NL7700771A - Substrate connector for printed circuit board - has insulating casing supporting spaced parallel substrates - Google Patents

Substrate connector for printed circuit board - has insulating casing supporting spaced parallel substrates

Info

Publication number
NL7700771A
NL7700771A NL7700771A NL7700771A NL7700771A NL 7700771 A NL7700771 A NL 7700771A NL 7700771 A NL7700771 A NL 7700771A NL 7700771 A NL7700771 A NL 7700771A NL 7700771 A NL7700771 A NL 7700771A
Authority
NL
Netherlands
Prior art keywords
circuit board
printed circuit
spaced parallel
insulating casing
substrate connector
Prior art date
Application number
NL7700771A
Other languages
Dutch (nl)
Original Assignee
Amp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amp Inc filed Critical Amp Inc
Priority to NL7700771A priority Critical patent/NL7700771A/en
Publication of NL7700771A publication Critical patent/NL7700771A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/1064—Electrical connections provided on a side surface of one or more of the containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The substrate connector is used to mount two planar substrates (2) on a printed circuit board (8). It comprises an insulating casing, which supports the substrates (2) in spaced parallel planes and which has a number of contacts (15) each with a pin (16) projecting from the casing, to fit into a respective aperture of the perforated printed circuit board (8). Each of the contacts (15) also has two separate flexible contact blades (18,19) on the opposite side to the pin (16) each with a contact surface (20,21) in the plane of one of the two substrates (2), to engage the edge of the latter.
NL7700771A 1977-01-26 1977-01-26 Substrate connector for printed circuit board - has insulating casing supporting spaced parallel substrates NL7700771A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
NL7700771A NL7700771A (en) 1977-01-26 1977-01-26 Substrate connector for printed circuit board - has insulating casing supporting spaced parallel substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7700771A NL7700771A (en) 1977-01-26 1977-01-26 Substrate connector for printed circuit board - has insulating casing supporting spaced parallel substrates

Publications (1)

Publication Number Publication Date
NL7700771A true NL7700771A (en) 1978-07-28

Family

ID=19827846

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7700771A NL7700771A (en) 1977-01-26 1977-01-26 Substrate connector for printed circuit board - has insulating casing supporting spaced parallel substrates

Country Status (1)

Country Link
NL (1) NL7700771A (en)

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Legal Events

Date Code Title Description
BV The patent application has lapsed