TW200705633A - Thin film circuit connections - Google Patents

Thin film circuit connections

Info

Publication number
TW200705633A
TW200705633A TW095121767A TW95121767A TW200705633A TW 200705633 A TW200705633 A TW 200705633A TW 095121767 A TW095121767 A TW 095121767A TW 95121767 A TW95121767 A TW 95121767A TW 200705633 A TW200705633 A TW 200705633A
Authority
TW
Taiwan
Prior art keywords
thin film
substrate
circuit elements
foil
film circuit
Prior art date
Application number
TW095121767A
Other languages
Chinese (zh)
Inventor
Martin John Edwards
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200705633A publication Critical patent/TW200705633A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

An electronic device comprises a substrate (12) and thin film circuitry provided on the substrate and having a plurality of contact terminals (22) provided over the substrate. The thin film circuitry comprises at least first circuit elements (40). A connector foil arrangement (30) has a first foil portion (36) having conducting tracks (32) which connect to the contact terminals (22) and a second foil portion (38) which overlies the first circuit elements (40) of the thin film circuit. The second portion (38) has a conductor pad (42). This device uses a connector foil both to provide external connections to terminals of the thin film circuitry but also to overlie selected ones of the circuit elements. The conductor pad can be used for lower resistance connections, for heat dissipation purposes, or for electromagnetic shielding.
TW095121767A 2005-06-21 2006-06-16 Thin film circuit connections TW200705633A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05105468 2005-06-21

Publications (1)

Publication Number Publication Date
TW200705633A true TW200705633A (en) 2007-02-01

Family

ID=37429245

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095121767A TW200705633A (en) 2005-06-21 2006-06-16 Thin film circuit connections

Country Status (2)

Country Link
TW (1) TW200705633A (en)
WO (1) WO2006136984A2 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05273522A (en) * 1992-01-08 1993-10-22 Matsushita Electric Ind Co Ltd Display device and display device using the same
US5592199A (en) * 1993-01-27 1997-01-07 Sharp Kabushiki Kaisha Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same
US6184965B1 (en) * 1996-03-26 2001-02-06 Canon Kabushiki Kaisha Circuit connection structure
JP3983120B2 (en) * 2001-07-30 2007-09-26 富士通日立プラズマディスプレイ株式会社 IC chip mounting structure and display device

Also Published As

Publication number Publication date
WO2006136984A3 (en) 2007-05-03
WO2006136984A2 (en) 2006-12-28

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