NO985940D0 - Komponentmonteringsanordning, klemme og montasje - Google Patents

Komponentmonteringsanordning, klemme og montasje

Info

Publication number
NO985940D0
NO985940D0 NO985940A NO985940A NO985940D0 NO 985940 D0 NO985940 D0 NO 985940D0 NO 985940 A NO985940 A NO 985940A NO 985940 A NO985940 A NO 985940A NO 985940 D0 NO985940 D0 NO 985940D0
Authority
NO
Norway
Prior art keywords
mounting
clamp
component
component mounting
mounting device
Prior art date
Application number
NO985940A
Other languages
English (en)
Other versions
NO985940L (no
Inventor
Michael Persson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of NO985940D0 publication Critical patent/NO985940D0/no
Publication of NO985940L publication Critical patent/NO985940L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
NO985940A 1997-12-17 1998-12-17 Komponentmonteringsanordning, klemme og montasje NO985940L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9704719A SE9704719L (sv) 1997-12-17 1997-12-17 Komponentmonteringsarrangemang, klämma och sammansättning

Publications (2)

Publication Number Publication Date
NO985940D0 true NO985940D0 (no) 1998-12-17
NO985940L NO985940L (no) 1999-06-18

Family

ID=20409435

Family Applications (1)

Application Number Title Priority Date Filing Date
NO985940A NO985940L (no) 1997-12-17 1998-12-17 Komponentmonteringsanordning, klemme og montasje

Country Status (6)

Country Link
US (1) US6075208A (no)
EP (1) EP0930814A3 (no)
CA (1) CA2256141A1 (no)
NO (1) NO985940L (no)
SE (1) SE9704719L (no)
TW (1) TW410538B (no)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302704B1 (en) * 1999-04-22 2001-10-16 Ford Global Tech. Method and apparatus for selectively connecting flexible circuits
US6842345B2 (en) 2002-08-29 2005-01-11 Hewlett-Packard Development Company, L.P. Circuit board support assembly
US6757179B2 (en) 2002-08-29 2004-06-29 Hewlett-Packard Development Company, L.P. Circuit board support assembly
US7129577B2 (en) * 2003-02-27 2006-10-31 Power-One, Inc. Power supply packaging system
US7056144B2 (en) 2004-02-19 2006-06-06 Hewlett-Packard Development Company, L.P. Offset compensation system
GB2425147B (en) * 2005-12-23 2007-02-28 Christopher Charles Brindle Retaining clip
US7742310B2 (en) * 2006-09-29 2010-06-22 Hewlett-Packard Development Company, L.P. Sequencer
US7397666B2 (en) * 2006-10-25 2008-07-08 Hewlett-Packard Development Company, L.P. Wedge lock

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5138524A (en) * 1991-09-19 1992-08-11 Thermalloy Incorporated Apparatus for securing electronic device packages to heat sinks
JP3256370B2 (ja) * 1994-03-17 2002-02-12 新キャタピラー三菱株式会社 油圧ショベルのポンプ制御装置
US5870287A (en) * 1997-10-07 1999-02-09 Aavid Thermal Technologies, Inc. Spring clip for mounting a heat sink to an electronic component

Also Published As

Publication number Publication date
NO985940L (no) 1999-06-18
SE9704719L (sv) 1999-06-18
EP0930814A3 (en) 1999-09-15
EP0930814A2 (en) 1999-07-21
CA2256141A1 (en) 1999-06-17
TW410538B (en) 2000-11-01
SE9704719D0 (sv) 1997-12-17
US6075208A (en) 2000-06-13

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Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application