NL7509591A - Elektronisch geleidende kleefstof. - Google Patents
Elektronisch geleidende kleefstof.Info
- Publication number
- NL7509591A NL7509591A NL7509591A NL7509591A NL7509591A NL 7509591 A NL7509591 A NL 7509591A NL 7509591 A NL7509591 A NL 7509591A NL 7509591 A NL7509591 A NL 7509591A NL 7509591 A NL7509591 A NL 7509591A
- Authority
- NL
- Netherlands
- Prior art keywords
- conductive adhesive
- electronically conductive
- electronically
- adhesive
- conductive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/54—Inorganic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0266—Size distribution
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9308074A JPS5120941A (ja) | 1974-08-14 | 1974-08-14 | Dodenseisetsuchakuzai |
JP9308274A JPS5121192A (ja) | 1974-08-14 | 1974-08-14 | Dodenseisetsuchakushiito |
Publications (3)
Publication Number | Publication Date |
---|---|
NL7509591A true NL7509591A (nl) | 1976-02-17 |
NL172104B NL172104B (nl) | 1983-02-01 |
NL172104C NL172104C (nl) | 1983-07-01 |
Family
ID=26434523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NLAANVRAGE7509591,A NL172104C (nl) | 1974-08-14 | 1975-08-12 | Elektrische verbinding door geleidende hechtmiddelen. |
Country Status (6)
Country | Link |
---|---|
CH (1) | CH607666A5 (nl) |
DE (1) | DE2536361A1 (nl) |
FR (1) | FR2282148A1 (nl) |
GB (1) | GB1477780A (nl) |
HK (1) | HK43281A (nl) |
NL (1) | NL172104C (nl) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH627031A5 (nl) * | 1978-08-09 | 1981-12-15 | Portescap | |
JPS594096A (ja) * | 1982-06-30 | 1984-01-10 | 日本メクトロン株式会社 | 異種回路基板相互の接続方法 |
JPS593824A (ja) * | 1982-06-30 | 1984-01-10 | 日本メクトロン株式会社 | パネルキ−ボ−ド |
DE3366599D1 (en) * | 1982-07-27 | 1986-11-06 | Luc Technologies Ltd | Bonding and bonded products |
FR2549627B1 (fr) * | 1983-07-19 | 1986-02-07 | Thomson Csf | Dispositif de connexion d'un ecran de visualisation et ecran de visualisation comportant un tel dispositif |
DE3418958A1 (de) * | 1984-05-22 | 1985-12-05 | Nippon Mektron, Ltd., Tokio/Tokyo | Vorrichtung und verfahren zum elektrischen und mechanischen verbinden flexibler gedruckter schaltfolien |
US4588456A (en) * | 1984-10-04 | 1986-05-13 | Amp Incorporated | Method of making adhesive electrical interconnecting means |
KR880700617A (ko) * | 1985-04-30 | 1988-03-15 | 제이 엘.사이칙 | 회로 패널 어셈블리 및 그 제조방법 |
AU588925B2 (en) * | 1985-11-06 | 1989-09-28 | Minnesota Mining And Manufacturing Company | Anisotropically conductive polymeric matrix |
JPS62169434A (ja) * | 1986-01-22 | 1987-07-25 | Sharp Corp | Lsi搭載方式 |
JPS62177877A (ja) * | 1986-01-31 | 1987-08-04 | 住友スリ−エム株式会社 | 異方導電性フイルムコネクタ |
KR900002640Y1 (ko) * | 1986-02-10 | 1990-03-31 | 알프스 덴기 가부시기 가이샤 | 다련 슬라이드형 전기부품 |
DE3627595A1 (de) * | 1986-08-14 | 1988-02-18 | Licentia Gmbh | Verfahren zum aufbringen und kontaktieren eines elektrischen schaltkreises |
JPS6433808A (en) * | 1986-10-18 | 1989-02-03 | Japan Synthetic Rubber Co Ltd | Conductive particle and conductive adhesive including it |
FR2620569A1 (fr) * | 1987-09-11 | 1989-03-17 | Radiotechnique Compelec | Procede pour calibrer l'epaisseur d'une soudure d'un composant electronique sur un substrat |
DE3805851A1 (de) * | 1988-02-25 | 1989-08-31 | Standard Elektrik Lorenz Ag | Leiterplatte mit einer kuehlvorrichtung |
DE3824140A1 (de) * | 1988-07-15 | 1990-01-25 | Siemens Ag | Befestigen und elektrisches kontaktieren von piezokeramiken |
DE3905657A1 (de) * | 1989-02-24 | 1990-08-30 | Telefunken Electronic Gmbh | Flexible traegerfolie |
US5049085A (en) * | 1989-12-22 | 1991-09-17 | Minnesota Mining And Manufacturing Company | Anisotropically conductive polymeric matrix |
US5243142A (en) * | 1990-08-03 | 1993-09-07 | Hitachi Aic Inc. | Printed wiring board and process for producing the same |
FR2674690B1 (fr) * | 1991-03-28 | 1993-06-11 | Lambert Francois | Procede de raccordement electrique. |
DE4206700A1 (de) * | 1992-03-04 | 1993-09-16 | Vdo Schindling | Kontaktierung |
DE4406418C1 (de) * | 1994-02-28 | 1995-07-13 | Bosch Gmbh Robert | Anisotrop elektrisch leitender Kleber |
US5840215A (en) * | 1996-12-16 | 1998-11-24 | Shell Oil Company | Anisotropic conductive adhesive compositions |
US6300566B1 (en) | 1998-03-13 | 2001-10-09 | Siemens Aktiengesellschaft | Electrical connection of a circuit carrier to a conductor-track carrier |
DE19815110B4 (de) * | 1998-04-03 | 2004-12-30 | Knürr AG | Wärmeabführanordnung |
DE69936089T2 (de) * | 1998-10-22 | 2008-01-10 | Sony Chemicals Corp. | Anisotropisch leitfähiger Kleber und Klebefilm |
DE20000936U1 (de) | 2000-01-20 | 2000-04-06 | FER Fahrzeugelektrik GmbH, 99817 Eisenach | Montageanordnung |
EP3047973A3 (en) * | 2015-01-23 | 2016-09-07 | Konica Minolta, Inc. | Inkjet head, method of producing inkjet head, and inkjet recording device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2885459A (en) * | 1955-11-02 | 1959-05-05 | Pulsifer Verne | Sealing and conducting gasket material |
US3514326A (en) * | 1967-11-17 | 1970-05-26 | Minnesota Mining & Mfg | Tape |
US3541222A (en) * | 1969-01-13 | 1970-11-17 | Bunker Ramo | Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making |
-
1975
- 1975-07-30 GB GB3190675A patent/GB1477780A/en not_active Expired
- 1975-08-12 NL NLAANVRAGE7509591,A patent/NL172104C/nl not_active IP Right Cessation
- 1975-08-13 CH CH1053675A patent/CH607666A5/xx unknown
- 1975-08-14 FR FR7525414A patent/FR2282148A1/fr active Granted
- 1975-08-14 DE DE19752536361 patent/DE2536361A1/de active Granted
-
1981
- 1981-08-27 HK HK432/81A patent/HK43281A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
NL172104B (nl) | 1983-02-01 |
FR2282148A1 (fr) | 1976-03-12 |
DE2536361A1 (de) | 1976-02-26 |
HK43281A (en) | 1981-09-04 |
FR2282148B1 (nl) | 1981-12-31 |
CH607666A5 (en) | 1978-09-29 |
NL172104C (nl) | 1983-07-01 |
GB1477780A (en) | 1977-06-29 |
DE2536361C2 (nl) | 1988-10-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BA | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
V4 | Lapsed because of reaching the maximum lifetime of a patent |
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