TH32541A - Electronic circuit package with a compressed heat sink structure. - Google Patents

Abstract

DC60 (28/10/40) package of electronic circuits. Where the electronic devices (eg zips) on the substrate that are put on the package circuit are assembled. By heating with the heat sink in a separate manner using compressible heat-conducting assemblies (such as solder balls), these assemblies are compressed. And was deformed Permanently shaped in the form of Splices that use heat Electronic circuit package Where the electronic devices (eg zips) on the substrate that are put on the package circuit are assembled. With heat with heat sink In a decoupling manner using compressible heat-conducting assemblies (eg solder balls), these assemblies are compressed And was deformed They are permanently shaped as part of the heat-based assembly.

Claims (1)

1.Electronic circuit package assembly Which contains the following components The circuit is cut off the string. Which has conductors on the surface One of that part The electronic device is positioned on the correct substrate. Put such a circuit And electrical splice with those conductors, heat sinks that are heat splicing to such electronic devices The compressed heat-conducting components were set. Location between the said electronic device and the heat sink. And continue with heat to that section in an isolated manner.