NL7308737A - - Google Patents

Info

Publication number
NL7308737A
NL7308737A NL7308737A NL7308737A NL7308737A NL 7308737 A NL7308737 A NL 7308737A NL 7308737 A NL7308737 A NL 7308737A NL 7308737 A NL7308737 A NL 7308737A NL 7308737 A NL7308737 A NL 7308737A
Authority
NL
Netherlands
Application number
NL7308737A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7308737A publication Critical patent/NL7308737A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01Manufacture or treatment
    • H10W70/05Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
NL7308737A 1972-06-23 1973-06-22 NL7308737A (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26555072A 1972-06-23 1972-06-23

Publications (1)

Publication Number Publication Date
NL7308737A true NL7308737A (2) 1973-12-27

Family

ID=23010926

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7308737A NL7308737A (2) 1972-06-23 1973-06-22

Country Status (10)

Country Link
US (1) US3801477A (2)
JP (1) JPS4957373A (2)
BE (1) BE801196A (2)
CA (1) CA982699A (2)
DE (1) DE2331534A1 (2)
FR (1) FR2189873B1 (2)
GB (1) GB1416650A (2)
IT (1) IT989353B (2)
NL (1) NL7308737A (2)
SE (1) SE381777B (2)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3983284A (en) * 1972-06-02 1976-09-28 Thomson-Csf Flat connection for a semiconductor multilayer structure
US4022930A (en) * 1975-05-30 1977-05-10 Bell Telephone Laboratories, Incorporated Multilevel metallization for integrated circuits
US4188438A (en) * 1975-06-02 1980-02-12 National Semiconductor Corporation Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices
JP2755594B2 (ja) * 1988-03-30 1998-05-20 株式会社 東芝 セラミックス回路基板
JP4815771B2 (ja) * 2004-09-01 2011-11-16 住友電気工業株式会社 電気部品の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3495324A (en) * 1967-11-13 1970-02-17 Sperry Rand Corp Ohmic contact for planar devices
GB1250248A (2) * 1969-06-12 1971-10-20

Also Published As

Publication number Publication date
DE2331534A1 (de) 1974-01-17
CA982699A (en) 1976-01-27
AU5724073A (en) 1975-01-09
BE801196A (fr) 1973-10-15
SE381777B (sv) 1975-12-15
FR2189873B1 (2) 1977-09-09
JPS4957373A (2) 1974-06-04
FR2189873A1 (2) 1974-01-25
IT989353B (it) 1975-05-20
GB1416650A (en) 1975-12-03
US3801477A (en) 1974-04-02

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Legal Events

Date Code Title Description
BV The patent application has lapsed