NL84048C - - Google Patents
Info
- Publication number
- NL84048C NL84048C NL84048DA NL84048C NL 84048 C NL84048 C NL 84048C NL 84048D A NL84048D A NL 84048DA NL 84048 C NL84048 C NL 84048C
- Authority
- NL
- Netherlands
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2742412X | 1952-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL84048C true NL84048C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Family
ID=19875526
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL81606D NL81606C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1952-07-05 | ||
| NL84048D NL84048C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1952-07-05 | ||
| NLAANVRAGE7413473,A NL170871B (nl) | 1952-07-05 | Werkwijze voor het verwijderen van zware en/of giftige metalen uit afvalgas. | |
| NLAANVRAGE7106028,A NL170870B (nl) | 1952-07-05 | Werkwijze voor het vuurvast bekleden van ovenwanden en een aldus vervaardigde metallurgische schachtoven. |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL81606D NL81606C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1952-07-05 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NLAANVRAGE7413473,A NL170871B (nl) | 1952-07-05 | Werkwijze voor het verwijderen van zware en/of giftige metalen uit afvalgas. | |
| NLAANVRAGE7106028,A NL170870B (nl) | 1952-07-05 | Werkwijze voor het vuurvast bekleden van ovenwanden en een aldus vervaardigde metallurgische schachtoven. |
Country Status (4)
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE962489C (de) * | 1954-02-10 | 1957-04-25 | Dehydag Gmbh | Sparbeizmittel zum Schutze von Metallen bei der Behandlung mit sauren Mitteln |
| DE1007592B (de) * | 1955-01-19 | 1957-05-02 | Dehydag Gmbh | Bad zur Herstellung von galvanischen Metallueberzuegen |
| US2853443A (en) * | 1956-04-25 | 1958-09-23 | Westinghouse Electric Corp | Addition agent for acid copper electrolytes |
| BE565994A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1957-04-16 | |||
| US2931760A (en) * | 1957-09-25 | 1960-04-05 | Leon R Westbrook | Acid copper plating |
| NL238490A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1958-04-26 | |||
| US3770599A (en) * | 1971-05-24 | 1973-11-06 | Oxy Metal Finishing Corp | Acid zinc plating baths |
| US4009087A (en) * | 1974-11-21 | 1977-02-22 | M&T Chemicals Inc. | Electrodeposition of copper |
| US4474649A (en) * | 1982-06-21 | 1984-10-02 | Asarco Incorporated | Method of thiourea addition of electrolytic solutions useful for copper refining |
| JPH02232391A (ja) * | 1988-12-21 | 1990-09-14 | Internatl Business Mach Corp <Ibm> | アデイテイブ鍍金浴および方法 |
| TW593731B (en) * | 1998-03-20 | 2004-06-21 | Semitool Inc | Apparatus for applying a metal structure to a workpiece |
| US6565729B2 (en) * | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
| US6113771A (en) * | 1998-04-21 | 2000-09-05 | Applied Materials, Inc. | Electro deposition chemistry |
| US6571657B1 (en) | 1999-04-08 | 2003-06-03 | Applied Materials Inc. | Multiple blade robot adjustment apparatus and associated method |
| US6551484B2 (en) | 1999-04-08 | 2003-04-22 | Applied Materials, Inc. | Reverse voltage bias for electro-chemical plating system and method |
| US20030213772A9 (en) * | 1999-07-09 | 2003-11-20 | Mok Yeuk-Fai Edwin | Integrated semiconductor substrate bevel cleaning apparatus and method |
| US6913680B1 (en) | 2000-05-02 | 2005-07-05 | Applied Materials, Inc. | Method of application of electrical biasing to enhance metal deposition |
| WO2001090446A2 (en) | 2000-05-23 | 2001-11-29 | Applied Materials, Inc. | Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio |
| US6576110B2 (en) | 2000-07-07 | 2003-06-10 | Applied Materials, Inc. | Coated anode apparatus and associated method |
| EP1470268A2 (en) * | 2000-10-03 | 2004-10-27 | Applied Materials, Inc. | Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| US6610189B2 (en) | 2001-01-03 | 2003-08-26 | Applied Materials, Inc. | Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature |
| US20040020780A1 (en) * | 2001-01-18 | 2004-02-05 | Hey H. Peter W. | Immersion bias for use in electro-chemical plating system |
| US6478937B2 (en) | 2001-01-19 | 2002-11-12 | Applied Material, Inc. | Substrate holder system with substrate extension apparatus and associated method |
| US20030146102A1 (en) * | 2002-02-05 | 2003-08-07 | Applied Materials, Inc. | Method for forming copper interconnects |
| US6911136B2 (en) * | 2002-04-29 | 2005-06-28 | Applied Materials, Inc. | Method for regulating the electrical power applied to a substrate during an immersion process |
| US20040200725A1 (en) * | 2003-04-09 | 2004-10-14 | Applied Materials Inc. | Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process |
| US20040206628A1 (en) * | 2003-04-18 | 2004-10-21 | Applied Materials, Inc. | Electrical bias during wafer exit from electrolyte bath |
| US20050092602A1 (en) * | 2003-10-29 | 2005-05-05 | Harald Herchen | Electrochemical plating cell having a membrane stack |
| US20050092601A1 (en) * | 2003-10-29 | 2005-05-05 | Harald Herchen | Electrochemical plating cell having a diffusion member |
| US20060102467A1 (en) * | 2004-11-15 | 2006-05-18 | Harald Herchen | Current collimation for thin seed and direct plating |
| US20060175201A1 (en) * | 2005-02-07 | 2006-08-10 | Hooman Hafezi | Immersion process for electroplating applications |
| US20100140098A1 (en) * | 2008-05-15 | 2010-06-10 | Solopower, Inc. | Selenium containing electrodeposition solution and methods |
| JP2017503929A (ja) * | 2013-11-25 | 2017-02-02 | エンソン インコーポレイテッド | 銅の電析 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA477508A (en) * | 1951-10-02 | Brown Henry | Electrodeposition of nickel from acid baths | |
| DE104111C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | ||||
| CA461186A (en) * | 1949-11-22 | John Franklin Beaver, Jr. | Bright copper plating | |
| US2196588A (en) * | 1937-05-26 | 1940-04-09 | Du Pont | Electroplating |
| US2315802A (en) * | 1940-04-20 | 1943-04-06 | Harshaw Chem Corp | Nickel plating |
| US2389179A (en) * | 1941-02-21 | 1945-11-20 | Udylite Corp | Electrodeposition of metals |
| US2489538A (en) * | 1941-05-24 | 1949-11-29 | Gen Motors Corp | Electrodeposition of copper |
| US2391289A (en) * | 1941-09-15 | 1945-12-18 | Jr John F Beaver | Bright copper plating |
| US2355505A (en) * | 1941-10-03 | 1944-08-08 | Purdue Research Foundation | Electrodeposition of bright zinc |
| US2462870A (en) * | 1942-07-09 | 1949-03-01 | Gen Motors Corp | Electrodeposition of copper |
| US2472393A (en) * | 1944-09-25 | 1949-06-07 | American Steel & Wire Co | Process and bath for copper coating ferrous metal |
| BE504701A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1950-07-17 | |||
| US2700020A (en) * | 1952-06-02 | 1955-01-18 | Houdaille Hershey Corp | Plating copper |
-
0
- NL NL81606D patent/NL81606C/xx active
- NL NL84048D patent/NL84048C/xx active
- NL NLAANVRAGE7413473,A patent/NL170871B/xx unknown
- BE BE518440D patent/BE518440A/xx unknown
- NL NLAANVRAGE7106028,A patent/NL170870B/xx unknown
-
1952
- 1952-07-30 DE DEN5865A patent/DE962129C/de not_active Expired
- 1952-07-30 DE DEN5864A patent/DE940860C/de not_active Expired
-
1953
- 1953-04-13 US US348582A patent/US2742412A/en not_active Expired - Lifetime
- 1953-04-13 US US348581A patent/US2742413A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE962129C (de) | 1957-04-18 |
| BE518440A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | |
| NL170870B (nl) | |
| DE940860C (de) | 1956-03-29 |
| NL81606C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | |
| US2742413A (en) | 1956-04-17 |
| US2742412A (en) | 1956-04-17 |
| NL170871B (nl) |