NO158080C - Innkapslede enheter. - Google Patents

Innkapslede enheter.

Info

Publication number
NO158080C
NO158080C NO843517A NO843517A NO158080C NO 158080 C NO158080 C NO 158080C NO 843517 A NO843517 A NO 843517A NO 843517 A NO843517 A NO 843517A NO 158080 C NO158080 C NO 158080C
Authority
NO
Norway
Prior art keywords
wrapped units
wrapped
units
Prior art date
Application number
NO843517A
Other languages
English (en)
Other versions
NO843517L (no
NO158080B (no
Inventor
David William Pearce
Original Assignee
Marconi Avionics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Avionics filed Critical Marconi Avionics
Publication of NO843517L publication Critical patent/NO843517L/no
Publication of NO158080B publication Critical patent/NO158080B/no
Publication of NO158080C publication Critical patent/NO158080C/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/001—Shaping in several steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/04—Condition, form or state of moulded material or of the material to be shaped cellular or porous
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
    • B29L2031/3055—Cars
    • B29L2031/3061—Number plates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Packages (AREA)
NO843517A 1983-09-05 1984-09-04 Innkapslede enheter. NO158080C (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB838323755A GB8323755D0 (en) 1983-09-05 1983-09-05 Encapsulation process

Publications (3)

Publication Number Publication Date
NO843517L NO843517L (no) 1985-03-06
NO158080B NO158080B (no) 1988-03-28
NO158080C true NO158080C (no) 1988-07-06

Family

ID=10548337

Family Applications (1)

Application Number Title Priority Date Filing Date
NO843517A NO158080C (no) 1983-09-05 1984-09-04 Innkapslede enheter.

Country Status (3)

Country Link
US (1) US4542260A (no)
GB (2) GB8323755D0 (no)
NO (1) NO158080C (no)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628148A (en) * 1984-03-27 1986-12-09 Toko, Inc. Encapsulated electronic circuit
EP0206771B1 (en) * 1985-06-20 1992-03-11 Kabushiki Kaisha Toshiba Packaged semiconductor device
US4636920A (en) * 1985-09-05 1987-01-13 Caterpillar Inc. Printed circuit board mounting apparatus
DE8527350U1 (de) * 1985-09-25 1985-12-05 W. Günther GmbH, 8500 Nürnberg Elektronisches Wendeschütz für Drehstrommotoren
US4935581A (en) * 1986-04-17 1990-06-19 Citizen Watch Co., Ltd. Pin grid array package
JPS62244139A (ja) * 1986-04-17 1987-10-24 Citizen Watch Co Ltd 樹脂封止型ピングリツドアレイ及びその製造方法
US4777563A (en) * 1986-05-02 1988-10-11 Toshiba Battery Co., Ltd. Thin type electronic instrument
US4740868A (en) * 1986-08-22 1988-04-26 Motorola Inc. Rail bonded multi-chip leadframe, method and package
US4739449A (en) * 1987-06-30 1988-04-19 Kaufman Lance R Circuit package with thermal expansion relief chimney
US4939014A (en) * 1987-12-16 1990-07-03 Ford Motor Company Composite polymer/desiccant coatings for IC encapsulation
US4977009A (en) * 1987-12-16 1990-12-11 Ford Motor Company Composite polymer/desiccant coatings for IC encapsulation
GB2220107B (en) * 1988-04-30 1992-06-24 Pressac Ltd Circuit board assembly
US5338602A (en) * 1988-10-03 1994-08-16 E. I. Du Pont De Nemours And Company Article of manufacture
US5236779A (en) * 1988-10-03 1993-08-17 E. I. Du Pont De Nemours And Company Article of manufacture
GB2237937A (en) * 1989-11-07 1991-05-15 Ryan Mining Services Limited Electric switch for use in hazardous environments
US5096427A (en) * 1991-01-31 1992-03-17 Thomas & Betts Corporation Socket and header electrical connector assembly
US5153368A (en) * 1991-05-28 1992-10-06 Ici Americas, Inc. Filtered electrical connection assembly using potted ferrite element
US5236098A (en) * 1992-03-13 1993-08-17 Thomas & Betts Corporation Socket and header electrical connector assembly
US5412166A (en) * 1993-06-25 1995-05-02 United Technologies Automotive, Inc. Power window switch control apparatus
JP3337847B2 (ja) * 1995-02-27 2002-10-28 株式会社東芝 電子部品内蔵カードの製造方法
GB2299047A (en) * 1995-03-21 1996-09-25 Uponor Ltd Manufacture of electrofusion fittings
ITTO20030978A1 (it) * 2003-12-05 2005-06-06 Ansaldo Segnalamento Ferroviario S P A Boa (balise) per segnalazione ferroviaria e metodo di realizzazione della boa stessa.
US20050224255A1 (en) * 2004-04-08 2005-10-13 Frank Becherer Plastic injected part with a plastic-coated printed circuit board, which can be equipped with components
JP4744947B2 (ja) 2005-06-23 2011-08-10 本田技研工業株式会社 電子制御ユニット及びその製造方法
RU2414015C1 (ru) * 2007-04-12 2011-03-10 Абб Текнолоджи Аг Наружное электротехническое устройство с улучшенной системой полимерной изоляции
RU2500050C2 (ru) * 2009-02-03 2013-11-27 Абб Рисерч Лтд Электроизолирующий корпус
NL1037176C2 (en) * 2009-08-05 2011-02-08 J M Geluk Beheer B V Explosion proof electronic device and method of manufacturing such a device.
JP2011100718A (ja) * 2009-10-05 2011-05-19 Yazaki Corp コネクタ
US8946566B2 (en) * 2012-10-05 2015-02-03 Apple Inc. Heterogeneous encapsulation
GB2531033B (en) * 2014-10-07 2021-02-10 Aker Solutions Ltd An apparatus with wired electrical communication

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3778685A (en) * 1972-03-27 1973-12-11 Nasa Integrated circuit package with lead structure and method of preparing the same
US4066839A (en) * 1972-11-16 1978-01-03 Sgs-Ates Componenti Elettronici S.P.A. Molded body incorporating heat dissipator

Also Published As

Publication number Publication date
GB8323755D0 (en) 1983-10-05
US4542260A (en) 1985-09-17
GB8422457D0 (en) 1984-10-10
NO843517L (no) 1985-03-06
GB2146176A (en) 1985-04-11
NO158080B (no) 1988-03-28
GB2146176B (en) 1987-01-14

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