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Priority claimed from DE19681668687external-prioritypatent/DE1668687C3/de
Priority claimed from NO00708/69Aexternal-prioritypatent/NO130112B/no
Application filed by Schering AgfiledCriticalSchering Ag
Priority to NO740113ApriorityCriticalpatent/NO130435C/no
Publication of NO130435BpublicationCriticalpatent/NO130435B/no
Publication of NO130435CpublicationCriticalpatent/NO130435C/no
Способ преобразования матрично расположенных шариковых выводов микросхем из бессвинцового припоя в оловянно-свинцовые околоэвтектического состава и припойная паста для его реализации