NL7801658A - PACKAGE FOR SEMICONDUCTOR DEVICES OF HIGH POWER. - Google Patents
PACKAGE FOR SEMICONDUCTOR DEVICES OF HIGH POWER.Info
- Publication number
- NL7801658A NL7801658A NL7801658A NL7801658A NL7801658A NL 7801658 A NL7801658 A NL 7801658A NL 7801658 A NL7801658 A NL 7801658A NL 7801658 A NL7801658 A NL 7801658A NL 7801658 A NL7801658 A NL 7801658A
- Authority
- NL
- Netherlands
- Prior art keywords
- package
- semiconductor devices
- high power
- semiconductor
- devices
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US76963777A | 1977-02-17 | 1977-02-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7801658A true NL7801658A (en) | 1978-08-21 |
Family
ID=25086071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7801658A NL7801658A (en) | 1977-02-17 | 1978-02-14 | PACKAGE FOR SEMICONDUCTOR DEVICES OF HIGH POWER. |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS53102674A (en) |
DE (1) | DE2806099A1 (en) |
FR (1) | FR2381388A1 (en) |
GB (1) | GB1599852A (en) |
NL (1) | NL7801658A (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2511193A1 (en) * | 1981-08-07 | 1983-02-11 | Thomson Csf | Laminated support for cooling semiconductor - has three metal layers including one rigid layer to avoid bi-metallic bending with changing temp. |
JPS5899838U (en) * | 1981-12-28 | 1983-07-07 | 富士通株式会社 | semiconductor equipment |
US4570337A (en) * | 1982-04-19 | 1986-02-18 | Olin Corporation | Method of assembling a chip carrier |
US5014159A (en) * | 1982-04-19 | 1991-05-07 | Olin Corporation | Semiconductor package |
US4866571A (en) * | 1982-06-21 | 1989-09-12 | Olin Corporation | Semiconductor package |
EP0139029A1 (en) * | 1983-10-19 | 1985-05-02 | Olin Corporation | Improved semiconductor package |
JPS60113931A (en) * | 1983-11-25 | 1985-06-20 | Toshiba Corp | Semiconductor device |
US4862323A (en) * | 1984-04-12 | 1989-08-29 | Olin Corporation | Chip carrier |
FR2563379A1 (en) * | 1984-04-20 | 1985-10-25 | Artus | Assembly of semiconductor electronic devices mounted on a dissipator |
US4853491A (en) * | 1984-10-03 | 1989-08-01 | Olin Corporation | Chip carrier |
US4639760A (en) * | 1986-01-21 | 1987-01-27 | Motorola, Inc. | High power RF transistor assembly |
DE3837617A1 (en) * | 1988-11-05 | 1990-05-10 | Semikron Elektronik Gmbh | SUPPORT BODY FOR THE ELECTRICALLY INSULATED ARRANGEMENT OF COMPONENTS |
DE3837920A1 (en) * | 1988-11-09 | 1990-05-10 | Semikron Elektronik Gmbh | SEMICONDUCTOR ELEMENT |
US5317194A (en) * | 1989-10-17 | 1994-05-31 | Kabushiki Kaisha Toshiba | Resin-sealed semiconductor device having intermediate silicon thermal dissipation means and embedded heat sink |
US5917236A (en) * | 1995-12-08 | 1999-06-29 | Hewlett-Packard Company | Packaging system for field effects transistors |
DE102006011995B3 (en) * | 2006-03-16 | 2007-11-08 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module, has base plate connected with substrate in material-coherent manner, and contact layer of substrate divided into segments for providing material-coherent connection with base plate |
US8237260B2 (en) | 2008-11-26 | 2012-08-07 | Infineon Technologies Ag | Power semiconductor module with segmented base plate |
US9960127B2 (en) | 2016-05-18 | 2018-05-01 | Macom Technology Solutions Holdings, Inc. | High-power amplifier package |
US10134658B2 (en) | 2016-08-10 | 2018-11-20 | Macom Technology Solutions Holdings, Inc. | High power transistors |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3728589A (en) * | 1971-04-16 | 1973-04-17 | Rca Corp | Semiconductor assembly |
JPS49131863U (en) * | 1973-03-10 | 1974-11-13 |
-
1978
- 1978-02-14 GB GB587878A patent/GB1599852A/en not_active Expired
- 1978-02-14 NL NL7801658A patent/NL7801658A/en not_active Application Discontinuation
- 1978-02-14 DE DE19782806099 patent/DE2806099A1/en not_active Withdrawn
- 1978-02-16 JP JP1597678A patent/JPS53102674A/en active Granted
- 1978-02-16 FR FR7804380A patent/FR2381388A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JPS53102674A (en) | 1978-09-07 |
FR2381388A1 (en) | 1978-09-15 |
DE2806099A1 (en) | 1978-08-24 |
GB1599852A (en) | 1981-10-07 |
JPS6128219B2 (en) | 1986-06-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NL7801658A (en) | PACKAGE FOR SEMICONDUCTOR DEVICES OF HIGH POWER. | |
NL7714275A (en) | PACKAGING OF SEMICONDUCTOR DISCS. | |
BR7900229A (en) | SEMICONDUCTOR DEVICE | |
NL189379C (en) | METHOD FOR ENCAPSULATION OF MICRO-ELECTRONIC ELEMENTS. | |
IT7923939A0 (en) | COOLING STRUCTURE OF SEMICONDUCTOR DEVICES. | |
IT1032591B (en) | PROCEDURE FOR THE MANUFACTURING OF SEMICONDUCTIVE DEVICES | |
IT1037478B (en) | PROCEDURE FOR MANUFACTURING SEMICONDUCTOR DEVICE | |
IT1106505B (en) | PROCEDURE FOR THE MANUFACTURE OF SEMICONDUCTIVE DEVICES | |
IT1114884B (en) | SEMICONDUCTOR DEVICES MANUFACTURE PROCEDURE | |
SE7900083L (en) | SEMICONDUCTOR DEVICE | |
SE410911B (en) | SEMICONDUCTOR DEVICE | |
IT1071194B (en) | PROCEDURE FOR THE MANUFACTURE OF SEMICONDUCTIVE MEMORY DEVICES | |
NL7803039A (en) | PUSHABLE SEMICONDUCTOR DEVICE. | |
BR7808124A (en) | SEMICONDUCTOR DEVICE | |
DD129256A1 (en) | POWER SEMICONDUCTOR COMPONENT | |
NL7901106A (en) | PROCEDURE FOR USING THROW-SPREADING DEVICES. | |
PL200347A1 (en) | HIGH-VOLTAGE SEMICONDUCTOR | |
DK525979A (en) | Semiconductor LADNNGSOVERFOERINGSANORDNING | |
SE7902980L (en) | SEMICONDUCTOR DEVICE | |
BR7800627A (en) | SEMICONDUCTOR DEVICE | |
IT1081539B (en) | SEMICONDUCTOR STRUCTURE | |
NL7807818A (en) | PROCEDURE FOR THE MANUFACTURE OF SEMI-CONDUCTOR DEVICES. | |
IT7919985A0 (en) | SEMICONDUCTOR DEVICE. | |
NL7713114A (en) | PROCEDURE FOR MANUFACTURING SEMI-CONDUCTOR DEVICES. | |
NL7811807A (en) | LATERAL SEMICONDUCTOR DEVICES. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
BV | The patent application has lapsed |