NL7402422A - Universele verkoperingsoplossing. - Google Patents

Universele verkoperingsoplossing.

Info

Publication number
NL7402422A
NL7402422A NL7402422A NL7402422A NL7402422A NL 7402422 A NL7402422 A NL 7402422A NL 7402422 A NL7402422 A NL 7402422A NL 7402422 A NL7402422 A NL 7402422A NL 7402422 A NL7402422 A NL 7402422A
Authority
NL
Netherlands
Prior art keywords
sales solution
universal sales
universal
solution
sales
Prior art date
Application number
NL7402422A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL7402422A priority Critical patent/NL7402422A/xx
Priority to DE2505958A priority patent/DE2505958C3/de
Priority to CA220,417A priority patent/CA1069367A/en
Priority to GB6992/75A priority patent/GB1490914A/en
Priority to JP1995875A priority patent/JPS5615496B2/ja
Priority to BE153558A priority patent/BE825773A/xx
Priority to FR7505441A priority patent/FR2262123B1/fr
Publication of NL7402422A publication Critical patent/NL7402422A/xx
Priority to US06/059,797 priority patent/US4248633A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
NL7402422A 1974-02-22 1974-02-22 Universele verkoperingsoplossing. NL7402422A (nl)

Priority Applications (8)

Application Number Priority Date Filing Date Title
NL7402422A NL7402422A (nl) 1974-02-22 1974-02-22 Universele verkoperingsoplossing.
DE2505958A DE2505958C3 (de) 1974-02-22 1975-02-13 Verkupferungslösung
CA220,417A CA1069367A (en) 1974-02-22 1975-02-19 Plating solution containing an inorganic redox couple and a complexing agent for cuprous ions
GB6992/75A GB1490914A (en) 1974-02-22 1975-02-19 Electroless copper-plating solution
JP1995875A JPS5615496B2 (pt) 1974-02-22 1975-02-19
BE153558A BE825773A (fr) 1974-02-22 1975-02-20 Bain de cuivrage universel
FR7505441A FR2262123B1 (pt) 1974-02-22 1975-02-21
US06/059,797 US4248633A (en) 1974-02-22 1979-07-23 Universal copper-plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7402422A NL7402422A (nl) 1974-02-22 1974-02-22 Universele verkoperingsoplossing.

Publications (1)

Publication Number Publication Date
NL7402422A true NL7402422A (nl) 1975-08-26

Family

ID=19820810

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7402422A NL7402422A (nl) 1974-02-22 1974-02-22 Universele verkoperingsoplossing.

Country Status (8)

Country Link
US (1) US4248633A (pt)
JP (1) JPS5615496B2 (pt)
BE (1) BE825773A (pt)
CA (1) CA1069367A (pt)
DE (1) DE2505958C3 (pt)
FR (1) FR2262123B1 (pt)
GB (1) GB1490914A (pt)
NL (1) NL7402422A (pt)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USH325H (en) 1980-07-30 1987-09-01 Richardson Chemical Company Electroless deposition of transition metals
US4450191A (en) * 1982-09-02 1984-05-22 Omi International Corporation Ammonium ions used as electroless copper plating rate controller
EP0132594B1 (en) * 1983-07-25 1988-09-07 Hitachi, Ltd. Electroless copper plating solution
JPS6215235A (ja) * 1985-07-15 1987-01-23 Mitsubishi Rayon Co Ltd 導電性高分子材料の製造法
DE3622090C1 (pt) * 1986-07-02 1990-02-15 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De
JPH04325688A (ja) * 1991-04-26 1992-11-16 Murata Mfg Co Ltd 無電解めっき浴
US5256441A (en) * 1992-08-04 1993-10-26 Amp-Akzo Corporation Ductile copper
US5306336A (en) * 1992-11-20 1994-04-26 Monsanto Company Sulfate-free electroless copper plating baths
MY144574A (en) * 1998-09-14 2011-10-14 Ibiden Co Ltd Printed circuit board and method for its production
JP3444276B2 (ja) * 2000-06-19 2003-09-08 株式会社村田製作所 無電解銅めっき浴、無電解銅めっき方法および電子部品
WO2002063069A2 (en) * 2001-01-12 2002-08-15 University Of Rochester Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features
JP4663243B2 (ja) * 2004-01-13 2011-04-06 上村工業株式会社 無電解銅めっき浴
TWI348499B (en) * 2006-07-07 2011-09-11 Rohm & Haas Elect Mat Electroless copper and redox couples
TWI347982B (en) * 2006-07-07 2011-09-01 Rohm & Haas Elect Mat Improved electroless copper compositions
EP1876262A1 (en) * 2006-07-07 2008-01-09 Rohm and Haas Electronic Materials, L.L.C. Environmentally friendly electroless copper compositions
TWI347373B (en) * 2006-07-07 2011-08-21 Rohm & Haas Elect Mat Formaldehyde free electroless copper compositions
TWI649449B (zh) * 2015-11-27 2019-02-01 德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法
WO2017109556A1 (en) 2015-12-23 2017-06-29 Uniwersytet Warszawski Means for carrying out electroless metal deposition with atomic sub-monolayer precision
PL3184667T3 (pl) * 2015-12-23 2020-05-18 Uniwersytet Warszawski Środki do prowadzenia bezprądowego osadzania metalu z precyzją submonowarstw atomowych
US20190382901A1 (en) * 2018-06-15 2019-12-19 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1143021A (en) * 1965-10-01 1969-02-19 Itek Corp Photographic metal salt transfer process
US3663242A (en) * 1970-09-25 1972-05-16 Shipley Co Stabilized electroless plating solutions

Also Published As

Publication number Publication date
JPS50119726A (pt) 1975-09-19
JPS5615496B2 (pt) 1981-04-10
GB1490914A (en) 1977-11-02
FR2262123B1 (pt) 1978-08-18
DE2505958A1 (de) 1975-08-28
DE2505958C3 (de) 1982-04-22
DE2505958B2 (de) 1981-08-06
CA1069367A (en) 1980-01-08
US4248633A (en) 1981-02-03
BE825773A (fr) 1975-08-20
FR2262123A1 (pt) 1975-09-19

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Legal Events

Date Code Title Description
BC A request for examination has been filed
BI The patent application has been withdrawn