NO20003024D0 - Innkapsling - Google Patents
InnkapslingInfo
- Publication number
- NO20003024D0 NO20003024D0 NO20003024A NO20003024A NO20003024D0 NO 20003024 D0 NO20003024 D0 NO 20003024D0 NO 20003024 A NO20003024 A NO 20003024A NO 20003024 A NO20003024 A NO 20003024A NO 20003024 D0 NO20003024 D0 NO 20003024D0
- Authority
- NO
- Norway
- Prior art keywords
- encapsulation
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9913660A GB2350936B (en) | 1999-06-11 | 1999-06-11 | Enclosure |
Publications (2)
Publication Number | Publication Date |
---|---|
NO20003024D0 true NO20003024D0 (no) | 2000-06-13 |
NO20003024L NO20003024L (no) | 2000-12-12 |
Family
ID=10855204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20003024A NO20003024L (no) | 1999-06-11 | 2000-06-13 | Innkapsling |
Country Status (8)
Country | Link |
---|---|
US (1) | US6444901B1 (no) |
EP (1) | EP1059834A3 (no) |
JP (1) | JP2001057495A (no) |
CN (1) | CN1203744C (no) |
AU (1) | AU3943300A (no) |
GB (1) | GB2350936B (no) |
NO (1) | NO20003024L (no) |
RU (1) | RU2000115173A (no) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3941723B2 (ja) * | 2003-03-27 | 2007-07-04 | 日本電気株式会社 | 電子機器の筐体 |
CN101600330B (zh) * | 2008-06-03 | 2012-04-18 | 上海贝尔股份有限公司 | 用于面板间电磁屏蔽的结构及其制造方法 |
US8253037B2 (en) | 2008-11-10 | 2012-08-28 | Finisar Corporation | Electromagnetic shielding configuration |
JP2011228388A (ja) * | 2010-04-16 | 2011-11-10 | Honda Motor Co Ltd | 補助基板接合構造 |
TWM390029U (en) * | 2010-05-21 | 2010-10-01 | Askey Computer Corp | Shell for electronic device |
JP5535035B2 (ja) * | 2010-10-29 | 2014-07-02 | パナソニックヘルスケア株式会社 | ヒンジ装置及びそれを用いた超低温フリーザ |
CN202435779U (zh) * | 2011-12-02 | 2012-09-12 | 鸿富锦精密工业(深圳)有限公司 | 电磁屏蔽箱体 |
CN107529299A (zh) * | 2017-09-12 | 2017-12-29 | 珠海格力电器股份有限公司 | 电控箱 |
US11395419B2 (en) * | 2020-10-20 | 2022-07-19 | Quanta Computer Inc. | Stepped venting panel |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3296354A (en) | 1964-02-05 | 1967-01-03 | Basic Products Corp | Furnace |
US3296356A (en) * | 1965-03-02 | 1967-01-03 | James H Mcadams | Radio frequency electromagnetic energy r. f. barrier |
US4759466A (en) * | 1986-08-14 | 1988-07-26 | Apple Computer, Inc. | EMI seam for enclosures |
JPH062317Y2 (ja) * | 1988-08-09 | 1994-01-19 | 株式会社東芝 | 筐体構造 |
GB2236910B (en) * | 1989-09-28 | 1993-12-08 | Technophone Ltd | A housing for electronic circuitry |
US5001298A (en) * | 1989-10-18 | 1991-03-19 | Signal Catv System Inc. | Radio frequency interference device for a high-frequency signal distributor |
DE9103040U1 (no) * | 1991-03-13 | 1991-06-13 | Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De | |
JP2501638Y2 (ja) * | 1991-11-25 | 1996-06-19 | 船井電機株式会社 | プリント基板装着用シ―ルド板 |
US5175395A (en) * | 1991-11-27 | 1992-12-29 | Rockwell International Corporation | Electromagnetic shield |
DE4223322C1 (no) * | 1992-07-16 | 1993-07-29 | Schroff Gmbh, 7541 Straubenhardt, De | |
US5354951A (en) * | 1993-03-15 | 1994-10-11 | Leader Tech, Inc. | Circuit board component shielding enclosure and assembly |
US5348549A (en) * | 1993-03-29 | 1994-09-20 | Brown Daniel R | Fluid tight medical apparatus disposal receptacle |
DE4319965C3 (de) * | 1993-06-14 | 2000-09-14 | Emi Tec Elektronische Material | Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung |
US5783771A (en) * | 1995-10-06 | 1998-07-21 | Digital Equipment Corporation | EMI chassis seam |
JPH10154890A (ja) * | 1996-11-22 | 1998-06-09 | Mitsumi Electric Co Ltd | 複数のシールドケースの組立構造 |
-
1999
- 1999-06-11 GB GB9913660A patent/GB2350936B/en not_active Expired - Fee Related
-
2000
- 2000-06-09 EP EP00304921A patent/EP1059834A3/en not_active Withdrawn
- 2000-06-09 RU RU2000115173/09A patent/RU2000115173A/ru not_active Application Discontinuation
- 2000-06-11 CN CNB001262653A patent/CN1203744C/zh not_active Expired - Fee Related
- 2000-06-12 US US09/602,190 patent/US6444901B1/en not_active Expired - Fee Related
- 2000-06-12 JP JP2000215207A patent/JP2001057495A/ja active Pending
- 2000-06-13 AU AU39433/00A patent/AU3943300A/en not_active Abandoned
- 2000-06-13 NO NO20003024A patent/NO20003024L/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
NO20003024L (no) | 2000-12-12 |
RU2000115173A (ru) | 2002-05-20 |
CN1283077A (zh) | 2001-02-07 |
EP1059834A3 (en) | 2001-09-19 |
JP2001057495A (ja) | 2001-02-27 |
EP1059834A2 (en) | 2000-12-13 |
AU3943300A (en) | 2000-12-14 |
US6444901B1 (en) | 2002-09-03 |
GB2350936A (en) | 2000-12-13 |
GB2350936B (en) | 2001-08-15 |
GB9913660D0 (en) | 1999-08-11 |
CN1203744C (zh) | 2005-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |