NO20071957L - Elektrisk kretspakke med keramisk substrat, ledende grunnplate og lederlegeme - Google Patents

Elektrisk kretspakke med keramisk substrat, ledende grunnplate og lederlegeme

Info

Publication number
NO20071957L
NO20071957L NO20071957A NO20071957A NO20071957L NO 20071957 L NO20071957 L NO 20071957L NO 20071957 A NO20071957 A NO 20071957A NO 20071957 A NO20071957 A NO 20071957A NO 20071957 L NO20071957 L NO 20071957L
Authority
NO
Norway
Prior art keywords
electrical circuit
conductor body
ceramic substrate
circuit board
base plate
Prior art date
Application number
NO20071957A
Other languages
English (en)
Inventor
Jens Helfrich
Rolf Disselnkotter
Hans-Joachim Krokoszinski
Original Assignee
Vetco Gray Controls Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vetco Gray Controls Ltd filed Critical Vetco Gray Controls Ltd
Publication of NO20071957L publication Critical patent/NO20071957L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

En elektrisk kretspakke omfatter et keramisk substrat (1) med et elektrisk kretsmønster utformet på sin ene overflate, mens den motsatte overflate av substratet er metallisert, og hvor en elektrisk ledende, liten plate (2) og et lederlegeme (3) er slik anordnet at en første side av den lille plate er loddet til den metalliserte overflate av substratet, mens den motsatte side av den lille plate er festet i kontakt med lederlegemet. En fremgangsmåte for å bygge pakken er også beskrevet.
NO20071957A 2004-09-23 2007-04-17 Elektrisk kretspakke med keramisk substrat, ledende grunnplate og lederlegeme NO20071957L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0421131A GB2418539A (en) 2004-09-23 2004-09-23 Electrical circuit package
PCT/GB2005/003288 WO2006032835A2 (en) 2004-09-23 2005-08-24 Electrical circuit package with ceramic substrate, conductive platelet and conductor body

Publications (1)

Publication Number Publication Date
NO20071957L true NO20071957L (no) 2007-06-25

Family

ID=33397101

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20071957A NO20071957L (no) 2004-09-23 2007-04-17 Elektrisk kretspakke med keramisk substrat, ledende grunnplate og lederlegeme

Country Status (4)

Country Link
US (1) US20080080141A1 (no)
GB (2) GB2418539A (no)
NO (1) NO20071957L (no)
WO (1) WO2006032835A2 (no)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7742309B2 (en) 2006-12-29 2010-06-22 Nokia Corporation Electronic device and method of assembling an electronic device
WO2016017260A1 (ja) * 2014-07-30 2016-02-04 富士電機株式会社 半導体モジュール

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4242157A (en) * 1979-04-20 1980-12-30 Rockwell International Corporation Method of assembly of microwave integrated circuits having a structurally continuous ground plane
FR2524247A1 (fr) * 1982-03-23 1983-09-30 Thomson Csf Procede de fabrication de circuits imprimes avec support metallique rigide conducteur individuel
DE3930858C2 (de) * 1988-09-20 2002-01-03 Peter H Maier Modulaufbau
US5173842A (en) * 1991-09-27 1992-12-22 International Business Machines Corporation Electrical assembly with deformable bridge printed circuit board
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
DE19515073A1 (de) * 1995-04-28 1996-10-31 Thomson Brandt Gmbh Klipp zum Befestigen von Elektronikbauelementen
US6586058B1 (en) * 1997-01-13 2003-07-01 International Business Machines Corporation Equipment packages for shock resistance
US6207221B1 (en) * 1997-03-01 2001-03-27 Jürgen Schulz-Harder Process for producing a metal-ceramic substrate and a metal-ceramic substrate
US6259157B1 (en) * 1998-03-11 2001-07-10 Sanyo Electric Co., Ltd. Hybrid integrated circuit device, and method of manufacturing thereof
JP3445511B2 (ja) * 1998-12-10 2003-09-08 株式会社東芝 絶縁基板、その製造方法およびそれを用いた半導体装置
DE19914497A1 (de) * 1999-03-30 2000-10-19 Siemens Ag Wärmeableitender Sockel für Bauelementträger
AT408345B (de) * 1999-11-17 2001-10-25 Electrovac Verfahren zur festlegung eines aus metall-matrix- composite-(mmc-) materiales gebildeten körpers auf einem keramischen körper
AT411126B (de) * 2001-04-06 2003-09-25 Siemens Ag Oesterreich Halbleitermodul
JP2003163315A (ja) * 2001-11-29 2003-06-06 Denki Kagaku Kogyo Kk モジュール
US7142434B2 (en) * 2002-01-16 2006-11-28 Rockwell Automation Technologies, Inc. Vehicle drive module having improved EMI shielding
US6560110B1 (en) * 2002-02-22 2003-05-06 Delphi Technologies, Inc. Corrosive resistant flip chip thermal management structure
JP4081430B2 (ja) * 2003-11-19 2008-04-23 本田技研工業株式会社 燃料電池車両

Also Published As

Publication number Publication date
GB0421131D0 (en) 2004-10-27
WO2006032835A3 (en) 2006-06-08
US20080080141A1 (en) 2008-04-03
WO2006032835A2 (en) 2006-03-30
GB0706468D0 (en) 2007-05-09
GB2432977A (en) 2007-06-06
GB2418539A (en) 2006-03-29

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Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application