NO120960B - - Google Patents

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Info

Publication number
NO120960B
NO120960B NO2173/68A NO217368A NO120960B NO 120960 B NO120960 B NO 120960B NO 2173/68 A NO2173/68 A NO 2173/68A NO 217368 A NO217368 A NO 217368A NO 120960 B NO120960 B NO 120960B
Authority
NO
Norway
Prior art keywords
plating
copper
additives
sulphurised
plating bath
Prior art date
Application number
NO2173/68A
Other languages
English (en)
Norwegian (no)
Inventor
C Abbott
Original Assignee
Dayton Bright Copper Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dayton Bright Copper Co filed Critical Dayton Bright Copper Co
Publication of NO120960B publication Critical patent/NO120960B/no

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
NO2173/68A 1967-06-05 1968-06-04 NO120960B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US643405A US3373095A (en) 1967-06-05 1967-06-05 Electroplating of copper

Publications (1)

Publication Number Publication Date
NO120960B true NO120960B (enExample) 1970-12-28

Family

ID=24580675

Family Applications (1)

Application Number Title Priority Date Filing Date
NO2173/68A NO120960B (enExample) 1967-06-05 1968-06-04

Country Status (10)

Country Link
US (1) US3373095A (enExample)
AT (1) AT278464B (enExample)
BE (1) BE716104A (enExample)
DE (1) DE1771447C2 (enExample)
ES (1) ES354519A1 (enExample)
FR (1) FR1569546A (enExample)
LU (1) LU56200A1 (enExample)
NL (1) NL6807883A (enExample)
NO (1) NO120960B (enExample)
SE (1) SE345879B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4009087A (en) * 1974-11-21 1977-02-22 M&T Chemicals Inc. Electrodeposition of copper
CN111593375A (zh) * 2020-05-15 2020-08-28 电子科技大学 一种用于电子电路电镀铜填孔的整平剂及电镀铜浴

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2424887A (en) * 1941-10-11 1947-07-29 Houdaille Hershey Corp Method and electrolyte for the electrodeposition of metals
US2805194A (en) * 1955-07-18 1957-09-03 Dayton Bright Copper Company Bright copper plating
US2931760A (en) * 1957-09-25 1960-04-05 Leon R Westbrook Acid copper plating
DE1133610B (de) * 1959-06-06 1962-07-19 Dehydag Gmbh Saure galvanische Kupferbaeder
NL291575A (enExample) * 1962-04-16
US3252987A (en) * 1964-03-09 1966-05-24 Eastman Kodak Co Tetrazolium compound electroplating leveling agent and method of preparation

Also Published As

Publication number Publication date
BE716104A (enExample) 1968-11-04
DE1771447C2 (de) 1974-08-22
DE1771447B1 (de) 1972-05-04
FR1569546A (enExample) 1969-05-30
US3373095A (en) 1968-03-12
ES354519A1 (es) 1970-01-01
NL6807883A (enExample) 1968-12-06
AT278464B (de) 1970-02-10
SE345879B (enExample) 1972-06-12
LU56200A1 (enExample) 1968-09-16

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