NO932203L - Fremgangsmaate og anordning til optimal avsoekning av en todimensjonal overflate paa en eller flere gjenstander - Google Patents
Fremgangsmaate og anordning til optimal avsoekning av en todimensjonal overflate paa en eller flere gjenstanderInfo
- Publication number
- NO932203L NO932203L NO932203A NO932203A NO932203L NO 932203 L NO932203 L NO 932203L NO 932203 A NO932203 A NO 932203A NO 932203 A NO932203 A NO 932203A NO 932203 L NO932203 L NO 932203L
- Authority
- NO
- Norway
- Prior art keywords
- objects
- articles
- probe
- dimensional surface
- scanning
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching
- H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching for microworking, e.g. etching of gratings, trimming of electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20221—Translation
- H01J2237/20228—Mechanical X-Y scanning
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
- Drying Of Semiconductors (AREA)
Abstract
En anordning til optimal avsøkning av en overflate på en eller flere gjenstander f.eks. en eller flere halvlederskiver som er underkastet en kjemisk etse- prosess, har innretninger (14,15) for innstilling av en eller flere gjenstander f.eks. halvlederskiver (10) på en skiveholder (50). Videre omfatter den en sonde (18) til kjemisk etsing av gjenstandene (10). Holderen (50) har et underlag (12) som gjenstanden eller gjenstandene (10) hviler på, og det finnes anordninger (50,52,60) som setter skiveholder og sonde i innbyrdes bevegelse på en slik måte at sonden (18) felger en spiralformet bane over gjenstanden eller gjenstandene (10) for å tildanne overflaten på gjenstandene slik at disse svarer til en ønsket tykkelse. En fremgangsmåte til avsøkning av overflaten av en eller flere gjenstander er også beskrevet.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/899,419 US5282921A (en) | 1992-06-16 | 1992-06-16 | Apparatus and method for optimally scanning a two-dimensional surface of one or more objects |
Publications (2)
Publication Number | Publication Date |
---|---|
NO932203D0 NO932203D0 (no) | 1993-06-15 |
NO932203L true NO932203L (no) | 1993-12-17 |
Family
ID=25410933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO932203A NO932203L (no) | 1992-06-16 | 1993-06-15 | Fremgangsmaate og anordning til optimal avsoekning av en todimensjonal overflate paa en eller flere gjenstander |
Country Status (6)
Country | Link |
---|---|
US (2) | US5282921A (no) |
EP (1) | EP0579380A1 (no) |
JP (1) | JPH0653178A (no) |
IL (1) | IL106018A (no) |
NO (1) | NO932203L (no) |
TW (1) | TW234785B (no) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0668614A3 (en) * | 1994-02-18 | 1996-03-27 | Hughes Aircraft Co | Method for improving the variation of the thickness of a wafer. |
DE4432304C2 (de) * | 1994-09-10 | 1996-10-17 | Forschungszentrum Juelich Gmbh | Verfahren zum Scannen einer Probenoberfläche mit einer Rastersonde eines Rastersondenmikroskops |
US5811021A (en) * | 1995-02-28 | 1998-09-22 | Hughes Electronics Corporation | Plasma assisted chemical transport method and apparatus |
US6139678A (en) * | 1997-11-20 | 2000-10-31 | Trusi Technologies, Llc | Plasma processing methods and apparatus |
JP4212707B2 (ja) * | 1998-11-26 | 2009-01-21 | スピードファム株式会社 | ウエハ平坦化システム及びウエハ平坦化方法 |
US6287976B1 (en) | 1999-05-19 | 2001-09-11 | Tru-Si Technologies, Inc. | Plasma processing methods and apparatus |
US6749764B1 (en) * | 2000-11-14 | 2004-06-15 | Tru-Si Technologies, Inc. | Plasma processing comprising three rotational motions of an article being processed |
US6500681B1 (en) * | 2002-01-11 | 2002-12-31 | Advanced Micro Devices, Inc. | Run-to-run etch control by feeding forward measured metal thickness |
DE10320143A1 (de) | 2003-05-06 | 2004-12-16 | Pari GmbH Spezialisten für effektive Inhalation | Vernebleranschlussvorrichtung für Beatmungsgeräte oder dergleichen |
US6991948B2 (en) * | 2003-11-05 | 2006-01-31 | Solid State Measurements, Inc. | Method of electrical characterization of a silicon-on-insulator (SOI) wafer |
WO2008011903A1 (en) * | 2006-07-28 | 2008-01-31 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Apparatus and method for processing a wafer |
US8022372B2 (en) | 2008-02-15 | 2011-09-20 | Veeco Instruments Inc. | Apparatus and method for batch non-contact material characterization |
TWI401426B (zh) * | 2008-02-15 | 2013-07-11 | Veeco Instr Inc | 用於批次非接觸式材料特性化之裝置及方法 |
US9653340B2 (en) | 2011-05-31 | 2017-05-16 | Veeco Instruments Inc. | Heated wafer carrier profiling |
WO2014210083A2 (en) | 2013-06-24 | 2014-12-31 | Dcg Systems, Inc. | Probe-based data collection system with adaptive mode of probing controlled by local sample properties |
US9287085B2 (en) * | 2014-05-12 | 2016-03-15 | Varian Semiconductor Equipment Associates, Inc. | Processing apparatus and method of treating a substrate |
WO2015200719A1 (en) | 2014-06-25 | 2015-12-30 | Dcg Systems, Inc. | Through process flow intra-chip and inter-chip electrical analysis and process control using in-line nanoprobing |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2967907A (en) * | 1952-06-02 | 1961-01-10 | Hogan Faximile Corp | Continuous facsimile scanning apparatus |
US2912497A (en) * | 1955-12-21 | 1959-11-10 | Western Union Telegraph Co | Optical scanner |
US3806643A (en) * | 1966-09-01 | 1974-04-23 | Battelle Development Corp | Photographic records of digital information and playback systems including optical scanners |
US3993909A (en) * | 1973-03-16 | 1976-11-23 | U.S. Philips Corporation | Substrate holder for etching thin films |
JPS55104057A (en) * | 1979-02-02 | 1980-08-09 | Hitachi Ltd | Ion implantation device |
US4509162A (en) * | 1980-10-28 | 1985-04-02 | Quixote Corporation | High density recording medium |
US4423137A (en) * | 1980-10-28 | 1983-12-27 | Quixote Corporation | Contact printing and etching method of making high density recording medium |
JPS57161641A (en) * | 1981-03-31 | 1982-10-05 | Olympus Optical Co Ltd | Inspecting device for defect of surface |
US4668366A (en) * | 1984-08-02 | 1987-05-26 | The Perkin-Elmer Corporation | Optical figuring by plasma assisted chemical transport and etching apparatus therefor |
JPH07114226B2 (ja) * | 1986-10-28 | 1995-12-06 | 東京エレクトロン株式会社 | プローブ装置及びプロービング方法 |
JPH0480919A (ja) * | 1990-07-24 | 1992-03-13 | Sony Corp | プラズマ診断装置 |
JPH0499626A (ja) * | 1990-08-17 | 1992-03-31 | Ishizaka Shoji Kk | 捺染スクリーンの製造方法 |
JPH0834198B2 (ja) * | 1990-11-28 | 1996-03-29 | 信越半導体株式会社 | Soi基板における単結晶薄膜層の膜厚制御方法 |
US5254830A (en) * | 1991-05-07 | 1993-10-19 | Hughes Aircraft Company | System for removing material from semiconductor wafers using a contained plasma |
-
1992
- 1992-06-16 US US07/899,419 patent/US5282921A/en not_active Expired - Lifetime
-
1993
- 1993-03-24 US US08/036,310 patent/US5312510A/en not_active Expired - Lifetime
- 1993-06-14 EP EP93304592A patent/EP0579380A1/en not_active Withdrawn
- 1993-06-14 IL IL10601893A patent/IL106018A/en not_active IP Right Cessation
- 1993-06-15 NO NO932203A patent/NO932203L/no unknown
- 1993-06-16 JP JP5145217A patent/JPH0653178A/ja active Pending
- 1993-07-14 TW TW082105621A patent/TW234785B/zh active
Also Published As
Publication number | Publication date |
---|---|
NO932203D0 (no) | 1993-06-15 |
US5282921A (en) | 1994-02-01 |
IL106018A0 (en) | 1993-10-20 |
IL106018A (en) | 1995-03-30 |
TW234785B (no) | 1994-11-21 |
US5312510A (en) | 1994-05-17 |
JPH0653178A (ja) | 1994-02-25 |
EP0579380A1 (en) | 1994-01-19 |
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