 (cg-RX-API-DMAC10.html)
CN (1) CN1082724C (cg-RX-API-DMAC10.html)
BR (1) BR9504030A (cg-RX-API-DMAC10.html)
CO (1) CO4370140A1 (cg-RX-API-DMAC10.html)
DE (1) DE69530732T2 (cg-RX-API-DMAC10.html)
NZ (1) NZ280015A (cg-RX-API-DMAC10.html)
TW (1) TW307070B (cg-RX-API-DMAC10.html)
ZA (1) ZA957902B (cg-RX-API-DMAC10.html)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
JPH11121667A (ja) * 1997-10-20 1999-04-30 Fujitsu Ltd ヒートパイプ式冷却装置
US5927385A (en) * 1998-01-21 1999-07-27 Yeh; Ming Hsin Cooling device for the CPU of computer
EP0933878A1 (en) * 1998-01-27 1999-08-04 Lucent Technologies Inc. Cooling system for radio telecommunications equipment
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6199624B1 (en) * 1999-04-30 2001-03-13 Molex Incorporated Folded fin heat sink and a heat exchanger employing the heat sink
US6360816B1 (en) 1999-12-23 2002-03-26 Agilent Technologies, Inc. Cooling apparatus for electronic devices
EP1202346A1 (en) * 2000-09-29 2002-05-02 Siemens Aktiengesellschaft Heat sink arrangement
US6418020B1 (en) * 2001-03-30 2002-07-09 Advanced Thermal Technologies Heat dissipation device with ribbed fin plates
EP1417873A1 (en) 2001-08-09 2004-05-12 Heat Technology, Inc. Electronics cooling subassembly
US20030066626A1 (en) * 2001-10-04 2003-04-10 John Bird Cooling system having independent fan location
US8505063B2 (en) * 2002-02-22 2013-08-06 Qwest Communications International Inc. Systems and methods for providing redundant back-up to a video transmission system
US7046515B1 (en) 2002-06-06 2006-05-16 Raytheon Company Method and apparatus for cooling a circuit component
US6972950B1 (en) * 2002-06-06 2005-12-06 Raytheon Company Method and apparatus for cooling a portable computer
DE10234500A1 (de) * 2002-07-23 2004-02-19 Siemens Ag Verfahren zur Wärmeableitung in Mobilfunkgeräten und ein entsprechendes Mobilfunkgerät
US6735082B2 (en) * 2002-08-14 2004-05-11 Agilent Technologies, Inc. Heatsink with improved heat dissipation capability
US20040163795A1 (en) * 2003-02-25 2004-08-26 Yi-Yung Lin Heat sink
US7079390B2 (en) * 2003-06-05 2006-07-18 Hewlett-Packard Development, L.P. System and method for heat dissipation and air flow redirection in a chassis
US7198094B2 (en) * 2003-06-20 2007-04-03 Hewlett-Packard Development Company, L.P. Finned device for removing heat from an electronic component
GB2407375B (en) * 2003-10-22 2006-06-28 Motorola Inc Heat sinks
CN2672865Y (zh) * 2003-11-14 2005-01-19 鸿富锦精密工业（深圳）有限公司 散热器
US6958914B2 (en) * 2003-12-09 2005-10-25 Dell Products L.P. Interlocking heat sink
TWI251460B (en) * 2004-01-09 2006-03-11 Delta Electronics Inc Compound heat sink with multi-directional fins
US7779648B2 (en) * 2004-11-01 2010-08-24 Tecumseh Products Company Heat exchanger with enhanced air distribution
KR100719702B1 (ko) * 2005-05-25 2007-05-17 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP4480638B2 (ja) * 2005-07-04 2010-06-16 Ｎｅｃディスプレイソリューションズ株式会社 貫流型強制空冷ヒートシンクおよび投写型表示装置
US7532476B2 (en) * 2006-06-29 2009-05-12 Intel Corporation Flow solutions for microelectronic cooling
WO2008035452A1 (fr) * 2006-09-19 2008-03-27 Mitsubishi Electric Corporation Dispositif de refroidissement pour un corps mobile
USD613258S1 (en) * 2009-05-15 2010-04-06 Koninklije Philips Electronics N.V. Heatsink
USD638376S1 (en) * 2010-08-06 2011-05-24 Cisco Technology, Inc. Passive cooling element
USD644615S1 (en) * 2010-08-31 2011-09-06 Canon U.S. Life Sciences, Inc. Two part heat spreader
US20130014921A1 (en) * 2011-07-14 2013-01-17 Chen Chih-Peng Air flow guiding structure
CN105453257B (zh) * 2013-08-16 2018-12-07 华为技术有限公司 用于自然冷却散热器的增强结构
KR20150145084A (ko) * 2014-06-18 2015-12-29 주식회사 케이엠더블유 방열 장치
WO2017027315A1 (en) 2015-08-07 2017-02-16 Vishay Dale Electronics, Llc Molded body and electrical device having a molded body for high voltage applications
US11067963B2 (en) * 2019-01-09 2021-07-20 Dell Products L.P. System and method for thermal management in a multicomponent system

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE527420A (cg-RX-API-DMAC10.html) * 1953-03-20
US2965819A (en) * 1958-08-07 1960-12-20 Rosenbaum Jacob Heat dissipating electronic mounting apparatus
GB1054001A (cg-RX-API-DMAC10.html) * 1964-02-14
US3280907A (en) * 1964-09-01 1966-10-25 Hoffman Sidney Energy transfer device
US3312277A (en) * 1965-03-22 1967-04-04 Astrodyne Inc Heat sink
US3592260A (en) * 1969-12-05 1971-07-13 Espey Mfg & Electronics Corp Heat exchanger with inner guide strip
US3955122A (en) * 1974-02-26 1976-05-04 Armor Elevator Company, Inc. Heat sink mounting for controlled rectifiers
US4823869A (en) * 1986-06-19 1989-04-25 International Business Machines Corporation Heat sink
US4753290A (en) * 1986-07-18 1988-06-28 Unisys Corporation Reduced-stress heat sink device
US4682651A (en) * 1986-09-08 1987-07-28 Burroughs Corporation (Now Unisys Corporation) Segmented heat sink device
US5019880A (en) * 1988-01-07 1991-05-28 Prime Computer, Inc. Heat sink apparatus
US5077601A (en) * 1988-09-09 1991-12-31 Hitachi, Ltd. Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
JPH03222350A (ja) * 1990-01-29 1991-10-01 Hitachi Ltd 樹脂封止形半導体装置及びその実装構造
JP2544497B2 (ja) * 1990-02-28 1996-10-16 株式会社日立製作所 コンピュ―タ冷却装置
JPH04192552A (ja) * 1990-11-27 1992-07-10 Nec Corp 半導体素子用パッケージ
JPH0548282A (ja) * 1991-08-19 1993-02-26 Sansha Electric Mfg Co Ltd 冷却フイン構造
US5329436A (en) * 1993-10-04 1994-07-12 David Chiu Removable heat sink for xenon arc lamp packages
US5368094A (en) * 1993-11-02 1994-11-29 Hung; Chin-Ping Bipartite heat sink positioning device for computer chips

Also Published As

Publication number Publication date
DE69530732D1 (de) 2003-06-18
KR0182794B1 (ko) 1999-03-20
DE69530732T2 (de) 2003-12-18
CN1125319A (zh) 1996-06-26
KR960013151A (ko) 1996-04-20
CO4370140A1 (es) 1996-10-07
US5582240A (en) 1996-12-10
TW307070B (cg-RX-API-DMAC10.html) 1997-06-01
BR9504030A (pt) 1996-09-24
EP0702405A1 (en) 1996-03-20
CN1082724C (zh) 2002-04-10
ZA957902B (en) 1996-04-29
EP0702405B1 (en) 2003-05-14

Similar Documents

Publication Publication Date Title
US5582240A (en) Pneumatically coupled heat sink assembly
EP3440906B1 (en) Systems and methods for thermal management for high power density emi shielded electronic devices
US6330153B1 (en) Method and system for efficiently removing heat generated from an electronic device
US4928756A (en) Heat dissipating fin and method for making fin assembly
US8004842B2 (en) Heat dissipation device for communication chassis
US20040200601A1 (en) Heat sink assembly
CN108064430B (zh) 可旋转天线设备
KR19990078137A (ko) 주위에 대해 밀봉된 외부 엔클로저를 갖는 전자장치
CA3118544A1 (en) Impinging jet coldplate for power electronics with enhanced heat transfer
US11330738B1 (en) Force balanced package mounting
JP2004228484A (ja) 冷却装置及び電子機器
US8228239B2 (en) Heat-dissipating wireless communication system
US12386402B2 (en) Electronic device
KR102541485B1 (ko) 5g 통신용 안테나 어레이, 안테나 구조, 노이즈 억제 열전도 시트 및 열전도 시트
US20230139054A1 (en) Thermal-Control System Of A Mesh Network Device and Associated Mesh Network Devices
EP2383779B1 (en) Mounting base
US20040118550A1 (en) Heatsink with multiple, selectable fin densities
US6965515B2 (en) Thermoelectric cooling of low-noise amplifier transistors in wireless communications networks
JP2000164773A (ja) 放熱器
US6201221B1 (en) Method and apparatus for heat regulating electronics products
US11605886B1 (en) Radome with integrated passive cooling
US6515859B2 (en) Heat sink alignment
JP3037323B1 (ja) コンピュータの冷却装置
KR200319226Y1 (ko) 방사형 방열핀을 갖는 히트파이프용 방열판
KR200247971Y1 (ko) 씨피유 냉각장치

Legal Events

Date Code Title Description
RENW Renewal (renewal fees accepted)
RENW Renewal (renewal fees accepted)