NO129650B - - Google Patents
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- Publication number
- NO129650B NO129650B NO00602/71A NO60271A NO129650B NO 129650 B NO129650 B NO 129650B NO 00602/71 A NO00602/71 A NO 00602/71A NO 60271 A NO60271 A NO 60271A NO 129650 B NO129650 B NO 129650B
- Authority
- NO
- Norway
- Prior art keywords
- semiconductor element
- heating
- bodies
- cooling
- parts
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 claims description 44
- 238000010438 heat treatment Methods 0.000 claims description 32
- 210000000056 organ Anatomy 0.000 claims description 3
- 239000002918 waste heat Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 description 42
- 239000011810 insulating material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000011321 prophylaxis Methods 0.000 description 3
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000003137 locomotive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE02336/70A SE354943B (sv) | 1970-02-24 | 1970-02-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
NO129650B true NO129650B (sv) | 1974-05-06 |
Family
ID=20259779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO00602/71A NO129650B (sv) | 1970-02-24 | 1971-02-19 |
Country Status (6)
Country | Link |
---|---|
US (1) | US3739234A (sv) |
CA (1) | CA926519A (sv) |
DE (1) | DE2107319A1 (sv) |
NO (1) | NO129650B (sv) |
RO (1) | RO56432A (sv) |
SE (1) | SE354943B (sv) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1346157A (en) * | 1971-02-13 | 1974-02-06 | Bbc Brown Boveri & Cie | Cooling apparatus for a thyristor |
DE2204589A1 (de) * | 1972-02-01 | 1973-08-16 | Siemens Ag | Kuehlanordnung fuer flache halbleiterbauelemente |
US4012770A (en) * | 1972-09-28 | 1977-03-15 | Dynatherm Corporation | Cooling a heat-producing electrical or electronic component |
US4036286A (en) * | 1972-11-02 | 1977-07-19 | Mcdonnell Douglas Corporation | Permafrost stabilizing heat pipe assembly |
CS159563B1 (sv) * | 1972-12-28 | 1975-01-31 | ||
US3989095A (en) * | 1972-12-28 | 1976-11-02 | Ckd Praha, Oborovy Podnik | Semi conductor cooling system |
US3852806A (en) * | 1973-05-02 | 1974-12-03 | Gen Electric | Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes |
US3852804A (en) * | 1973-05-02 | 1974-12-03 | Gen Electric | Double-sided heat-pipe cooled power semiconductor device assembly |
US3852805A (en) * | 1973-06-18 | 1974-12-03 | Gen Electric | Heat-pipe cooled power semiconductor device assembly having integral semiconductor device evaporating surface unit |
US3852803A (en) * | 1973-06-18 | 1974-12-03 | Gen Electric | Heat sink cooled power semiconductor device assembly having liquid metal interface |
US3826957A (en) * | 1973-07-02 | 1974-07-30 | Gen Electric | Double-sided heat-pipe cooled power semiconductor device assembly using compression rods |
CA1007875A (en) * | 1974-04-22 | 1977-04-05 | Mcdonnell Douglas Corporation | Permafrost stabilizing heat pipe assembly |
DE2638909A1 (de) * | 1976-08-28 | 1978-03-02 | Semikron Gleichrichterbau | Halbleiteranordnung |
US4145708A (en) * | 1977-06-13 | 1979-03-20 | General Electric Company | Power module with isolated substrates cooled by integral heat-energy-removal means |
US5229915A (en) * | 1990-02-07 | 1993-07-20 | Ngk Insulators, Ltd. | Power semiconductor device with heat dissipating property |
JPH0714029B2 (ja) * | 1990-02-07 | 1995-02-15 | 日本碍子株式会社 | 電力用半導体素子 |
JP3067399B2 (ja) * | 1992-07-03 | 2000-07-17 | 株式会社日立製作所 | 半導体冷却装置 |
US5405808A (en) * | 1993-08-16 | 1995-04-11 | Lsi Logic Corporation | Fluid-filled and gas-filled semiconductor packages |
JPH11121667A (ja) * | 1997-10-20 | 1999-04-30 | Fujitsu Ltd | ヒートパイプ式冷却装置 |
US6044899A (en) | 1998-04-27 | 2000-04-04 | Hewlett-Packard Company | Low EMI emissions heat sink device |
US6226178B1 (en) | 1999-10-12 | 2001-05-01 | Dell Usa, L.P. | Apparatus for cooling a heat generating component in a computer |
US6394175B1 (en) * | 2000-01-13 | 2002-05-28 | Lucent Technologies Inc. | Top mounted cooling device using heat pipes |
TW572246U (en) * | 2001-07-26 | 2004-01-11 | Jiun-Fu Liou | Heat dissipating module with a self rapid heat conduction |
US7124806B1 (en) | 2001-12-10 | 2006-10-24 | Ncr Corp. | Heat sink for enhanced heat dissipation |
US6732786B1 (en) * | 2002-10-29 | 2004-05-11 | Taiwan Trigem Information Co., Ltd. | Edge-mounted heat dissipation device having top-and-bottom fan structure |
AU2005332526B2 (en) * | 2005-03-31 | 2011-09-08 | Neobulb Technologies, Inc. | A high power LED illuminating equipment having high thermal diffusivity |
US7922361B2 (en) * | 2005-08-19 | 2011-04-12 | Neobulb Technologies, Inc. | Light-emitting diode illuminating equipment with high power and high heat dissipation efficiency |
US7494248B2 (en) * | 2006-07-05 | 2009-02-24 | Jaffe Limited | Heat-dissipating structure for LED lamp |
US7494249B2 (en) * | 2006-07-05 | 2009-02-24 | Jaffe Limited | Multiple-set heat-dissipating structure for LED lamp |
US7740380B2 (en) * | 2008-10-29 | 2010-06-22 | Thrailkill John E | Solid state lighting apparatus utilizing axial thermal dissipation |
JP5489911B2 (ja) * | 2010-08-18 | 2014-05-14 | 三菱電機株式会社 | 半導体パワーモジュール |
WO2016060123A1 (ja) * | 2014-10-14 | 2016-04-21 | 矢崎総業株式会社 | サービスプラグ |
-
1970
- 1970-02-24 SE SE02336/70A patent/SE354943B/xx unknown
-
1971
- 1971-01-28 US US00110721A patent/US3739234A/en not_active Expired - Lifetime
- 1971-02-02 CA CA104335A patent/CA926519A/en not_active Expired
- 1971-02-16 DE DE19712107319 patent/DE2107319A1/de active Pending
- 1971-02-19 NO NO00602/71A patent/NO129650B/no unknown
- 1971-02-24 RO RO66054A patent/RO56432A/ro unknown
Also Published As
Publication number | Publication date |
---|---|
DE2107319A1 (de) | 1971-09-09 |
CA926519A (en) | 1973-05-15 |
SE354943B (sv) | 1973-03-26 |
RO56432A (sv) | 1974-07-01 |
US3739234A (en) | 1973-06-12 |
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