NO2595460T3 - - Google Patents

Info

Publication number
NO2595460T3
NO2595460T3 NO10849617A NO10849617A NO2595460T3 NO 2595460 T3 NO2595460 T3 NO 2595460T3 NO 10849617 A NO10849617 A NO 10849617A NO 10849617 A NO10849617 A NO 10849617A NO 2595460 T3 NO2595460 T3 NO 2595460T3
Authority
NO
Norway
Application number
NO10849617A
Other languages
Norwegian (no)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NO2595460T3 publication Critical patent/NO2595460T3/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L47/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/016—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
NO10849617A 2010-07-14 2010-07-14 NO2595460T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2010/075149 WO2012006776A1 (zh) 2010-07-14 2010-07-14 复合材料、用其制作的高频电路基板及其制作方法

Publications (1)

Publication Number Publication Date
NO2595460T3 true NO2595460T3 (es) 2018-03-10

Family

ID=45468875

Family Applications (1)

Application Number Title Priority Date Filing Date
NO10849617A NO2595460T3 (es) 2010-07-14 2010-07-14

Country Status (6)

Country Link
US (1) US9890276B2 (es)
EP (1) EP2595460B1 (es)
AU (1) AU2010345325B2 (es)
ES (1) ES2655275T3 (es)
NO (1) NO2595460T3 (es)
WO (1) WO2012006776A1 (es)

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US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
TWI464213B (zh) * 2013-03-07 2014-12-11 Taiwan Union Technology Corp 樹脂組合物及其應用
EP2838086A1 (en) 2013-07-22 2015-02-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. In an reduction of comb filter artifacts in multi-channel downmix with adaptive phase alignment
TWI506077B (zh) 2013-12-31 2015-11-01 Taiwan Union Technology Corp 樹脂組合物及其應用
WO2016105051A1 (ko) * 2014-12-22 2016-06-30 주식회사 두산 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판
KR101865649B1 (ko) 2014-12-22 2018-07-04 주식회사 두산 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판
WO2016147984A1 (ja) * 2015-03-13 2016-09-22 京セラ株式会社 樹脂組成物、プリプレグ、金属張積層板および配線基板
WO2017201592A1 (pt) * 2016-05-25 2017-11-30 Luciano Fusco Método para a fabricação de um compósito líquido feito de resina e fibra de vidro e um compósito líquido feito pelo método
KR102337574B1 (ko) * 2016-07-12 2021-12-13 주식회사 두산 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판
CN109053944B (zh) * 2017-06-13 2020-03-17 广东生益科技股份有限公司 一种聚合物树脂及其在高频电路板中的应用
CN109912908B (zh) 2017-12-13 2021-05-18 财团法人工业技术研究院 基板组合物及由其所制备的基板
CN111378242B (zh) * 2018-12-29 2022-10-18 广东生益科技股份有限公司 一种树脂组合物、包含其的预浸料、介质基板以及印刷电路板
CN111154212B (zh) * 2019-09-24 2022-10-21 张家界皓文树脂合成有限公司 热塑型高频高速树脂组合物
KR20220089694A (ko) 2019-10-30 2022-06-28 린텍 가부시키가이샤 접착제 조성물 및 접착 시트
JP7286569B2 (ja) * 2020-02-17 2023-06-05 信越化学工業株式会社 熱硬化性樹脂組成物、熱硬化性接着剤、熱硬化性樹脂フィルム並びに前記熱硬化性樹脂組成物を用いた積層板、プリプレグ、及び回路基板
JP6905160B1 (ja) * 2020-03-13 2021-07-21 リンテック株式会社 デバイス用硬化性接着シート
CN111253702B (zh) * 2020-03-30 2023-06-06 广东生益科技股份有限公司 一种树脂组合物及使用其的预浸料和电路材料
KR20220043497A (ko) * 2020-09-29 2022-04-05 주식회사 엘지에너지솔루션 수지 조성물
CN112266602A (zh) * 2020-11-23 2021-01-26 江苏诺德新材料股份有限公司 一种碳氢复合材料及其制造的高频覆铜板
CN113316320A (zh) * 2021-04-13 2021-08-27 青岛中青电子软件有限公司 一种高导热pcb基板的加工制备方法
CN115073858B (zh) * 2022-06-15 2023-11-14 西安天和嘉膜工业材料有限责任公司 高频板用双马改性烯烃树脂胶液、胶布及制备方法和应用
CN115093818B (zh) * 2022-06-27 2023-08-11 浙江亦龙新材料有限公司 一种电子级胶黏剂及其制备方法

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US5571609A (en) 1994-10-13 1996-11-05 Rogers Corporation Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture thereof
WO1997038564A1 (en) 1996-04-09 1997-10-16 Arlon, Inc. Composite dielectric material
JPH1112456A (ja) * 1997-06-24 1999-01-19 Matsushita Electric Works Ltd 樹脂組成物、プリプレグ及び積層板
US6333384B1 (en) 1998-11-02 2001-12-25 Gil Technologies Vinyl-terminated polybutadiene and butadiene-styrene copolymers containing urethane and/or ester residues, and the electrical laminates obtained therefrom
US6878782B2 (en) 1999-12-01 2005-04-12 General Electric Thermoset composition, method, and article
US6352782B2 (en) * 1999-12-01 2002-03-05 General Electric Company Poly(phenylene ether)-polyvinyl thermosetting resin
US6306963B1 (en) * 2000-05-08 2001-10-23 General Electric Co. Thermosetting resins and laminates
JP5328064B2 (ja) * 2000-08-10 2013-10-30 日本化薬株式会社 多価フェノール化合物、熱硬化性樹脂組成物及びその硬化物
JP2005105062A (ja) * 2003-09-29 2005-04-21 Tdk Corp 樹脂組成物、樹脂付導体箔、プリプレグ、シート、導体箔付シート、積層板およびプリント配線基板
TW200730601A (en) * 2006-02-07 2007-08-16 Nanya Plastics Corp Electronic insulating bond play or bonding sheet
EP2025696A1 (en) * 2006-06-06 2009-02-18 Hitachi Chemical Company, Ltd. Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate
JP5433416B2 (ja) * 2006-08-08 2014-03-05 ワールド プラパティーズ、 インコーポレイテッド 回路材料、回路および多層回路積層板
JP5104507B2 (ja) 2007-04-26 2012-12-19 日立化成工業株式会社 セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板
JP5181221B2 (ja) 2008-01-15 2013-04-10 日立化成株式会社 低熱膨張性低誘電損失プリプレグ及びその応用品
JP4613977B2 (ja) 2008-04-28 2011-01-19 日立化成工業株式会社 薄層石英ガラスクロスを含むプリプレグ、およびそれを用いた配線板
CN101328277B (zh) * 2008-07-28 2010-07-21 广东生益科技股份有限公司 一种复合材料、用其制作的高频电路基板及制作方法
JP5093059B2 (ja) * 2008-11-06 2012-12-05 日立化成工業株式会社 樹脂組成物、プリプレグ、積層板及びプリント基板
CN101747854B (zh) * 2008-12-04 2012-11-21 比亚迪股份有限公司 胶粘剂组合物以及覆盖膜和柔性线路板
US8227948B1 (en) 2009-01-09 2012-07-24 Hydro-Gear Limited Partnership Electric motor
CN101544841B (zh) * 2009-04-10 2010-07-21 广东生益科技股份有限公司 复合材料及用其制作的高频电路基板
CN101643565B (zh) * 2009-08-24 2010-07-21 广东生益科技股份有限公司 复合材料、用其制作的高频电路基板及其制作方法
CN101735562B (zh) * 2009-12-11 2012-09-26 广东生益科技股份有限公司 环氧树脂组合物及其制备方法及采用其制作的层压材料及覆铜箔层压板

Also Published As

Publication number Publication date
ES2655275T3 (es) 2018-02-19
AU2010345325B2 (en) 2013-09-26
US9890276B2 (en) 2018-02-13
EP2595460B1 (en) 2017-10-11
US20130180770A1 (en) 2013-07-18
WO2012006776A1 (zh) 2012-01-19
AU2010345325A1 (en) 2012-02-02
EP2595460A1 (en) 2013-05-22
EP2595460A4 (en) 2015-06-10

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