NL7408575A - - Google Patents
Info
- Publication number
- NL7408575A NL7408575A NL7408575A NL7408575A NL7408575A NL 7408575 A NL7408575 A NL 7408575A NL 7408575 A NL7408575 A NL 7408575A NL 7408575 A NL7408575 A NL 7408575A NL 7408575 A NL7408575 A NL 7408575A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
- H10D84/121—BJTs having built-in components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US374230A US3877063A (en) | 1973-06-27 | 1973-06-27 | Metallization structure and process for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7408575A true NL7408575A (https=) | 1974-12-31 |
Family
ID=23475885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7408575A NL7408575A (https=) | 1973-06-27 | 1974-06-26 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3877063A (https=) |
| JP (1) | JPS5331715B2 (https=) |
| DE (1) | DE2430097C3 (https=) |
| FR (1) | FR2235491B1 (https=) |
| GB (1) | GB1435458A (https=) |
| NL (1) | NL7408575A (https=) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2402304A1 (fr) * | 1977-08-31 | 1979-03-30 | Int Computers Ltd | Procede de connexion electrique d'une pastille de circuit integre |
| US4183041A (en) * | 1978-06-26 | 1980-01-08 | Rca Corporation | Self biasing of a field effect transistor mounted in a flip-chip carrier |
| JPS5830147A (ja) * | 1981-08-18 | 1983-02-22 | Toshiba Corp | 半導体装置 |
| US4459321A (en) * | 1982-12-30 | 1984-07-10 | International Business Machines Corporation | Process for applying closely overlapped mutually protective barrier films |
| FR2561444B1 (fr) * | 1984-03-16 | 1986-09-19 | Thomson Csf | Dispositif semi-conducteur hyperfrequence a connexions externes prises au moyen de poutres |
| US4829363A (en) * | 1984-04-13 | 1989-05-09 | Fairchild Camera And Instrument Corp. | Structure for inhibiting dopant out-diffusion |
| DE69032893T2 (de) * | 1989-11-30 | 1999-07-22 | Kabushiki Kaisha Toshiba, Kawasaki, Kanagawa | Werkstoff für elektrische Leiter, Elektronikagerät welches diesen verwendet und Flüssig-Kristall-Anzeige |
| JP2527908Y2 (ja) * | 1990-06-01 | 1997-03-05 | エヌオーケー株式会社 | 抜取り治具 |
| US5156998A (en) * | 1991-09-30 | 1992-10-20 | Hughes Aircraft Company | Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal barrier layer to block migration of tin through via holes |
| US5321279A (en) * | 1992-11-09 | 1994-06-14 | Texas Instruments Incorporated | Base ballasting |
| US5683939A (en) * | 1993-04-02 | 1997-11-04 | Harris Corporation | Diamond insulator devices and method of fabrication |
| US6337151B1 (en) | 1999-08-18 | 2002-01-08 | International Business Machines Corporation | Graded composition diffusion barriers for chip wiring applications |
| JP4700264B2 (ja) * | 2003-05-21 | 2011-06-15 | 財団法人国際科学振興財団 | 半導体装置 |
| WO2006038305A1 (ja) | 2004-10-01 | 2006-04-13 | Tadahiro Ohmi | 半導体装置およびその製造方法 |
| US20060231919A1 (en) * | 2005-04-15 | 2006-10-19 | Blacka Robert J | Passive microwave device and method for producing the same |
| US7628309B1 (en) * | 2005-05-03 | 2009-12-08 | Rosemount Aerospace Inc. | Transient liquid phase eutectic bonding |
| US7538401B2 (en) | 2005-05-03 | 2009-05-26 | Rosemount Aerospace Inc. | Transducer for use in harsh environments |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3476531A (en) * | 1966-09-07 | 1969-11-04 | Western Electric Co | Palladium copper contact for soldering |
| US3701931A (en) * | 1971-05-06 | 1972-10-31 | Ibm | Gold tantalum-nitrogen high conductivity metallurgy |
| US3740523A (en) * | 1971-12-30 | 1973-06-19 | Bell Telephone Labor Inc | Encoding of read only memory by laser vaporization |
-
1973
- 1973-06-27 US US374230A patent/US3877063A/en not_active Expired - Lifetime
-
1974
- 1974-06-21 GB GB2774174A patent/GB1435458A/en not_active Expired
- 1974-06-22 DE DE2430097A patent/DE2430097C3/de not_active Expired
- 1974-06-25 FR FR7422068A patent/FR2235491B1/fr not_active Expired
- 1974-06-26 NL NL7408575A patent/NL7408575A/xx unknown
- 1974-06-27 JP JP7374674A patent/JPS5331715B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5036079A (https=) | 1975-04-04 |
| GB1435458A (en) | 1976-05-12 |
| DE2430097C3 (de) | 1978-09-07 |
| DE2430097B2 (de) | 1978-01-12 |
| FR2235491A1 (https=) | 1975-01-24 |
| US3877063A (en) | 1975-04-08 |
| DE2430097A1 (de) | 1975-01-16 |
| JPS5331715B2 (https=) | 1978-09-04 |
| FR2235491B1 (https=) | 1978-01-13 |