NL7308737A - - Google Patents

Info

Publication number
NL7308737A
NL7308737A NL7308737A NL7308737A NL7308737A NL 7308737 A NL7308737 A NL 7308737A NL 7308737 A NL7308737 A NL 7308737A NL 7308737 A NL7308737 A NL 7308737A NL 7308737 A NL7308737 A NL 7308737A
Authority
NL
Netherlands
Application number
NL7308737A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7308737A publication Critical patent/NL7308737A/xx

Links

Classifications

    • H10W70/093
    • H10W70/60
    • H10W90/00
NL7308737A 1972-06-23 1973-06-22 NL7308737A (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26555072A 1972-06-23 1972-06-23

Publications (1)

Publication Number Publication Date
NL7308737A true NL7308737A (en:Method) 1973-12-27

Family

ID=23010926

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7308737A NL7308737A (en:Method) 1972-06-23 1973-06-22

Country Status (10)

Country Link
US (1) US3801477A (en:Method)
JP (1) JPS4957373A (en:Method)
BE (1) BE801196A (en:Method)
CA (1) CA982699A (en:Method)
DE (1) DE2331534A1 (en:Method)
FR (1) FR2189873B1 (en:Method)
GB (1) GB1416650A (en:Method)
IT (1) IT989353B (en:Method)
NL (1) NL7308737A (en:Method)
SE (1) SE381777B (en:Method)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3983284A (en) * 1972-06-02 1976-09-28 Thomson-Csf Flat connection for a semiconductor multilayer structure
US4022930A (en) * 1975-05-30 1977-05-10 Bell Telephone Laboratories, Incorporated Multilevel metallization for integrated circuits
US4188438A (en) * 1975-06-02 1980-02-12 National Semiconductor Corporation Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices
JP2755594B2 (ja) * 1988-03-30 1998-05-20 株式会社 東芝 セラミックス回路基板
JP4815771B2 (ja) * 2004-09-01 2011-11-16 住友電気工業株式会社 電気部品の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3495324A (en) * 1967-11-13 1970-02-17 Sperry Rand Corp Ohmic contact for planar devices
GB1250248A (en:Method) * 1969-06-12 1971-10-20

Also Published As

Publication number Publication date
SE381777B (sv) 1975-12-15
FR2189873A1 (en:Method) 1974-01-25
AU5724073A (en) 1975-01-09
BE801196A (fr) 1973-10-15
US3801477A (en) 1974-04-02
GB1416650A (en) 1975-12-03
IT989353B (it) 1975-05-20
JPS4957373A (en:Method) 1974-06-04
DE2331534A1 (de) 1974-01-17
FR2189873B1 (en:Method) 1977-09-09
CA982699A (en) 1976-01-27

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Legal Events

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