NO20020321L - LED signals - Google Patents

LED signals

Info

Publication number
NO20020321L
NO20020321L NO20020321A NO20020321A NO20020321L NO 20020321 L NO20020321 L NO 20020321L NO 20020321 A NO20020321 A NO 20020321A NO 20020321 A NO20020321 A NO 20020321A NO 20020321 L NO20020321 L NO 20020321L
Authority
NO
Norway
Prior art keywords
main surface
conducting
led signals
tracks
thermally conducting
Prior art date
Application number
NO20020321A
Other languages
Norwegian (no)
Other versions
NO20020321D0 (en
NO322102B1 (en
Inventor
Simon Bluemel
Ulrich Kreplin
Dirk Zimmermann
Axel Heilmann
Michael Zabel
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of NO20020321D0 publication Critical patent/NO20020321D0/en
Publication of NO20020321L publication Critical patent/NO20020321L/en
Publication of NO322102B1 publication Critical patent/NO322102B1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Devices (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The module has a number of LED components (2) on a first main surface (11) of an electrically insulating circuit board (10) and a cooling device (3) on an opposing second main surface (12), conducting tracks (4) on the first main surface and dust-tight thermally conducting leadthroughs (50) providing a thermally conducting connection from the conducting tracks to the second main surface.
NO20020321A 2001-01-19 2002-01-21 LED signal module NO322102B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10102353A DE10102353B4 (en) 2001-01-19 2001-01-19 LED signal module

Publications (3)

Publication Number Publication Date
NO20020321D0 NO20020321D0 (en) 2002-01-21
NO20020321L true NO20020321L (en) 2002-07-22
NO322102B1 NO322102B1 (en) 2006-08-14

Family

ID=7671117

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20020321A NO322102B1 (en) 2001-01-19 2002-01-21 LED signal module

Country Status (5)

Country Link
EP (1) EP1243843B1 (en)
AT (1) ATE419492T1 (en)
DE (2) DE10102353B4 (en)
DK (1) DK1243843T3 (en)
NO (1) NO322102B1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004053958B3 (en) * 2004-11-09 2005-09-01 Behr Hella Thermocontrol Gmbh Device for detecting electromagnetic radiation, especially sunlight, for use in vehicle, has metal core conducting plate with region(s) inclined to its plane, at least one optoelectronic component arranged in inclined region
CA2616007C (en) 2005-05-20 2018-02-27 Tir Technology Lp Light-emitting module
DE602005016280D1 (en) * 2005-11-29 2009-10-08 Nat Central University Jungli Light emitting device
US20080074884A1 (en) * 2006-09-25 2008-03-27 Thye Linn Mok Compact high-intensty LED-based light source and method for making the same
JP2010537214A (en) 2007-08-29 2010-12-02 ベーア−ヘラー サーモコントロール ゲーエムベーハー Solar sensor for detecting the direction and intensity of solar radiation
DE102009020851A1 (en) * 2009-05-12 2010-11-25 Osram Gesellschaft mit beschränkter Haftung Light strip and method for producing a light strip
ITTV20090228A1 (en) * 2009-12-09 2011-06-10 Giovine Vincenzo Di LONG-RANGE REACTOR INDICATOR WITH LED-TYPE LIGHT SOURCES
DE102012202353A1 (en) * 2012-02-16 2013-08-22 Osram Gmbh Light module circuit board
DE102017104386A1 (en) 2017-03-02 2018-09-06 HELLA GmbH & Co. KGaA Method for producing an electrical assembly

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4733335A (en) * 1984-12-28 1988-03-22 Koito Manufacturing Co., Ltd. Vehicular lamp
DE8815418U1 (en) * 1988-12-12 1989-02-16 Isensee-Electronic-GmbH, 7012 Fellbach Infrared spotlights
JPH033276A (en) * 1989-05-31 1991-01-09 Nippon Denyo Kk Led lamp
DE9003623U1 (en) * 1990-03-28 1990-10-31 Siemens AG, 1000 Berlin und 8000 München Device for dissipating waste heat from a circuit board
JPH07114813A (en) * 1993-10-19 1995-05-02 Koito Mfg Co Ltd Lighting fixture for vehicle
US5808592A (en) * 1994-04-28 1998-09-15 Toyoda Gosei Co., Ltd. Integrated light-emitting diode lamp and method of producing the same
DE4444567A1 (en) * 1994-12-02 1996-06-05 Siemens Ag Mfg. circuit board based on core plate of aluminium or alloy
US5612680A (en) * 1995-03-31 1997-03-18 Desanto; Joseph J. Universal termination module for assembling wire harnesses having multiple diverse connectors
DE19528459C2 (en) * 1995-08-03 2001-08-23 Garufo Gmbh Cooling for a light unit equipped with LEDs
US5785418A (en) * 1996-06-27 1998-07-28 Hochstein; Peter A. Thermally protected LED array
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
DE19736962B4 (en) * 1997-08-25 2009-08-06 Robert Bosch Gmbh Arrangement, comprising a carrier substrate for power devices and a heat sink and method for producing the same

Also Published As

Publication number Publication date
EP1243843A2 (en) 2002-09-25
DE10102353A1 (en) 2002-08-01
NO20020321D0 (en) 2002-01-21
EP1243843A3 (en) 2004-12-15
DK1243843T3 (en) 2009-04-14
DE50213157D1 (en) 2009-02-12
ATE419492T1 (en) 2009-01-15
EP1243843B1 (en) 2008-12-31
DE10102353B4 (en) 2007-11-15
NO322102B1 (en) 2006-08-14

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