NO811175L - PROCEDURE FOR MANUFACTURING PRINTED LEADERS - Google Patents
PROCEDURE FOR MANUFACTURING PRINTED LEADERSInfo
- Publication number
- NO811175L NO811175L NO811175A NO811175A NO811175L NO 811175 L NO811175 L NO 811175L NO 811175 A NO811175 A NO 811175A NO 811175 A NO811175 A NO 811175A NO 811175 L NO811175 L NO 811175L
- Authority
- NO
- Norway
- Prior art keywords
- conductor
- lighting
- printing
- copper
- plates
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 24
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000004020 conductor Substances 0.000 claims description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000011888 foil Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000005286 illumination Methods 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 4
- 230000007547 defect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000012550 audit Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0505—Double exposure of the same photosensitive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Materials For Medical Uses (AREA)
- Prostheses (AREA)
- Orthopedics, Nursing, And Contraception (AREA)
Description
Oppfinnelsens "Fremgangsmåte til fremstilling av trykte lederplater" benevnelse: Oppfinnelsen angår en fremgangsmåte til fremstilling av trykte lederplater hvor platene, som er forkobret på kjemisk vei etter boringen, oppbygges galvanisk til den forlangte endelige tykkelse over hele arealet, boringene innbefattet, og lederplaten derpå belegges med en negativt arbeidende polymerfolie over hele arealet, og hvor de ikke belyste steder erter belysningen vaskes ut.ved fremkallingen, hvoretter det frittliggende kobber etses bort (tenting-metode). The invention's "Procedure for the production of printed conductor plates" designation: The invention relates to a method for the production of printed conductor plates where the plates, which are copper-coated chemically after drilling, are galvanically built up to the required final thickness over the entire area, the holes included, and the conductor plate is then coated with a negatively working polymer foil over the entire area, and where the non-illuminated places the lighting is washed out during development, after which the detached copper is etched away (tenting method).
For fremstilling av lederplater finnes der forskjellige metoder. En metode som særlig anvendes for fremstilling av høy-verdige lederplater med fine lederbildekonfigurasjoner, resp. snevre toleranser, er den såkalte "tenting-metode". There are different methods for the production of conductor plates. A method that is particularly used for the production of high-quality conductor plates with fine conductor image configurations, resp. tight tolerances, is the so-called "tenting method".
Denne metode har fremfor de tradisjonelle den fordel at kobberlaget kan påføres i en enkelt operasjon, og at der ikke behøves noen mellomfortinning ("metal-resist") så der spares operasjoner og materiale. Med denne metode blir lederplatene etter boringen kjemisk forkobret (gjennomkontaktert). Det kjemiske kobberskikt blir i én operasjon oppbygget galvanisk til den forlangte endelige tykkelse over hele arealet (panel plating"). For fremstilling av lederbildet blir lederplaten nu belagt med en lysfølsom, negativt arbeidende fotopolymerfolie, denne blir ved hjelp av ultrafiolett lys og et trykkeverktøy belyst (polymerisert) på bestemte steder som f.eks. lederbaner, loddeøyne, og de ikke belyste steder blir deretter vasket ut ved fremkallingen. Det frittliggende kobber kan så etses bort med et egnet etsemedium. Lederbildet med loddeøyne og gjennom-kontakteringen. blir dermed beskyttet av fotopolymerfolien. This method has the advantage over traditional methods that the copper layer can be applied in a single operation, and that there is no need for intermediate tinning ("metal-resist"), so operations and material are saved. With this method, after drilling, the conductor plates are chemically copper plated (through contact). The chemical copper layer is galvanically built up in one operation to the required final thickness over the entire area (panel plating"). To produce the conductor image, the conductor plate is now coated with a light-sensitive, negatively working photopolymer foil, which is illuminated with the help of ultraviolet light and a printing tool (polymerized) in certain places such as conductor paths, solder eyes, and the non-illuminated places are then washed out during development. The exposed copper can then be etched away with a suitable etching medium. The conductor image with solder eyes and the through contact. is thus protected of the photopolymer foil.
Etter fjernelsen av fotopolymerfolien foreligger lederbildetAfter the removal of the photopolymer foil, the conductor image is available
i kobberoverflaten og kan så bearbeides videre.in the copper surface and can then be processed further.
Et kritisk punkt ved den beskrevne metode ligger i belysningen av fotopolymerfolien. Støv resp. partikler som ikke slipper lys igjennom, mellom lyskilde og fotopolymerfolie fører til feil i avbildingen, som f.eks. avbrudd eller innsnevringer i lederbaner eller åpne boringstildekninger, og dermed til behov for revisjon og retusjering resp. til etsefeil som nødvendiggjør etterbearbeidelse av de etsede lederbilder i form av sveising av avbrutte lederbaner eller klinking av utetsede borings-gjennom-kontakteringer eller også til kassering av de defekte lederplater. For å unngå disse feil blir der derfor ved utførelsen av belysningsoperasjonen ved "tenting-metoden" stillet ytterst strenge krav når det gjelder renhet av arbeidsrom, trykkverktøy og belysningsapparat. Dessuten behøves betraktelige revisjons- A critical point in the described method lies in the illumination of the photopolymer foil. Dust or particles that do not let light through, between the light source and photopolymer foil lead to errors in the image, such as e.g. interruptions or narrowings in conductor tracks or open drilling covers, and thus to the need for revision and retouching or for etching defects which necessitate post-processing of the etched conductor images in the form of welding of interrupted conductor paths or riveting of unetched bore-through contacts or also for discarding the defective conductor plates. In order to avoid these errors, extremely strict requirements are therefore made when performing the lighting operation using the "tenting method" in terms of the cleanliness of the workroom, pressure tools and lighting equipment. In addition, considerable audit
og retusjeringsarbeider på lederplatene med den påtrykte fotopolymerfolie for å holde etsefeil og dermed etterarbeide og vrakning innen forsvarlige grenser. and retouching work on the conductor plates with the printed photopolymer foil to keep etching defects and thus rework and scrapping within safe limits.
Den foreliggende oppfinnelse har til oppgave å giThe present invention has the task of providing
anvisning på en "tenting-metode" med redusert behov for revisjons-og retusjeringsarbeider på den trykte plate såvel som etterarbeide på de etsede lederbilder. instruction on a "tenting method" with reduced need for revision and retouching work on the printed plate as well as post-work on the etched leader images.
For løsning av denne oppgave foretar man ifølge oppfinnelsen en dobbelt belysning for å frembringe lederbildet. To solve this task, according to the invention, a double illumination is carried out to produce the leader image.
Ved denne forholdsregel blir det oppnådd at lederbildetWith this precaution, it is achieved that the leadership image
blir belyst påny i den annen belysningsoperasjon, hvorved steder med belysningsfeil etter første belysningsoperasjon blir eliminert, idet det er høyst usannsynlig at der skal opptre en belysningsfeil på samme sted ved første og annen gangs belysning. is illuminated again in the second lighting operation, whereby places with lighting faults after the first lighting operation are eliminated, as it is highly unlikely that a lighting fault will occur in the same place during the first and second lighting.
En gunstig videre utvikling av fremgangsmåten går ut påA favorable further development of the method involves
at der ved den første belysningsoperasjon anvendes et trykke-verktøy med de dimensjoner som ønskes for lederbaner og lodde-øyne, og der ved den annen belysningsoperasjon anvendes et trykke-verktøy med samme lederbildekonfigurasjon som ved første trykk, men med mindre lederbredde og mindre diameter av loddeøynene. that in the first lighting operation a printing tool with the desired dimensions for conductor tracks and solder eyes is used, and in the second lighting operation a printing tool is used with the same conductor image configuration as in the first printing, but with smaller conductor width and smaller diameter of the solder eyes.
Den annen belysningsoperasjon kan skje på en annen belysningsstasjon. The second lighting operation can take place at another lighting station.
På grunn av de mindre lederbredder og mindre loddeøyne-diametre på det annet trykkverktøy blir toleransene med hensyn til trykkeverktøy og trykk utlignet, og' man unngår uttillatelig sidelengs utbredelse av lederbanene og forstørrelse av lodde-øynene, resp. forringelse av kvaliteten av fotopolymerfoliens kanter ved den annen belysningsoperasjon. Due to the smaller conductor widths and smaller solder eye diameters on the other pressure tool, the tolerances with respect to the pressure tool and pressure are equalized, and impermissible lateral spreading of the conductor paths and enlargement of the solder eyes, resp. deterioration of the quality of the edges of the photopolymer film in the second illumination operation.
Besparelsene når det gjelder mindre strenge krav til renhet under belysningen såvel som behovet for revisjon og retusjering ved trykkeverktøy og lederplater samt mindre vrakprosent over-veier langt meromkostningene til fremstilling av det annet trykkeverktøy og til den annen belysningsprosess. The savings in terms of less strict requirements for cleanliness during lighting as well as the need for revision and retouching of printing tools and conductor plates as well as a lower percentage of scrap far outweigh the additional costs for manufacturing the second printing tool and for the second lighting process.
Oppfinnelsen vil i det følgende bli belyst nærmere under henvisning til tegningen. The invention will be explained in more detail below with reference to the drawing.
Fig. 1 viser en belysningsanordning.Fig. 1 shows a lighting device.
Fig. 2 viser trykkeverktøy og trykkresultat etter den Fig. 2 shows the printing tool and the printing result after it
tradisjonelle belysningsmetode.traditional lighting method.
Fig. 3 viser trykkeverktøy og trykkeresultat ved fremgangsmåten ifølge oppfinnelsen. Fig. 3 shows the printing tool and printing result of the method according to the invention.
Ved belysningsanordningen på fig. 1 er der på et belysningsapparat 1 inneholdende et underlag i form av en glassskive 2 In the case of the lighting device in fig. 1 is there on a lighting device 1 containing a substrate in the form of a glass disc 2
som bestråles bakfra av en lyskilde 3, lagt et trykkverktøy 4 som tjener som sjablon. Over sjablonen 4 legges lederplaten 5, som er belagt med en negativt arbeidende fotopolymerfolie 6. which is irradiated from behind by a light source 3, a pressure tool 4 is placed which serves as a template. The conductor plate 5, which is coated with a negatively working photopolymer foil 6, is placed over the template 4.
På fig. 2 ses i øvre del trykkeverktøyet 7, som for enkel-hets skyld f.eks. bare skal ha én lederbane 8, som er avbrutt på stedet 9. In fig. 2 shows in the upper part the printing tool 7, which for the sake of simplicity e.g. must only have one conductor path 8, which is interrupted at the location 9.
Nedenfor trykkeverktøyet ses det ferdige trykkeprodukt, f.eks. den trykte lederplate. Man ser at et avbrudd i lederbanen som ble forårsaket av en feil ved trykkeverktøyet, stadig foreligger. Samtidig forekommer der også en loddeøyefeil 10 som f.eks. kan være forårsaket av støvpartikler mellom lyskilden og fotopolymerfolien. Below the printing tool is the finished printing product, e.g. the printed circuit board. It can be seen that an interruption in the conductor track, which was caused by an error with the printing tool, still exists. At the same time, there also occurs a solder eye error 10, which e.g. may be caused by dust particles between the light source and the photopolymer film.
På fig. 3 ses oventil til venstre et trykkeverktøy 7 med en lederbane 8 som oppviser et avbrudd 9. Nedenunder ses igjen det viste objekt, f.eks. en lederplate, som har de samme feil som lederplaten på fig. 1. Til høyre for disse bilder er den annen belysningsoperasjon skjematisk anskueliggjort. Oventil til høyre ses det annet trykkeverktøy 12, som oppviser et lednings-avbrudd 13 på et annet sted av lederbanen. Ved den annen belysningsoperasjon er både de to første feil fra den første belysningsoperasjon og den av trykkeverktøyet 12 forårsakede feil i det trykte produkt, som er vist nedenfor det annet trykke-verktøy 12, fullstendig eliminert. Man får et fullstendig feil-fritt trykkbilde på lederplaten 14. In fig. 3, a printing tool 7 with a conductor track 8 which exhibits an interruption 9 is seen in the upper left. Below, the shown object is seen again, e.g. a conductor plate, which has the same defects as the conductor plate in fig. 1. To the right of these images, the second lighting operation is shown schematically. Above on the right, the second pressing tool 12 is seen, which shows a wire interruption 13 in another place of the conductor track. In the second illumination operation, both the first two errors from the first illumination operation and the error caused by the printing tool 12 in the printed product, which is shown below the second printing tool 12, are completely eliminated. A completely error-free printed image is obtained on the conductor plate 14.
Fremgangsmåten ifølge oppfinnelsen er foruten ved den beskrevne "tenting-metode" også egnet for alle trykkemetoder hvor der anvendes et negativt arbeidende fotopolymerskikt. In addition to the described "tenting method", the method according to the invention is also suitable for all printing methods where a negatively working photopolymer layer is used.
Claims (3)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19803013819 DE3013819A1 (en) | 1980-04-10 | 1980-04-10 | METHOD FOR PRODUCING PRINTED CIRCUITS |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NO811175L true NO811175L (en) | 1981-10-12 |
Family
ID=6099682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO811175A NO811175L (en) | 1980-04-10 | 1981-04-06 | PROCEDURE FOR MANUFACTURING PRINTED LEADERS |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0037936A3 (en) |
| DE (1) | DE3013819A1 (en) |
| NO (1) | NO811175L (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59194867A (en) * | 1983-04-20 | 1984-11-05 | Canon Inc | Manufacture of liquid jet recording head |
| JPH062415B2 (en) * | 1983-04-20 | 1994-01-12 | キヤノン株式会社 | INKJET HEAD AND METHOD OF MANUFACTURING THE INKJET HEAD |
| CN102879998A (en) * | 2012-09-18 | 2013-01-16 | 深圳力合光电传感技术有限公司 | Method for etching touch screen |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1597794A1 (en) * | 1967-07-20 | 1970-06-18 | Puls Ewald | Process and device for the production of printing plates or etching plates for web offset or letterpress |
| DE1772112A1 (en) * | 1968-04-01 | 1971-01-28 | Siemens Ag | Process for producing a photoresist composition for semiconductor purposes |
| DE2143737A1 (en) * | 1971-09-01 | 1973-03-08 | Ibm Deutschland | PHOTO ETCHING |
-
1980
- 1980-04-10 DE DE19803013819 patent/DE3013819A1/en not_active Ceased
-
1981
- 1981-03-25 EP EP81102245A patent/EP0037936A3/en not_active Ceased
- 1981-04-06 NO NO811175A patent/NO811175L/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE3013819A1 (en) | 1981-10-15 |
| EP0037936A3 (en) | 1983-08-17 |
| EP0037936A2 (en) | 1981-10-21 |
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