NO2777050T3 - - Google Patents
Info
- Publication number
- NO2777050T3 NO2777050T3 NO12778009A NO12778009A NO2777050T3 NO 2777050 T3 NO2777050 T3 NO 2777050T3 NO 12778009 A NO12778009 A NO 12778009A NO 12778009 A NO12778009 A NO 12778009A NO 2777050 T3 NO2777050 T3 NO 2777050T3
- Authority
- NO
- Norway
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Micromachines (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Element Separation (AREA)
- Semiconductor Memories (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014002825.9A DE102014002825A1 (de) | 2014-02-25 | 2014-02-25 | Verfahren zur Herstellung eines Bauteils und Bauteil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NO2777050T3 true NO2777050T3 (ko) | 2018-06-16 |
Family
ID=52472278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO12778009A NO2777050T3 (ko) | 2014-02-25 | 2012-10-11 |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US10000376B2 (ko) |
| EP (1) | EP3110748B1 (ko) |
| JP (1) | JP6263283B2 (ko) |
| KR (1) | KR101901503B1 (ko) |
| CN (1) | CN105980293B (ko) |
| AU (1) | AU2015222512B2 (ko) |
| BR (1) | BR112016015806B1 (ko) |
| CA (1) | CA2936000C (ko) |
| DE (1) | DE102014002825A1 (ko) |
| IL (1) | IL246394A (ko) |
| NO (1) | NO2777050T3 (ko) |
| RU (1) | RU2640892C1 (ko) |
| SG (1) | SG11201607078WA (ko) |
| WO (1) | WO2015128063A1 (ko) |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101714516A (zh) * | 2001-08-24 | 2010-05-26 | 肖特股份公司 | 用于形成触点的方法及封装的集成电路组件 |
| US7422928B2 (en) * | 2003-09-22 | 2008-09-09 | Matsushita Electric Works, Ltd. | Process for fabricating a micro-electro-mechanical system with movable components |
| DE102005015584B4 (de) | 2005-04-05 | 2010-09-02 | Litef Gmbh | Verfahren zur Herstellung eines mikromechanischen Bauteils |
| US7539003B2 (en) * | 2005-12-01 | 2009-05-26 | Lv Sensors, Inc. | Capacitive micro-electro-mechanical sensors with single crystal silicon electrodes |
| JP4792143B2 (ja) * | 2007-02-22 | 2011-10-12 | 株式会社デンソー | 半導体装置およびその製造方法 |
| DE102007030121A1 (de) * | 2007-06-29 | 2009-01-02 | Litef Gmbh | Verfahren zur Herstellung eines Bauteils und Bauteil |
| DE102008042350A1 (de) * | 2008-09-25 | 2010-04-01 | Robert Bosch Gmbh | Mikromechanisches Bauelement und Verfahren zu dessen Herstellung |
| JP5177015B2 (ja) * | 2009-02-27 | 2013-04-03 | 富士通株式会社 | パッケージドデバイスおよびパッケージドデバイス製造方法 |
| JP5206826B2 (ja) * | 2011-03-04 | 2013-06-12 | 株式会社デンソー | 領域分割基板およびそれを用いた半導体装置ならびにそれらの製造方法 |
| DE102011085084B4 (de) * | 2011-10-24 | 2022-01-13 | Robert Bosch Gmbh | Verfahren zum Herstellen einer elektrischen Durchkontaktierung in einem Substrat sowie Substrat mit einer elektrischen Durchkontaktierung |
| DE102012206732A1 (de) * | 2012-04-24 | 2013-10-24 | Robert Bosch Gmbh | Verfahren zum Herstellen eines hybrid integrierten Bauteils |
| DE102012208033B4 (de) | 2012-05-14 | 2020-08-06 | Robert Bosch Gmbh | Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung |
| DE102012210480B4 (de) * | 2012-06-21 | 2024-05-08 | Robert Bosch Gmbh | Verfahren zum Herstellen eines Bauelements mit einer elektrischen Durchkontaktierung |
| CN203269551U (zh) * | 2013-05-09 | 2013-11-06 | 苏州敏芯微电子技术有限公司 | 微机电系统与集成电路的集成芯片 |
| CN103552980A (zh) * | 2013-11-15 | 2014-02-05 | 安徽北方芯动联科微系统技术有限公司 | Mems芯片圆片级封装方法及其单片超小型mems芯片 |
-
2012
- 2012-10-11 NO NO12778009A patent/NO2777050T3/no unknown
-
2014
- 2014-02-25 DE DE102014002825.9A patent/DE102014002825A1/de not_active Withdrawn
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2015
- 2015-02-11 SG SG11201607078WA patent/SG11201607078WA/en unknown
- 2015-02-11 BR BR112016015806-7A patent/BR112016015806B1/pt active IP Right Grant
- 2015-02-11 WO PCT/EP2015/000304 patent/WO2015128063A1/de active Application Filing
- 2015-02-11 CN CN201580006575.7A patent/CN105980293B/zh active Active
- 2015-02-11 JP JP2016570170A patent/JP6263283B2/ja active Active
- 2015-02-11 US US15/121,595 patent/US10000376B2/en active Active
- 2015-02-11 EP EP15704464.5A patent/EP3110748B1/de active Active
- 2015-02-11 AU AU2015222512A patent/AU2015222512B2/en active Active
- 2015-02-11 KR KR1020167023053A patent/KR101901503B1/ko active IP Right Grant
- 2015-02-11 CA CA2936000A patent/CA2936000C/en active Active
- 2015-02-11 RU RU2016125157A patent/RU2640892C1/ru active
-
2016
- 2016-06-22 IL IL246394A patent/IL246394A/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| IL246394A (en) | 2016-11-30 |
| AU2015222512B2 (en) | 2017-10-05 |
| BR112016015806A2 (pt) | 2017-08-08 |
| CN105980293A (zh) | 2016-09-28 |
| CA2936000A1 (en) | 2015-09-03 |
| US10000376B2 (en) | 2018-06-19 |
| EP3110748B1 (de) | 2018-01-10 |
| BR112016015806B1 (pt) | 2021-11-30 |
| EP3110748A1 (de) | 2017-01-04 |
| WO2015128063A1 (de) | 2015-09-03 |
| AU2015222512A1 (en) | 2016-09-22 |
| SG11201607078WA (en) | 2016-10-28 |
| JP6263283B2 (ja) | 2018-01-17 |
| KR20160111503A (ko) | 2016-09-26 |
| RU2640892C1 (ru) | 2018-01-12 |
| KR101901503B1 (ko) | 2018-11-05 |
| CA2936000C (en) | 2017-02-07 |
| US20160362297A1 (en) | 2016-12-15 |
| JP2017506167A (ja) | 2017-03-02 |
| DE102014002825A1 (de) | 2015-08-27 |
| CN105980293B (zh) | 2019-01-04 |